Method of manufacturing light-emitting device

Patent metadata

Field	Value
Publication number	US-11011685-B2
Application number	US-202016799017-A
Country	US
Kind code	B2
Filing date	Feb 24, 2020
Priority date	May 31, 2017
Publication date	May 18, 2021
Grant date	May 18, 2021

Abstract

A method of manufacturing a light-emitting device includes steps of: preparing at least one first member each including (i) a light-transmissive member having a top surface, a bottom surface, and a lateral surface contiguous with the top surface and the bottom surface, (ii) a phosphor layer disposed below the bottom surface, and (iii) a cover layer disposed on a lateral surface of the phosphor layer and the lateral surface of the light-transmissive member; and, for each of the at least one first member, mounting a light-emitting element on a base having a fat plate shape, bonding the light-emitting element and the phosphor layer of the first member together, placing a frame body on the base so as to surround the light-emitting element, and filling a light-reflective member in the frame body so that the light-reflective member covers at least a portion of the cover layer of the first member.

First claim

What is claimed is:

1. A method of manufacturing a light-emitting device, the method comprising steps of:
preparing at least one first member each comprising (i) a light-transmissive member having a top surface, a bottom surface opposite the top surface, and a lateral surface contiguous with the top surface and the bottom surface, (ii) a phosphor layer disposed below the bottom surface of the light-transmissive member, and (iii) a cover layer disposed on and in direct contact with a lateral surface of the phosphor layer and the lateral surface of the light-transmissive member; and,
for each of the at least one first member,
providing a base having a flat plate shape,
mounting a light-emitting element on the base,
bonding the light-emitting element and the phosphor layer of the first member together,
placing a frame body on the base so as to surround the light-emitting element, and
filling a light-reflective member in the frame body so that the light-reflective member covers at least a portion of the cover layer of the first member.

2. The method of claim 1 ,
wherein in the bonding step, the light-emitting element and the phosphor layer of each of the at least one first member are bonded via a bonding member made of a material that is same as a matrix material of the phosphor layer.

3. The method of claim 1 ,
wherein in the step of filling the light-reflective member in the frame body, the light-reflective member is filled so that the light-reflective member further covers at least a portion of a lateral surface of the light emitting element.

4. The method of claim 1 ,
wherein the step of preparing the at least one first member comprises steps of:
forming a dielectric multilayer film on an initial light-transmissive layer;
forming an initial phosphor layer on the dielectric multilayer film;
dividing the initial light-transmissive layer, the dielectric multilayer film, the initial phosphor layer together into first intermediate workpieces;
placing the first intermediate workpieces on a thermal release sheet at predetermined intervals with the initial phosphor layer located at the lowermost portion of the first intermediate workpieces;
filling an initial cover layer between the first intermediate workpieces on the thermal release sheet;
dividing the initial cover layer so as to produce second intermediate workpieces each including one of the first intermediate workpieces and at least a portion of the initial cover layer and serving as one of the at least one first member, wherein the initial light-transmissive layer in the one of the first intermediate workpieces serves as the light-transmissive member of the one of the at least one first member, the initial phosphor layer in the one of the first intermediate workpieces serves as the phosphor layer of the one of the at least one first member, and the at least a portion of the initial cover layer serves as the cover layer of the one of the at least one first member; and
separating the second intermediate workpieces from the thermal release sheet as the at least one first member.

5. The method of claim 4 , wherein the step of forming the initial phosphor layer is performed by screen printing.

6. The method of claim 1 , wherein the at least one first member each have a flat plate shape as a whole.

7. A method of manufacturing a light-emitting device, the method comprising steps of:
preparing at least one second member each comprising (i) a light-transmissive member having a top surface, a bottom surface opposite the top surface, and a lateral surface contiguous with the top surface and the bottom surface, (ii) a phosphor layer disposed below the bottom surface of the light-transmissive member, (iii) a cover layer disposed on and in direct contact with a lateral surface of the phosphor layer and the lateral surface of the light-transmissive member, and (iv) a light-emitting element disposed below the phosphor layer; and,
for each of the at least one second member,
providing a base having a flat plate shape,
mounting the light-emitting element of the second member on the base,
placing a frame body on the base so as to surround the light-emitting element, and
filling a light-reflective member in the frame body so that the light-reflective member covers at least a portion of the cover layer of the second member.

8. The method of claim 7 ,
wherein in the step of filling the light-reflective member in the frame body, the light-reflective member is filled so that the light-reflective member further covers at least a portion of a lateral surface of the light emitting element.

9. The method of claim 7 ,
wherein the step of preparing the at least one second member comprises steps of:
forming a dielectric multilayer film on an initial light-transmissive layer;
forming an initial phosphor layer on the dielectric multilayer film;
dividing the initial light-transmissive layer, the dielectric multilayer film, the initial phosphor layer together into first intermediate workpieces;
placing the first intermediate workpieces on a thermal release sheet at predetermined intervals with the initial light-transmissive layer located at the lowermost portion of the first intermediate workpieces;
filling an initial cover layer between the first intermediate workpieces on the thermal release sheet;
mounting a light-emitting element on the initial phosphor layer of each of the first intermediate workpieces;
dividing the initial cover layer so as to produce second intermediate workpieces each including one of the first intermediate workpieces, the light-emitting element mounted on the one of the first intermediate workpieces, and at least a portion of the initial cover layer and serving as one of the at least one second member, wherein the initial light-transmissive layer in the one of the first intermediate workpieces serves as the light-transmissive member of the one of the at least one second member, the initial phosphor layer in the one of the first intermediate workpieces serves as the phosphor layer of the one of the at least one second member, the light-emitting element mounted on the one of the first intermediate workpieces serves as the light-emitting element of the one of the at least one second member, and the at least a portion of the initial cover layer serves as the cover layer of the one of the at least one second member; and
separating the second intermediate workpieces from the thermal release sheet as the at least one second member.

10. The method of claim 9 , wherein the step of forming the initial phosphor layer is performed by screen printing.

11. The method of claim 9 ,
wherein in the step of mounting the light-emitting element on the initial phosphor layer of each of the first intermediate workpieces, the light-emitting element and the initial phosphor layer of each of the first intermediate workpieces are bonded via a bonding member made of a material that is same as a matrix material of the initial phosphor layer.

12. The method of claim 7 , wherein the at least one second member each have a flat plate shape as a whole.

13. A method of manufacturing a light-emitting device, the method comprising steps of:
preparing at least one third member each comprising (i) a light-transmissive member having a top surface, a bottom surface opposite the top surface, and a lateral surface contiguous with the top surface and the bottom surface, (ii) a phosphor layer disposed above the top surface of the light-transmissive member, (iii) a cover layer disposed on and in direct contact with a lateral surface of the phosphor layer and the lateral surface of the light-transmissive member, and (

Assignees

• Nichia Corp

Inventors

• Yuasa Taiki
• Iwakura Daisuke

Classifications

• H10W72/30

  Die-attach connectors · CPC title

• H10W72/07351

  characterised by changes in properties of the die-attach connectors during connecting · CPC title

• H10H20/0361

  of wavelength conversion means · CPC title

• H10H20/851

  Wavelength conversion means · CPC title

• H10H20/84

  Coatings, e.g. passivation layers or antireflective coatings · CPC title