Methods and apparatus for additively manufactured endoskeleton-based transport structures
US-12377576-B2 · Aug 5, 2025 · US
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Lakshman Narender Shankar patents
Lakshman Narender Shankar is listed as an inventor on 52 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lakshman Narender Shankar |
| Total patents | 52 |
| First publication | Aug 16, 2018 |
| Latest publication | Aug 5, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Removal of supports, and other materials from surface, and within hollow 3D printed parts
US-12090551-B2 · Sep 17, 2024 · US
Thermal elements for disassembly of node-based adhesively bonded structures
US-12083596-B2 · Sep 10, 2024 · US
Methods and apparatus for additively manufactured endoskeleton-based transport structures
US-2024173886-A1 · May 30, 2024 · US
Methods and apparatus for additively manufactured endoskeleton-based transport structures
US-2024139994-A1 · May 2, 2024 · US
Methods and apparatus for additively manufactured endoskeleton-based transport structures
US-11897163-B2 · Feb 13, 2024 · US
Structures and methods for high volume production of complex structures using interface nodes
US-11786971-B2 · Oct 17, 2023 · US
Apparatus and methods for additive manufacturing with variable extruder profiles
US-11673316-B2 · Jun 13, 2023 · US
Composite material inlay in additively manufactured structures
US-11584094-B2 · Feb 21, 2023 · US
Removal of supports, and other materials from surface, and within hollow 3d printed parts
US-2022339707-A1 · Oct 27, 2022 · US
Recent patents
Latest publications not already listed above.
Custom formed panels for transport structures and methods for assembling same
US-11479015-B2 · Oct 25, 2022 · US
Systems and methods for co-casting of additively manufactured interface nodes
US-11420262-B2 · Aug 23, 2022 · US
Systems and methods for co-printed or concurrently assembled hinge structures
US-11408216-B2 · Aug 9, 2022 · US
Autonomous item delivery
US-2022206488-A1 · Jun 30, 2022 · US
Hybrid processing of freeform deposition material by progressive forging
US-2022193776-A1 · Jun 23, 2022 · US
Thermal elements for disassembly of node-based adhesively bonded structures
US-2022193777-A1 · Jun 23, 2022 · US
Ultrasonic additive manufacturing of box-like parts
US-2022176449-A1 · Jun 9, 2022 · US
Apparatus and methods for optimization of powder removal features in additively manufactured components
US-2022176450-A1 · Jun 9, 2022 · US
Apparatus and methods for optimization of powder removal features in additively manufactured components
US-11292058-B2 · Apr 5, 2022 · US
3D-printed tooling shells
US-11247367-B2 · Feb 15, 2022 · US
Apparatus and methods for additively manufactured structures with augmented energy absorption properties
US-2021339802-A1 · Nov 4, 2021 · US
3D-printed tooling and methods for producing same
US-11155005-B2 · Oct 26, 2021 · US
Apparatus and methods for connecting nodes to tubes in transport structures
US-11110514-B2 · Sep 7, 2021 · US
Custom formed panels for transport structures and methods for assembling same
US-2021252825-A1 · Aug 19, 2021 · US
Apparatus and methods for additively manufactured structures with augmented energy absorption properties
US-11072371-B2 · Jul 27, 2021 · US
Methods and apparatus for additively manufactured endoskeleton-based transport structures
US-2021187785-A1 · Jun 24, 2021 · US
Apparatus and methods for sealing powder holes in additively manufactured parts
US-11020800-B2 · Jun 1, 2021 · US
Powder bed fusion re-coaters with heat source for thermal management
US-2021154771-A1 · May 27, 2021 · US
Automated wrapping of components in transport structures
US-10994876-B2 · May 4, 2021 · US
Methods and apparatus for additively manufactured endoskeleton-based transport structures
US-10940609-B2 · Mar 9, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Divergent Tech Inc | 52 |
Top CPC classifications
Most common classification codes across this inventor's patents.