Heat dissipation apparatus and terminal device having same

Patent metadata

Field	Value
Publication number	US-11016546-B2
Application number	US-201616473838-A
Country	US
Kind code	B2
Filing date	Dec 29, 2016
Priority date	Dec 29, 2016
Publication date	May 25, 2021
Grant date	May 25, 2021

Abstract

A heat dissipation apparatus applied to a terminal device includes a phase change material (PCM) and a heat transfer unit. The heat transfer unit is in contact with the PCM to conduct heat of the terminal device to the PCM. Because the PCM maintains a temperature substantially unchanged during a phase change, a temperature of the heat dissipation apparatus is not excessively high while heat is absorbed.

First claim

What is claimed is:

1. A terminal device, comprising:
a housing;
a processor disposed inside the housing and configured to dynamically adjust a working mode;
a phase change material disposed inside the housing and configured to absorb heat of the processor;
a temperature equalizing unit that is disposed inside the housing and is in contact with the phase change material; and
a heat transfer unit that is in contact with the processor and the phase change material and that conducts heat of the processor to the phase change material,
wherein the phase change material comprises a gap,
wherein the heat transfer unit comprises a groove, and
wherein the temperature equalizing unit is disposed inside the gap and the groove.

2. The terminal device of claim 1 , wherein a wall of the housing has a cavity, and wherein the phase change material is disposed in the cavity.

3. The terminal device of claim 1 , wherein an air layer is disposed between the phase change material and the processor.

4. The terminal device of claim 1 , wherein a phase change point of the phase change material ranges from 10 degrees Celsius (° C.) to 70° C.

5. The terminal device of claim 1 , wherein a phase change point of the phase change material ranges from 30 degrees Celsius (° C.) to 45° C.

6. The terminal device of claim 1 , wherein a heat capacity of the phase change material ranges from 100 joules to 10,000 joules.

7. The terminal device of claim 1 , wherein a mass of the phase change material ranges from 1 grams (g) to 200 g.

8. The terminal device of claim 1 , wherein the phase change material comprises a solid-solid phase change material.

9. The terminal device of claim 8 , wherein the phase change material comprises a composite phase change material, and wherein a form of the composite phase change material comprises a microcapsule.

10. The terminal device of claim 1 , wherein the phase change material comprises a solid-gas phase change material and has a housing of sufficient strength to keep a shape and a volume of the phase change material substantially unchanged during a phase change.

11. The terminal device of claim 1 , wherein the heat transfer unit is provided with the groove matching a shape of the temperature equalizing unit, and wherein the temperature equalizing unit is disposed in the groove.

12. The terminal device of claim 1 wherein the gap of phase change material matches a shape of the temperature equalizing unit, and wherein the temperature equalizing unit is disposed in the gap.

13. The terminal device of claim 1 , wherein the phase change material comprises a solid-liquid phase change material.

14. The terminal device of claim 8 , wherein the phase change material comprises a composite phase change material, and wherein a form of the composite phase change material comprises a shaped phase change material.

15. The terminal device of claim 8 , wherein the phase change material comprises a composite phase change material, and wherein a form of the composite phase change material comprises a nanocomposite phase change material.

16. The terminal device of claim 8 , wherein the phase change material comprises a composite phase change material, and wherein a form of the composite phase change material comprises a porous composite phase change material.

17. The terminal device of claim 1 , wherein the phase change material comprises a liquid-gas phase change material and has a housing of sufficient strength to keep a shape and a volume of the phase change material substantially unchanged during a phase change.

Assignees

• Huawei Tech Co Ltd

Inventors

• Li Wei
• Chen Chunyang
• Chen Baochun
• Zhang Zhiguo
• Li Quanming

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/735

  by melting or evaporation of solids · CPC title

• Y02D10/00

  Energy efficient computing, e.g. low power processors, power management or thermal management · CPC title

• G06F1/206 Primary

  comprising thermal management · CPC title

• G06F1/181

  Enclosures (for portable computers G06F1/1613) · CPC title