Semiconductor devices and methods of manufacturing semiconductor devices

Patent metadata

Field	Value
Publication number	US-11004801-B2
Application number	US-201916553986-A
Country	US
Kind code	B2
Filing date	Aug 28, 2019
Priority date	Aug 28, 2019
Publication date	May 11, 2021
Grant date	May 11, 2021

Abstract

In one example, a semiconductor device comprises a substrate, a first electronic component on a top side of the substrate, a second electronic component on the top side of the substrate, an encapsulant on the top side of the substrate, contacting a lateral side of the first electronic component and a lateral side of the second electronic component, a conformal shield on a top side of the encapsulant over the first electronic component and having a side shield contacting a lateral side of the encapsulant, and a compartment wall between the first electronic component and the second electronic component and contacting the conformal shield to define a compartment containing the first electronic component and excluding the second electronic component. Other examples and related methods are also disclosed herein.

First claim

The invention claimed is:

1. A semiconductor device, comprising:
a substrate;
a first electronic component on a top side of the substrate;
a second electronic component on the top side of the substrate;
an encapsulant on the top side of the substrate, contacting a lateral side of the first electronic component and a lateral side of the second electronic component;
a conformal shield on a top side of the encapsulant over the first electronic component and having a side shield contacting a lateral side of the encapsulant; and
a compartment wall between the first electronic component and the second electronic component and contacting the conformal shield to define a compartment containing the first electronic component and excluding the second electronic component.

2. The semiconductor device of claim 1 , wherein the substrate comprises a ground plane conductor below the compartment and contacting the side shield of the conformal shield.

3. The semiconductor device of claim 1 , wherein the substrate comprises a ground plane conductor below the compartment and electrically connected with the compartment wall through a conductive via.

4. The semiconductor device of claim 1 , wherein the substrate comprises an external interconnect electrically connected with the side shield of the conformal shield.

5. The semiconductor device of claim 1 , wherein the side shield of the conformal shield covers a lateral side of the substrate.

6. The semiconductor device of claim 1 , wherein the substrate comprises a ground plane that is electrically connected with the conformal shield and that covers a majority of the compartment under the first electronic component.

7. The semiconductor device of claim 1 , wherein the substrate comprises a pre-formed substrate.

8. The semiconductor device of claim 1 , wherein the substrate comprises a redistribution layer (RDL) substrate.

9. The semiconductor device of claim 1 , wherein the compartment wall comprises a contiguous conductive material.

10. The semiconductor device of claim 1 , wherein the compartment wall comprises a conductive wire.

11. A semiconductor device, comprising:
a substrate;
a first electronic component on a top side of the substrate;
a second electronic component on the top side of the substrate;
an encapsulant on the top side of the substrate contacting a lateral side of the first electronic component;
a conformal shield on a top side of the encapsulant over the first electronic component and comprising:
a first side shield between the first electronic component and the second electronic component and contacting a first lateral side of the encapsulant, and
a second side shield contacting a second lateral side of the encapsulant;
wherein the conformal shield defines a compartment containing the first electronic component and excluding the second electronic component.

12. The semiconductor device of claim 11 , wherein the substrate comprises a ground plane conductor below the compartment and electrically coupled with the first side shield and the second side shield.

13. The semiconductor device of claim 11 , wherein the second side shield covers a lateral side of the substrate.

14. The semiconductor device of claim 11 , wherein the substrate comprises a ground plane conductor below a majority of an area of the compartment.

15. A semiconductor device, comprising:
a first electronic component on a top side of a substrate;
a second electronic component on the top side of the substrate;
an encapsulant on the top side of the substrate, contacting a lateral side of the second electronic component;
a conformal shield over the second electronic component;
wherein a first compartment is defined external to the conformal shield and containing the first electronic component, and a second compartment is defined internal to the conformal shield and containing the second electronic component;
wherein the first electronic component is unshielded by the conformal shield and the second electronic component is shielded by the conformal shield.

16. The semiconductor device of claim 15 , further comprising:
a trench in the encapsulant between the first electron component and the second electronic component, and
a compartment wall in the trench.

17. The semiconductor device of claim 16 , wherein the conformal shield conforms to a contour of the compartment wall exposed by the trench.

18. The semiconductor device of claim 16 , wherein the compartment wall comprises a conductive wire.

19. The semiconductor device of claim 16 , wherein the encapsulant contacts a lateral side of the first electronic component.

20. The semiconductor device of claim 16 , wherein the first compartment is free of the encapsulant.

Assignees

• Amkor Tech Singapore Holding Pte Ltd

Inventors

• Oh Ji Hoon
• Bang Dong Hyun
• Shin Soo Jin
• Kwon Young Ik
• Hwang Tae Kyeong
• Lee Min Jae

Classifications

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W74/016

  using moulds · CPC title

• H10W72/90

  Bond pads, in general · CPC title

• H10W72/50

  Bond wires · CPC title