Multilayer electronic component

Patent metadata

Field	Value
Publication number	US-11011304-B2
Application number	US-202016943419-A
Country	US
Kind code	B2
Filing date	Jul 30, 2020
Priority date	Apr 26, 2017
Publication date	May 18, 2021
Grant date	May 18, 2021

Abstract

A multilayer electronic component includes: a multilayer stack including a plurality of dielectric layers and a plurality of conductor layers stacked together; a plurality of terminals integrated with the multilayer stack; and a shield formed of a conductor and integrated with the multilayer stack. The multilayer stack has a top surface, a bottom surface, and four side surfaces connecting the top surface and the bottom surface. The plurality of terminals are provided on the bottom surface of the multilayer stack. The shield entirely covers the top surface and the four side surfaces of the multilayer stack. The shield includes a portion that is thicker than the other portions of the shield.

First claim

What is claimed is:

1. A multilayer electronic component comprising:
a multilayer stack including a plurality of dielectric layers and a plurality of conductor layers stacked together;
a plurality of terminals; and
a shield formed of a conductor, wherein
the multilayer stack has a top surface and a bottom surface located at opposite ends in a first direction, and four side surfaces connecting the top surface and the bottom surface,
the plurality of terminals are provided on the bottom surface of the multilayer stack,
the shield entirely covers the top surface and the four side surfaces of the multilayer stack, and
the shield includes a portion thicker than the other portions of the shield.

2. The multilayer electronic component according to claim 1 , wherein
the shield includes a top covering portion covering the top surface of the multilayer stack, and four side covering portions covering the four side surfaces of the multilayer stack, and
the top covering portion is thicker than the four side covering portions.

3. The multilayer electronic component according to claim 1 , wherein
the multilayer stack includes a coil wound around a central axis extending in a second direction,
the shield includes five portions that respectively cover the top surface and the four side surfaces of the multilayer stack, and
of the five portions, one or two portions that intersect the central axis are thicker than the others of the five portions.

4. The multilayer electronic component according to claim 3 , wherein one of the five portions that covers the top surface of the multilayer stack intersects the central axis.

5. The multilayer electronic component according to claim 1 , wherein the first direction is a direction in which the plurality of dielectric layers are stacked.

6. The multilayer electronic component according to claim 1 , wherein the shield includes a plurality of metal layers stacked together.

7. The multilayer electronic component according to claim 6 , wherein
each of the plurality of metal layers includes a top-surface-corresponding portion covering the top surface of the multilayer stack, and four side-surface-corresponding portions respectively covering the four side surfaces of the multilayer stack, and
the top-surface-corresponding portion and the four side-surface-corresponding portions are contiguous.

8. The multilayer electronic component according to claim 6 , wherein the plurality of metal layers include a first metal layer and a second metal layer that is higher in electrical conductivity and thicker than the first metal layer.

9. The multilayer electronic component according to claim 6 , wherein the plurality of metal layers include a first metal layer formed of stainless steel and a second metal layer made of one of Ag, Cu, Au, and Al.

10. The multilayer electronic component according to claim 1 , wherein the multilayer stack includes at least one of an inductor or a capacitor.

11. The multilayer electronic component according to claim 1 , wherein the multilayer stack has a plurality of rounded corners.

12. The multilayer electronic component according to claim 11 , wherein
the plurality of rounded corners include a plurality of specific corners,
at each of the plurality of specific corners, the bottom surface intersects one or two of the four side surfaces, and
the shield at least partially covers each of the plurality of specific corners.

13. The multilayer electronic component according to claim 1 , wherein
the top surface of the multilayer stack includes a mark portion and a peripheral portion around the mark portion, and
there is a difference in level between the mark portion and the peripheral portion.

14. The multilayer electronic component according to claim 13 , wherein the mark portion protrudes from the peripheral portion.

15. The multilayer electronic component according to claim 13 , wherein the mark portion is recessed from the peripheral portion.

16. The multilayer electronic component according to claim 1 , wherein
the plurality of terminals include a ground terminal connected to a ground, and
the shield is electrically connected to the ground terminal.

17. The multilayer electronic component according to claim 16 , wherein the multilayer stack includes a connecting portion for electrically connecting the shield and the ground terminal.

18. The multilayer electronic component according to claim 1 , wherein each of the plurality of terminals has a bottom end face protruding from the bottom surface.

19. The multilayer electronic component according to claim 1 , wherein at least part of the shield is formed by sputtering.

Assignees

• Tdk Corp

Inventors

• Kusumoto Shohei
• Ootsuka Noriaki
• Abe Minoru
• Sato Yoshinori

Classifications

• H01F27/363 Primary

  made of electrically conductive material · CPC title

• H01G4/232

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/228

  Terminals · CPC title

• H01G4/40

  Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations · CPC title

• H01G4/38

  Multiple capacitors, i.e. structural combinations of fixed capacitors · CPC title