Multilayer electronic component

Patent metadata

Field	Value
Publication number	US-10796844-B2
Application number	US-201815940301-A
Country	US
Kind code	B2
Filing date	Mar 29, 2018
Priority date	Apr 26, 2017
Publication date	Oct 6, 2020
Grant date	Oct 6, 2020

Abstract

A multilayer electronic component includes: a multilayer stack including a plurality of dielectric layers and a plurality of conductor layers stacked together; a plurality of terminals integrated with the multilayer stack; and a shield formed of a conductor and integrated with the multilayer stack. The multilayer stack has a top surface, a bottom surface, and four side surfaces connecting the top surface and the bottom surface. The plurality of terminals are provided on the bottom surface of the multilayer stack. The shield entirely covers the top surface and the four side surfaces of the multilayer stack. The shield includes a portion that is thicker than the other portions of the shield.

First claim

What is claimed is:

1. A multilayer electronic component comprising:
a multilayer stack including a plurality of dielectric layers and a plurality of conductor layers stacked together;
a plurality of terminals integrated with the multilayer stack; and
a shield formed of a conductor and integrated with the multilayer stack, wherein
the multilayer stack has a top surface and a bottom surface located at opposite ends in a first direction, and four side surfaces connecting the top surface and the bottom surface,
the plurality of terminals are provided on the bottom surface of the multilayer stack,
the shield entirely covers the top surface and the four side surfaces of the multilayer stack, and
the shield includes a portion thicker than the other portions of the shield.

2. The multilayer electronic component according to claim 1 , wherein
the shield includes a top covering portion covering the top surface of the multilayer stack, and four side covering portions covering the four side surfaces of the multilayer stack, and
the top covering portion is thicker than the four side covering portions.

3. The multilayer electronic component according to claim 1 , wherein
the multilayer stack includes a coil wound around a central axis extending in a second direction,
the shield includes five portions that respectively cover the top surface and the four side surfaces of the multilayer stack, and
of the five portions, one or two portions that intersect the central axis are thicker than the others of the five portions.

4. The multilayer electronic component according to claim 3 , wherein one of the five portions that covers the top surface of the multilayer stack intersects the central axis.

5. A multilayer electronic component comprising:
a multilayer stack including a plurality of dielectric layers and a plurality of conductor layers stacked together;
a plurality of terminals integrated with the multilayer stack; and
a shield formed of a conductor and integrated with the multilayer stack, wherein
the multilayer stack has a top surface and a bottom surface located at opposite ends in a first direction, and four side surfaces connecting the top surface and the bottom surface,
the plurality of terminals are provided on the bottom surface of the multilayer stack,
the shield entirely covers the top surface and the four side surfaces of the multilayer stack,
the shield includes a plurality of metal layers stacked together,
each of the plurality of metal layers includes a top-surface-corresponding portion covering the top surface of the multilayer stack, and four side-surface-corresponding portions respectively covering the four side surfaces of the multilayer stack, and
the top-surface-corresponding portion and the four side-surface-corresponding portions are contiguous.

6. A multilayer electronic component comprising:
a multilayer stack including a plurality of dielectric layers and a plurality of conductor layers stacked together;
a plurality of terminals integrated with the multilayer stack; and
a shield formed of a conductor and integrated with the multilayer stack, wherein
the multilayer stack has a top surface and a bottom surface located at opposite ends in a first direction, and four side surfaces connecting the top surface and the bottom surface,
the plurality of terminals are provided on the bottom surface of the multilayer stack,
the shield entirely covers the top surface and the four side surfaces of the multilayer stack, and
the shield includes a top covering portion covering the top surface of the multilayer stack, four side covering portions covering the four side surfaces of the multilayer stack, and a partial covering portion contiguous to the four side covering portions and partially covering the bottom surface of the multilayer stack.

7. A multilayer electronic component comprising:
a multilayer stack including a plurality of dielectric layers and a plurality of conductor layers stacked together;
a plurality of terminals integrated with the multilayer stack; and
a shield formed of a conductor and integrated with the multilayer stack, wherein
the multilayer stack has a top surface and a bottom surface located at opposite ends in a first direction, and four side surfaces connecting the top surface and the bottom surface,
the plurality of terminals are provided on the bottom surface of the multilayer stack,
the shield entirely covers the top surface and the four side surfaces of the multilayer stack,
the top surface of the multilayer stack includes a mark portion and a peripheral portion around the mark portion,
there is a difference in level between the mark portion and the peripheral portion,
the shield includes a top covering portion covering the top surface of the multilayer stack,
the top covering portion has a top surface including a mark-corresponding portion corresponding to the mark portion, and a periphery-corresponding portion corresponding to the peripheral portion, and
there is a difference in level between the mark-corresponding portion and the periphery-corresponding portion.

8. A multilayer electronic component comprising:
a multilayer stack including a plurality of dielectric layers and a plurality of conductor layers stacked together;
a plurality of terminals integrated with the multilayer stack; and
a shield formed of a conductor and integrated with the multilayer stack, wherein
the multilayer stack has a top surface and a bottom surface located at opposite ends in a first direction, and four side surfaces connecting the top surface and the bottom surface,
the plurality of terminals are provided on the bottom surface of the multilayer stack,
the shield entirely covers the top surface and the four side surfaces of the multilayer stack,
the plurality of terminals include a plurality of signal terminals, and a ground terminal connected to a ground, and
the shield includes a bottom covering portion that partially covers the bottom surface of the multilayer stack and that is connected to the ground terminal without coming into contact with the plurality of signal terminals.

Assignees

• Tdk Corp

Inventors

• Kusumoto Shohei
• Ootsuka Noriaki
• Abe Minoru
• Sato Yoshinori

Classifications

• H01F27/363 Primary

  made of electrically conductive material · CPC title

• H01G4/228

  Terminals · CPC title

• H01G4/40

  Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations · CPC title

• H01F2017/008

  Electric or magnetic shielding of printed inductances · CPC title

• H03H1/00

  Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network (constructional details of electromechanical transducers H03H9/00) · CPC title