Method for manufacturing surge absorbing device

Patent metadata

Field	Value
Publication number	US-11005235-B2
Application number	US-201615755417-A
Country	US
Kind code	B2
Filing date	Aug 10, 2016
Priority date	Aug 27, 2015
Publication date	May 11, 2021
Grant date	May 11, 2021

Abstract

A method for manufacturing a surge absorbing device is provided. The method includes providing an elongate ceramic tube having a hollow space defined therein and having open and opposite first and second end; forming a first plating layer and a second plating layer on the first end and the second end, respectively; placing a surge absorbing element within the hollow space within the ceramic tube; disposing first and second brazing rings on the first plating layer and the second plating layer, respectively; disposing first and second sealing electrodes on the first and second brazing rings respectively; and melting the first and second brazing rings in an inert gas atmosphere to attach the first and second sealing electrodes onto the first plating layer and the second plating layer, respectively.

First claim

What is claimed is:

1. A method for manufacturing a surge absorbing device, the method comprising:
forming a first plating layer and a second plating layer on a first end and a second end of a ceramic tube having a hollow space defined in the ceramic tube and exposed through the first and second ends, respectively;
placing a surge absorbing element within the hollow space of the ceramic tube;
disposing first and second brazing rings on the first plating layer and the second plating layer, respectively;
disposing first and second sealing electrodes on the first and second brazing rings respectively; and
melting the first and second brazing rings in an inert gas atmosphere to attach the first and second sealing electrodes onto the first plating layer and the second plating layer, respectively,
wherein the forming of the first plating layer and the second plating layer on the first end and the second end respectively, comprises:
etching the first end and the second end of the ceramic tube;
forming first and second electroless plating catalyst layers on the etched first end and the etched second end respectively;
forming first and second metal layers on the first end and the second end of the ceramic tube respectively using an electroless plating process;
heat-treating the first and second metal layers,
wherein the first and second metal layers respectively comprise a first nickel layer and a second nickel layer formed by the electroless plating process using a nickel plating solution comprising a nickel precursor and a reducing agent,
wherein the nickel precursor comprises at least one selected from the group of consisting of nickel sulfate hydrate (NiSO 4 .6H 2 O) and nickel chloride hydrate (NiCl 2 .6H 2 O), and
wherein the reducing agent comprises at least one selected from the group of consisting of sodium hypophosphite (NaH 2 PO 2 ), sodium borohydride (NaBH 4 ), dimethylamine borane ((CH 2 ) 2 NHBH 3 ), and hydrazine (N 2 H 4 ).

2. The method of claim 1 , wherein the nickel plating solution comprises a solution prepared by mixing, with respect to 1 liter of distilled water, about 15 to 25 grams of nickel chloride hydrate (NiCl 2 .6H 2 O), about 15 to 25 grams of sodium hypophosphite hydrate (NaH 2 PO 3 .H 2 O), about 5 to 15 grams of sodium citrate tribasic dihydrate, and about 30 to 40 g of ammonium chloride (NH 4 Cl) to form a mixed solution and by adjusting the mixed solution to have a pH of about 8 to 9 with about 15 to 25 wt. % of aqueous solution of sodium hydroxide (NaOH).

3. The method of claim 1 , wherein heat-treating the first and second metal layers is carried out at about 350 to 450° C. for about 1 to 3 hours.

Assignees

• Univ Ajou Ind Academic Coop Found
• Smart Electronics Inc

Inventors

• Kim Chang-Koo
• Lee Hae-Min
• Kang Doo Won
• Kim Hyun Chang

Classifications

• C23C18/1692

  Heat-treatment · CPC title

• C23C18/50

  with alloys based on iron, cobalt or nickel · CPC title

• H01T4/02

  Details · CPC title

• H01T21/00

  Apparatus or processes specially adapted for the manufacture or maintenance of spark gaps or sparking plugs · CPC title

• C23C18/1893

  with use of organic or inorganic compounds other than metals, first · CPC title