Component semiconductor structure

Patent metadata

Field	Value
Publication number	US-11005033-B2
Application number	US-202016742365-A
Country	US
Kind code	B2
Filing date	Jan 14, 2020
Priority date	Jan 14, 2019
Publication date	May 11, 2021
Grant date	May 11, 2021

Abstract

A component semiconductor structure having a semiconductor layer, which has a front side and a back side, at least one integrated circuit being formed on the front side and a first oxide layer being formed on the back side, a monolithically formed semiconductor body having a top surface and a back surface being provided, and a second oxide layer being formed on the back surface, and the two oxide layers being integrally connected to each other, and a sensor region formed between the top surface and the back surface and having a three-dimensional isotropic Hall sensor structure being disposed in the semiconductor body, the Hall sensor structure extending from a buried lower surface up to the top surface, and at least three first highly doped semiconductor contact regions being formed on the top surface and at least three second highly doped semiconductor contact regions being formed on the lower surface.

First claim

What is claimed is:

1. A component semiconductor structure comprising:
a semiconductor layer having a front side and a back side;
at least one integrated circuit formed on the front side;
a first oxide layer being formed on back side;
a monolithically formed semiconductor body having a top surface and a back surface;
a second oxide layer formed on the back surface, the first and second oxide layers being integrally connected to each other via a thermal compression joining method;
a shared insulating layer being formed between the semiconductor body and the semiconductor layer;
a sensor region formed between the top surface and the back surface and having a three-dimensional isotropic Hall sensor structure being disposed in the semiconductor body, the Hall sensor structure extending from a buried lower surface up to an upper side;
a circumferential trench structure delimiting the sensor region of the semiconductor body;
at least three first highly doped semiconductor contact regions spaced a distance apart, and formed on the top surface; and
at least three second highly doped semiconductor contact regions spaced a distance apart and having a second conductivity type and formed on lower surface,
wherein the highly doped first semiconductor contact region is connected with the aid of an assigned first terminal contact and the highly doped second semiconductor contact region is connected with the aid of an assigned second terminal contact,
wherein the first semiconductor contact regions are disposed offset from the second semiconductor contact regions in a projection perpendicular to the top surface, and
wherein the first semiconductor contact regions and the second semiconductor contact regions each have a multiple rotational symmetry with respect to an axis of symmetry viewed perpendicularly on the top surface and on the lower surface of the semiconductor body.

2. The component semiconductor structure according to claim 1 , wherein the semiconductor body has a thickness between 2 μm and 50 μm in the sensor region.

3. The component semiconductor structure according to claim 1 , wherein a ratio between the thickness and length of the semiconductor body in the sensor region is in a range between 0.6 and 1.4 or in a range between 0.8 and 1.2.

4. The component semiconductor structure according to claim 1 , wherein the second terminal contacts comprise a highly doped polysilicon of a second conductivity type or a metal.

5. The component semiconductor structure according to claim 1 , wherein the integrated circuit is in an electrical operative connection with the Hall sensor structure.

6. The component semiconductor structure according to claim 1 , wherein the semiconductor layer has regions of a first conductivity type, and the semiconductor body has regions predominantly of a second conductivity type.

7. The component semiconductor structure according to claim 6 , wherein the first conductivity type is p and the second conductivity type is n or vice versa.

8. The component semiconductor structure according to claim 1 , wherein the semiconductor body and the semiconductor layer have a substantially identical lateral extension.

9. The component semiconductor structure according to claim 1 , wherein a continuous oxide layer is formed in the semiconductor layer between the front side and the back side.

Assignees

• Tdk Micronas Gmbh

Inventors

• Cornils Martin
• Vecchi Maria-Cristina

Classifications

• H10W72/90

  Bond pads, in general · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10N59/00

  Integrated devices, or assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups H10N50/00 - H10N52/00 (MRAM devices H10B61/00) · CPC title

• G01R33/075

  Hall devices configured for spinning current measurements · CPC title

• G01R33/072

  Constructional adaptation of the sensor to specific applications · CPC title