Heat-conductive sheet

Patent metadata

Field	Value
Publication number	US-11008462-B2
Application number	US-201816605886-A
Country	US
Kind code	B2
Filing date	Jun 25, 2018
Priority date	Jun 27, 2017
Publication date	May 18, 2021
Grant date	May 18, 2021

Abstract

A thermally conductive sheet contains a matrix composed of an organopolysiloxane having a crosslinked structure, a thermally conductive filler dispersed in the matrix, and a silicon compound. The silicon compound is at least one selected from the group consisting of alkoxysilane compounds and alkoxysiloxane compounds.

First claim

The invention claimed is:

1. A thermally conductive sheet comprising:
a matrix composed of an organopolysiloxane having a crosslinked structure;
a thermally conductive filler comprising a graphitized carbon fiber dispersed in the matrix; and
at least one silicon compound selected from the group consisting of alkoxysilane compounds and alkoxysiloxane compounds,
wherein a proportion of a mass of the silicon compound to a total mass of the matrix and the silicon compound is 0.1% by mass or more and 50% by mass or less, and
wherein the silicon compound comprises a compound in which a proportion of decrease in mass is in the range of 5% or more and 60% or less at a point in time when 60 min has passed from a heating start in a thermogravimetric analysis under a condition where temperature is elevated to 100° C. from a heating start temperature of 25° C. at a heating up rate of 10° C./min and then kept constant at 100° C.

2. The thermally conductive sheet according to claim 1 , wherein the silicon compound comprises the alkoxysilane compound, and
a proportion of the mass of the alkoxysilane compound to a total mass of the matrix and the alkoxysilane compound is 0.1% by mass or more and 10% by mass or less.

3. The thermally conductive sheet according to claim 1 , wherein the silicon compound comprises the alkoxysiloxane compound, and
a proportion of a mass of the alkoxysiloxane compound to a total mass of the matrix and the alkoxysiloxane compound is 5% by mass or more and 50% by mass or less.

4. The thermally conductive sheet according to claim 1 , wherein the silicon compound further comprises a compound in which a proportion of decrease in mass is less than 5% at a point in time when 60 min has passed from a heating start in a thermogravimetric analysis under a condition where temperature is elevated to 100° C. from a heating start temperature of 25° C. at a heating-up rate of 10° C./min and then kept constant at 100° C.

5. The thermally conductive sheet according to claim 1 , wherein the silicon compound comprises a compound having an alkyl group bonded to a silicon atom.

Assignees

• Sekisui Polymatech Co Ltd

Inventors

• Kudoh Hiroki

Classifications

• H10W40/10

  Arrangements for heating · CPC title

• H10W40/251 Primary

  Organics · CPC title

• C08K5/5419

  containing at least one Si—C bond · CPC title

• C08K3/22

  of metals · CPC title

• C08K3/04

  Carbon · CPC title