Thermally conductive sheet, production method for thermally conductive sheet, heat dissipation member, and semiconductor device

Patent metadata

Field	Value
Publication number	US-10526519-B2
Application number	US-201716072334-A
Country	US
Kind code	B2
Filing date	Jan 13, 2017
Priority date	Jan 26, 2016
Publication date	Jan 7, 2020
Grant date	Jan 7, 2020

Abstract

A thermal conducting sheet including: a binder resin; carbon fibers; and a thermal conducting filler other than the carbon fibers, wherein a mass ratio (carbon fibers/binder resin) of the carbon fibers to the binder resin is less than 1.30, wherein an amount of the thermal conducting filler is from 48% by volume through 70% by volume, and wherein the carbon fibers are oriented in a thickness direction of the thermal conducting sheet.

First claim

The invention claimed is:

1. A thermal conducting sheet, comprising:
a binder resin;
carbon fibers having conductivity; and
a thermal conducting filler other than the carbon fibers,
wherein the binder resin is a silicone resin,
wherein the thermal conducting filler includes at least one selected from the group consisting of aluminum oxide, aluminum nitride, and zinc oxide
wherein a mass ratio (carbon fibers/binder resin) of the carbon fibers to the binder resin is 0.60 or more but less than 1.30,
wherein an amount of the thermal conducting filler is from 48% by volume through 70% by volume, and
wherein the carbon fibers are oriented in a thickness direction of the thermal conducting sheet.

2. The thermal conducting sheet according to claim 1 ,
wherein compressibility of the thermal conducting sheet at a load of 0.5 kgf/cm 2 is 3% or more.

3. A method for producing the thermal conducting sheet according to claim 1 , the method comprising:
obtaining a molded body of a thermal conducting resin composition containing the binder resin, the carbon fibers, and the thermal conducting filler by molding the thermal conducting resin composition into a predetermined shape and curing the thermal conducting resin composition; and
obtaining a molded body sheet by cutting the molded body so as to have a sheet shape.

4. The method for producing the thermal conducting sheet according to claim 3 ,
wherein the obtaining the molded body is obtaining the molded body including the carbon fibers oriented along an extrusion direction by extruding the thermal conducting resin composition into a hollow die using an extruder to mold the thermal conducting resin composition into a predetermined shape and further curing the thermal conducting resin composition, and
wherein the obtaining the molded body sheet is obtaining the molded body sheet having a sheet shape by cutting the molded body in a perpendicular direction to the extrusion direction.

5. A heat dissipation member, comprising:
a heat spreader configured to dissipate heat generated by an electronic part; and
the thermal conducting sheet according to claim 1 provided on the heat spreader and interposed between the heat spreader and the electronic part.

6. A semiconductor device, comprising:
an electronic part;
a heat spreader configured to dissipate heat generated by the electronic part; and
the thermal conducting sheet according to claim 1 provided on the heat spreader and interposed between the heat spreader and the electronic part.

7. The semiconductor device according to claim 6 , further comprising:
a heat sink,
wherein a thermal conducting sheet is interposed between the heat spreader and the heat sink,
wherein the thermal conducting sheet comprises a binder resin, carbon fibers, and a thermal conducting filler other than the carbon fibers,
wherein a mass ratio (carbon fibers/binder resin) of the carbon fibers to the binder resin is 0.60 or more but less than 1.30,
wherein an amount of the thermal conducting filler is from 48% by volume through 70% by volume, and
wherein the carbon fibers are oriented in a thickness direction of the thermal conducting sheet.

8. The thermal conducting sheet according to claim 1 , wherein a volume resistivity of the thermal conducting sheet under application of voltage of 1,000 V is 1.0×10 8 Ω·cm or more.

Assignees

• Dexerials Corp

Inventors

• Kanaya Hiroki
• Nomura Yu
• Uchida Shunsuke
• Uchida Shinichi
• Aramaki Keisuke

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W76/17

  characterised by their materials · CPC title

• H10W72/01365

  Thermally treating (reflowing H10W72/01357) · CPC title

• H10W72/01351

  Changing the shapes of die-attach connectors · CPC title