Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame
US-2016170299-A1 · Jun 16, 2016 · US
US11013125B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11013125-B2 |
| Application number | US-201816122404-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 5, 2018 |
| Priority date | Mar 11, 2016 |
| Publication date | May 18, 2021 |
| Grant date | May 18, 2021 |
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A method for producing a plated part, includes: forming, on a surface of a base member, a catalyst activity inhibiting layer containing a polymer which has at least one of an amide group and an amino group; irradiating with light or heating a part of the surface of the base member on which the catalyst activity inhibiting layer is formed; applying an electroless plating catalyst to the surface of the base member heated or irradiated with the light; and bringing an electroless plating solution into contact with the surface of the base member to which the electroless plating catalyst is applied, to form an electroless plating film at a light-irradiated portion or a heated portion of the surface.
Opening claim text (preview).
What is claimed is: 1. A method for producing a plated part, comprising: forming, on a surface of a base member, a catalyst activity inhibiting layer containing a branched polymer having a side chain, the side chain including a group containing sulfur and an amide group; irradiating with light or heating a part of the surface of the base member on which the catalyst activity inhibiting layer is formed; applying an electroless plating catalyst to the surface of the base member heated or irradiated with the light; and bringing an electroless plating solution into contact with the surface of the base member to which the electroless plating catalyst is applied, to form an electroless plating film at a light-irradiated portion or a heated portion of the surface. 2. The method for producing the plated part according to claim 1 , further comprising washing the surface of the base member after the part of the surface of the base member is heated or irradiated with the light and before the electroless plating solution is brought into contact with the surface of the base member. 3. The method for producing the plated part according to claim 1 , wherein the branched polymer is a dendritic polymer. 4. The method for producing the plated part according to claim 3 , wherein the branched polymer is a hyper-branched polymer. 5. The method for producing the plated part according to claim 3 , wherein the branched polymer has a number average molecular weight of 3,000 to 30,000 and has a weight average molecular weight of 10,000 to 300,000. 6. The method for producing the plated part according to claim 3 , wherein the side chain of the branched polymer contains an aromatic ring. 7. The method for producing the plated part according to claim 1 , wherein the branched polymer further has a main chain, and the main chain of the branched polymer is an aliphatic. 8. The method for producing the plated part according to claim 1 , wherein the group containing sulfur is a sulfide group or a dithiocarbamate group. 9. The method for producing the plated part according to claim 1 , wherein the branched polymer is represented by the following formula (1) or the following formula (3), in the formula (1), A 1 is a group containing an aromatic ring, A 2 is a group containing sulfur, R 1 is a single bond or a substituted or unsubstituted alkylene group having 1 to 5 carbon atoms, each of R 2 and R 3 is hydrogen or a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms, and m1 is in a range of 1 to 10, and n1 is in a range of 5 to 100. 10. The method for producing the plated part according to claim 9 , wherein the branched polymer is represented by the formula (1), in the formula (1), A 1 is a group represented by the following formula (2), A 2 is a dithiocarbamate group, R 1 is a single bond, R 2 is hydrogen, and R 3 is an isopropyl group. 11. The method for producing the plated part according to claim 1 , wherein the catalyst activity inhibiting layer is removed from the light-irradiated portion or the heated portion of the surface by heating or irradiating with the light the part of the surface of the base member. 12. The method for producing the plated part according to claim 1 , wherein the heating or irradiating with the light the part of the surface of the base member is laser drawing performed on the surface of the base member by use of a laser beam.
using masks · CPC title
with use of organic or inorganic compounds other than metals, first · CPC title
with use of metal first · CPC title
Radiation, e.g. UV, laser · CPC title
with use of organic or inorganic compounds other than metals, first · CPC title
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