Composition for catalyst-free electroless plating and method for electroless plating using the same

Patent metadata

Field	Value
Publication number	US-11008657-B2
Application number	US-201816233563-A
Country	US
Kind code	B2
Filing date	Dec 27, 2018
Priority date	Feb 20, 2018
Publication date	May 18, 2021
Grant date	May 18, 2021

Abstract

This disclosure relates to a composition for catalyst-free electroless plating and a method for catalyst-free electroless plating using the same. More particularly, this disclosure relates to a composition for catalyst-free electroless plating and a method for catalyst-free electroless plating using the same that does not require a catalyst such as an expensive noble metal catalyst and may simplify the process.

First claim

What is claimed is:

1. A method for catalyst-free electroless plating using a first composition for catalyst-free electroless plating, the method comprising:
i) preparing a second composition for electroless plating, the second composition including a metal precursor and a reducing agent and not including a dispersion solution that contains a material to be plated; and
ii) introducing the second composition for electroless plating into the dispersion solution containing the material to be plated to form the first composition for catalyst-free electroless plating that includes
the metal precursor comprising a nickel precursor,
the reducing agent,
the material to be plated, and
the dispersion solution,
wherein a concentration of the metal precursor is 0.0001 to 0.0054 M in the first composition for catalyst-free electroless plating.

2. The method of claim 1 , further comprising:
controlling pH of the first composition for electroless plating to at least 6.5.

3. The method of claim 1 , wherein further comprising:
heating the first composition for catalyst-free electroless plating to 75° C. or higher.

4. The method of claim 1 , wherein the introducing is maintained for at least one minute to promote nuclear growth.

5. The method of claim 1 , wherein the introducing further comprises controlling pH of the dispersion solution containing the material to be plated to at least 6.5.

6. The method of claim 1 , wherein the nickel precursor is at least one selected from nickel acetate, nickel sulfate(NiSO 4 ), nickel chloride(NiCl 2 ), nickel carbonate(NiCO 3 ), nickel nitrate(Ni(NO 3 ) 2 ), and a hydrate thereof.

7. The method of claim 1 , wherein the metal precursor further comprises at least one selected from an iron precursor, a cobalt precursor, a copper precursor, a molybdenum precursor, a tungsten precursor, and a zinc precursor.

8. The method of claim 1 , wherein nickel of the nickel precursor in the first composition for catalyst-free electroless plating is included at an atomic ratio of 2% or more with respect to an entirety of the metal precursor.

9. The method of claim 1 , wherein the reducing agent comprises at least one selected from dimethylamine borane (DMAB), hydrazine, sodium hypophosphite, sodium borohydride, and formaldehyde.

10. The method of claim 1 , wherein the material to be plated is one selected from graphene, carbon nanotube, carbon black, carbon fiber, glass fiber, polymer fiber, and porous carbon material.

11. The method of claim 1 , further comprising:
iii) additionally introducing the second composition for electroless plating into the dispersion solution containing the material to be plated after a metal nucleation using the first composition for catalyst-free electroless plating formed in the introducing has been completed.

Assignees

• Korea Inst Mach & Materials
• Korea Institute Materials Science

Inventors

• Kim Taehoon
• Lee Sang Bok
• Jung Byung Mun
• Lee Kyunbae

Classifications

• C23C18/1639

  Substrates other than metallic, e.g. inorganic or organic or non-conductive · CPC title

• C23C18/50

  with alloys based on iron, cobalt or nickel · CPC title

• C23C18/1648

  Porous product · CPC title

• C23C18/1676

  Heating of the solution · CPC title

• C23C18/1675

  Process conditions · CPC title