Method of producing anisotropic conductive film and anisotropic conductive film
US-2019224889-A1 · Jul 25, 2019 · US
Method for manufacturing anisotropic conductive film, and anisotropic conductive film
US11004574B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11004574-B2 |
| Application number | US-201716087526-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 25, 2017 |
| Priority date | May 2, 2016 |
| Publication date | May 11, 2021 |
| Grant date | May 11, 2021 |
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Abstract
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An anisotropic conductive film manufacturing method capable of reducing manufacturing costs. Also, an anisotropic conductive film capable of suppressing the occurrence of conduction defects. The anisotropic conductive film manufacturing method includes: a holding step of supplying conductive particles having a plurality of particle diameters on a member having a plurality of opening parts, and holding the conductive particles in the opening parts; and a transfer step of transferring the conductive particles held in the opening parts to an adhesive film. In the particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the conductive particles held in the opening parts, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter.
First claim
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The invention claimed is: 1. A method for manufacturing an anisotropic conductive film, the method comprising: a holding step of supplying conductive particles having a plurality of particle diameters onto a member having a plurality of opening parts, and holding the conductive particles in the opening parts; and a transfer step of transferring the conductive particles held in the opening parts to an adhesive film, wherein in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the conductive particles held in the opening parts, the shape of the graph is such that the slope is substantially infinite in a range at or above a maximum peak particle diameter, and in a particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the conductive particles included in the adhesive film, the shape of the graph is such that a difference in a cumulative distribution between a particle diameter D 10 of a quantity accumulation of 10% from a small side of a particle diameter and a particle diameter D 90 of a quantity accumulation of 90% thereof is greater than 25% of an average particle diameter. 2. The method for manufacturing an anisotropic conductive film according to claim 1 , wherein in the particle diameter distribution graph (X-axis: particle diameter (μm), Y-axis: number of particles) of the conductive particles held in the opening parts, a particle diameter at which the slope becomes substantially infinite in a range at or below the maximum peak particle diameter is present. 3. The method for manufacturing an anisotropic conductive film according to claim 1 , wherein a surface of the plurality of conductive particles that are supplied in the holding step is covered by an insulator. 4. The method for manufacturing an anisotropic conductive film according to claim 2 , wherein a surface of the plurality of conductive particles held in the opening parts is covered by an insulator. 5. The method for manufacturing an anisotropic conductive film according to claim 2 , wherein a ratio of an opening diameter of the opening parts to an average particle diameter of the conductive particles is 1.3 to 1.8. 6. The method for manufacturing an anisotropic conductive film according to claim 1 , wherein the conductive particles held in the opening parts are such that 90% or more of the total particle count is in a range of ±30% of the average particle diameter.
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Classifications
of die-attach connectors · CPC title
hardening the adhesive by curing, e.g. thermosetting · CPC title
of anisotropic conductive adhesives · CPC title
Compression bonding, e.g. thermocompression bonding · CPC title
not comprising solid metals or solid metalloids, e.g. ceramics · CPC title
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- What does patent US11004574B2 cover?
- An anisotropic conductive film manufacturing method capable of reducing manufacturing costs. Also, an anisotropic conductive film capable of suppressing the occurrence of conduction defects. The anisotropic conductive film manufacturing method includes: a holding step of supplying conductive particles having a plurality of particle diameters on a member having a plurality of opening parts, and …
- Who is the assignee on this patent?
- Dexerials Corp
- What technology area does this patent fall under?
- Primary CPC classification H01B13/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue May 11 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).