Hybrid lift pin

Patent metadata

Field	Value
Publication number	US-11018047-B2
Application number	US-201816205899-A
Country	US
Kind code	B2
Filing date	Nov 30, 2018
Priority date	Jan 25, 2018
Publication date	May 25, 2021
Grant date	May 25, 2021

Abstract

A lift pin and a substrate support assembly and reactor including the lift pin are disclosed. The lift pin includes first section comprising a material having a first transparency and a second section comprising a material having a second transparency. The lift pin can provide improved temperature uniformity across substrate support assembly including the lift pin during substrate processing.

First claim

What is claimed is:

1. A lift pin configured to be moveable through an aperture of a susceptor, the lift pin comprising:
a first section comprising a material having a first transparency to infrared light, wherein the first transparency ranges from 0 or about 0 to about 10% transmission of infrared light; and
a second section comprising a material having a second transparency to infrared light, wherein the second transparency ranges from about 85% to about 100% transmission of infrared light;
wherein the first section comprises a first cylindrical portion and the second section comprises a second cylindrical portion; and
wherein the first cylindrical portion has an outer diameter that is substantially the same as the second cylindrical portion at an interface where the second cylindrical portion is directly coupled in heat transferring communication with the first cylindrical portion;
wherein the first section comprises a top surface configured to engage a substrate.

2. The lift pin of claim 1 , wherein the first section is mechanically coupled to the second section via reception of a coupling element of one of the first section and the second section with a complementary recess of the other of the first section and the second section.

3. The lift pin of claim 1 , wherein the first section comprises the top surface and a first bottom surface, wherein the second section comprises a second top surface and a second bottom surface, wherein the second top surface is directly coupled to the first bottom surface.

4. The lift pin of claim 1 , wherein the first transparency ranges from 0 or about 0 to about 5% transmission of infrared light.

5. The lift pin of claim 2 , wherein the second section comprises two portions that collectively define the complementary recess that surrounds the coupling element.

6. The lift pin of claim 5 , wherein the two portions of the second section are at least one of fused and welded together around the coupling element.

7. The lift pin of claim 1 , wherein the first cylindrical portion and the second cylindrical portion are solid cylinders.

8. The lift pin of claim 1 , wherein the second transparency ranges from about 90% to less than 100% transmission of infrared light.

9. The lift pin of claim 1 , wherein the first section is about 2% to about 55% of the length of the lift pin.

10. The lift pin of claim 1 , wherein the second section is about 45% to about 98% of the length of the lift pin.

11. The lift pin of claim 1 , wherein the first section and the second section are fused together.

12. The lift pin of claim 1 , wherein the first section comprises a body and a head, wherein a cross-sectional dimension of the head is greater than a cross-sectional dimension of the body, wherein the head comprises the top surface.

13. The lift pin of claim 1 , wherein the second section is substantially cylindrical.

14. A substrate support assembly comprising:
a susceptor;
a susceptor support coupled to the susceptor;
a rotatable shaft coupled to the susceptor support;
a lift pin support member;
one or more lift pins according to claim 1 coupled to the lift pin support member;
a moveable shaft coupled to the lift pin support member;
a lift pin mechanism to cause the moveable shaft to move in a vertical direction during a substrate transfer process; and
a susceptor rotation mechanism that causes the susceptor to rotate during substrate processing.

15. The substrate support assembly of claim 14 , wherein the susceptor support comprises a plurality of susceptor support arms and one or more susceptor support structures coupled to or integrated with each of the plurality of support arms.

16. The substrate support assembly of claim 15 , wherein at least one of the plurality of susceptor support arms comprises an aperture to receive one of the one or more lift pins.

17. The substrate support assembly of any of claim 14 , wherein the susceptor comprises a center region and a peripheral region and wherein a width of the center region is greater than a width of the peripheral region.

18. The substrate support assembly of claim 14 , comprising two or more of the lift pins.

19. A reactor comprising one or more lift pins of claim 1 .

20. The reactor of claim 19 , further comprising a susceptor configured to receive the one or more lift pins.

Assignees

• Asm Ip Holding Bv

Inventors

• Rokkam Uday Kiran
• Hill Eric

Classifications

• H10P72/7626

  characterised by the construction of the shaft · CPC title

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/7612 Primary

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title

• H01L21/68785

  Electricity · mapped topic