Antenna-in-package structures with broadside and end-fire radiations

Patent metadata

Field	Value
Publication number	US-9819098-B2
Application number	US-201314023995-A
Country	US
Kind code	B2
Filing date	Sep 11, 2013
Priority date	Sep 11, 2013
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.

First claim

We claim:

1. A package structure, comprising:
an antenna package comprising a first antenna, a first antenna feed line, a ground plane, a second antenna, and a second antenna feed line; and
an RFIC (radio frequency integrated circuit) chip mounted to the antenna package;
wherein the first antenna is connected to the RFIC chip by the first antenna feed line and the second antenna is connected to the RFIC chip by the second antenna feed line;
wherein the first antenna is configured to provide broadside radiation in a direction perpendicular to the antenna package, and the second antenna is configured to provide end-fire radiation in a direction parallel to the antenna package;
wherein the first antenna is disposed on a first surface of the antenna package;
wherein the second antenna is disposed on second surface of the antenna package;
wherein the first and second surfaces are different surfaces disposed on opposing sides of the antenna package;
wherein the RFIC chip is mounted to the second surface of the antenna package;
wherein the ground plane is disposed within the antenna package between the first and second surfaces of the antenna package;
wherein the first antenna feed line extends from the second surface of the antenna package through at least a portion of the antenna package to feed the first antenna disposed on the first surface of the antenna package; and
wherein the second antenna feed line extends along the second surface of the antenna package to feed the second antenna disposed on the second surface of the antenna package.

2. The package structure of claim 1 , wherein the first antenna comprises a planar patch antenna.

3. The package structure of claim 1 , wherein the first antenna feed line extends through the antenna package from the first surface to the second surface of the antenna package and is physically connected to the first antenna disposed on the first surface of the antenna package.

4. The package structure of claim 1 , wherein the first antenna comprises a first radiating element to receive broadside radiation and a second radiating element to transmit broadside radiation.

5. The package structure of claim 1 , wherein the second antenna comprises a first radiating element to receive end-fire radiation and a second radiating element to transmit end-fire radiation.

6. The package structure of claim 1 , wherein at least one of the first antenna and the second antenna comprises a phased array antenna.

7. An antenna package, comprising:
a first substrate comprising a first surface and a second surface;
a second substrate comprising a first surface and a second surface, wherein the first surface of the second substrate is directly bonded to the second surface of the first substrate by an adhesive material layer; and
an antenna ground plane disposed between the first and second substrates, wherein the antenna ground plane is formed on one of the first surface of the second substrate and the second surface of the first substrate;
wherein the first substrate comprises a first antenna formed on the first surface of the first substrate;
wherein the second substrate comprises a second antenna formed on the second surface of the second substrate;
wherein the first antenna is configured to provide broadside radiation in a direction perpendicular to the antenna package;
wherein the second antenna is configured to provide end-fife radiation in a direction parallel to the antenna package;
a first antenna feed line that extends from the second surface of the second substrate through at least the second substrate to feed the first antenna formed on the first surface of the first substrate; and
a second antenna feed line that extends along the second surface of the second substrate to feed the second antenna disposed on the second surface of the second substrate.

8. The antenna package of claim 7 , wherein the first and second substrates are printed circuit boards.

9. The antenna package of claim 7 , wherein first antenna comprises a planar patch radiating element.

10. The antenna package of claim 7 , wherein the first antenna comprises a cavity filled antenna.

11. The antenna package of claim 7 , wherein second antenna comprises a planar Yagi antenna.

12. The antenna package of claim 7 , wherein the antenna ground plane is formed on the first surface of the second substrate, and wherein the second antenna comprises a tapered slot antenna patterned in the antenna ground plane.

13. The antenna package of claim 7 , wherein the second antenna comprises a planar dipole antenna.

14. The antenna package of claim 7 , wherein the second antenna comprises a planar Vivaldi antenna.

15. The antenna package of claim 7 , wherein the first antenna comprises a first radiating element to receive broadside radiation and a second radiating element to transmit broadside radiation, and wherein the second antenna comprises a first radiating element to receive end-fire radiation and a second radiating element to transmit end-fire radiation.

16. The antenna package of claim 7 , wherein at least one of the first antenna and the second antenna comprises a phased array antenna.

17. A wireless communications device, comprising
an antenna package comprising a first antenna, a first antenna feed line, a ground plane, a second antenna, and a second antenna feed line;
an RFIC (radio frequency integrated circuit) chip mounted to the antenna package;
wherein the first antenna is connected to the RFIC chip by the first antenna feed line and the second antenna is connected to the RFIC chip by the second antenna feed line;
wherein the first antenna is configured to provide broadside radiation in a direction perpendicular to the antenna package, and the second antenna is configured to provide end-fire radiation in a direction parallel to the antenna package;
wherein the first antenna is disposed on a first surface of the antenna package;
wherein the second antenna is disposed on second surface of the antenna package;
wherein the first and second surfaces are different surfaces disposed on opposing sides of the antenna package;
wherein the RFIC chip is mounted to the second surface of the antenna package;
wherein the ground plane is disposed within the antenna package between the first and second surfaces of the antenna package;
wherein the first antenna feed line extends from the second surface of the antenna package through at least a portion of the antenna package to feed the first antenna disposed on the first surface of the antenna package; and
wherein the second antenna feed line extends along the second surface of the antenna package to feed the second antenna disposed on the second surface of the antenna package; and
an application board, wherein at least a portion of the second surface of the antenna package is mounted to the application board such that a portion of the antenna package having the second antenna is disposed at a distance past an edge of the application board.

18. The wireless communications device of claim 17 , wherein the first antenna comprises a planar patch antenna.

19. The wireless communications device of claim 17 , wherein the first antenna comprises a first radiating element to receive broadside radiation and a second radiating element to transmit broadside radiation.

20. The wireless communications device of claim 17 , wherein the second antenna comprises a first radiating element to receive end-fire radiation and a second radiating element to transmit end-fire radiation.

Assignees

• IBM

Inventors

• Gu Xiaoxiong
• Garcia Alberto V
• Liu Duixian
• Reynolds Scott K

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W44/248

  for antennas · CPC title

• H01Q9/0407

  Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole H01Q9/285; monopole H01Q9/40) · CPC title

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H01Q19/30

  the primary active element being centre-fed and substantially straight, e.g. Yagi antenna · CPC title