Integrated power delivery board for delivering power to an ASIC with bypass of signal vias in a printed circuit board

Patent metadata

Field	Value
Publication number	US-10999930-B2
Application number	US-201816222913-A
Country	US
Kind code	B2
Filing date	Dec 17, 2018
Priority date	Dec 17, 2018
Publication date	May 4, 2021
Grant date	May 4, 2021

Abstract

In one embodiment, an apparatus generally comprises a power delivery board for integration with a printed circuit board, the power delivery board comprising a power plane for delivering power from a voltage regulator module to an application specific integrated circuit (ASIC) mounted on a first side of the printed circuit board. The power plane in the power delivery board interconnects with power vias in the power delivery board for vertical alignment with the ASIC through power vias in the printed circuit board to electrically couple the voltage regulator module and the ASIC when the power delivery board is mounted on a second side of the printed circuit board.

First claim

What is claimed is:

1. An apparatus comprising:
a power delivery board for integration with a printed circuit board, the power delivery board comprising a power plane for delivering power from at least two voltage regulator modules to an application specific integrated circuit (ASIC) mounted on a first side of the printed circuit board;
wherein the power plane in the power delivery board interconnects with power vias in the power delivery board for vertical alignment with the ASIC through power vias in the printed circuit board to electrically couple the voltage regulator modules and the ASIC when the power delivery board is mounted on a second side of the printed circuit board; and
wherein the power delivery board comprises at least two pairs of additional power vias interconnected with the power plane, each of said pairs of additional power vias positioned for direct vertical alignment with one of the voltage regulator modules.

2. The apparatus of claim 1 wherein the voltage regulator modules are mounted on said first side of the printed circuit board with the ASIC.

3. The apparatus of claim 1 wherein the printed circuit board further comprises signal vias surrounding a portion of the power vias in the printed circuit board.

4. The apparatus of claim 1 wherein the power delivery board further comprises a ground plane interconnected with a plurality of ground vias for alignment with ground vias in the printed circuit board.

5. The apparatus of claim 1 wherein the power vias in the power delivery board comprise a central group of power vias vertically aligned with a core of the ASIC.

6. The apparatus of claim 1 wherein the power delivery board is attached to the printed circuit board with a ball grid array.

7. The apparatus of claim 1 wherein the power delivery board is attached to the printed circuit board with a land grid array.

8. The apparatus of claim 1 wherein the voltage regulator modules are positioned on opposite sides of the ASIC.

9. The apparatus of claim 1 wherein power received from each of the voltage regulator modules is delivered on the power plane shared by the voltage regulator modules.

10. The apparatus of claim 1 wherein the power delivery board comprises a plurality of power planes interleaved with a plurality of ground planes.

11. The apparatus of claim 1 wherein the power vias are interleaved with ground vias.

12. An apparatus comprising:
a printed circuit board comprising a first side, a second side, and a plurality of power vias extending from said first side to said second side, said first side configured for receiving an application specific integrated circuit (ASIC); and
a power delivery board mounted on said second side of the printed circuit board and comprising a power plane interconnected with power vias in the power delivery board for vertical alignment with the ASIC through said plurality of power vias in the printed circuit board to electrically couple a voltage regulator module and the ASIC;
wherein the voltage regulator module is vertically aligned with the power vias in the power delivery board to eliminate power planes in the printed circuit board for distribution of power from the voltage regulator module to the ASIC.

13. The apparatus of claim 12 wherein the power plane in the power delivery board comprises a plurality of power planes for electrically coupling the voltage regulator module with the ASIC.

14. The apparatus of claim 12 wherein the printed circuit board further comprises signal vias surrounding a portion of said plurality of power vias in the printed circuit board.

15. The apparatus of claim 12 wherein the power delivery board further comprises a plurality of ground planes and ground vias aligned with ground vias in the printed circuit board.

16. The apparatus of claim 12 wherein the power vias in the power delivery board comprise a central group of power vias vertically aligned with a core of the ASIC.

17. The apparatus of claim 12 further comprising a second power delivery board mounted on said second side of the printed circuit board and positioned for vertical alignment with a second ASIC.

18. An apparatus comprising:
a printed circuit board comprising a first side, a second side, and a plurality of power vias extending from said first side to said second side;
voltage regulator modules mounted on the printed circuit board;
application specific integrated circuits (ASICs) mounted on said first side of the printed circuit board; and
power delivery boards mounted on said second side of the printed circuit board at locations vertically aligned with the ASICs to eliminate power planes in the printed circuit board for distribution of power to the ASICs, each of the power delivery boards comprising a power plane for delivering power from two of the voltage regulator modules to one of the ASICs to electrically couple the voltage regulator modules and said one of the ASICs.

19. The apparatus of claim 18 wherein the power planes interconnect with a plurality of power vias in the power delivery boards, said plurality of power vias in the power delivery boards vertically aligned with the power vias in the printed circuit board for delivery of power from the voltage regulator modules to the ASICs.

20. The apparatus of claim 18 wherein the voltage regulator modules are mounted on said first side of the printed circuit board and the power delivery boards electrically couple the voltage regulator modules to the ASICs.

21. The apparatus of claim 18 wherein the printed circuit board further comprises signal vias surrounding a portion of said plurality of power vias in the printed circuit board.

22. The apparatus of claim 18 wherein each of the power delivery boards further comprises a plurality of ground planes.

23. The apparatus of claim 18 wherein each of the power delivery boards is attached to the printed circuit board with a ball grid array or a land grid array.

24. An apparatus comprising:
a power delivery board for integration with a printed circuit board, the power delivery board comprising a plurality of power planes for delivering power from voltage regulator modules to an electronic component mounted on a first side of the printed circuit board;
wherein each of the power planes in the power delivery board interconnect with power vias in the power delivery board for vertical alignment with the electronic component and each of the voltage regulator modules through power vias in the printed circuit board to electrically couple the voltage regulator modules and the electronic component when the power delivery board is mounted on a second side of the printed circuit board.

25. The apparatus of claim 24 wherein the power planes in the power delivery board interleave with ground planes in the power delivery board.

Assignees

• Cisco Tech Inc

Inventors

• Punjabi Shobhana
• Seto Kan
• Argyrakis Straty
• Goergen Joel Richard
• Mantiply Paul Lachlan
• O'Brien Richard Anthony

Classifications

• H05K2201/09309

  Core having two or more power planes; Capacitive laminate of two power planes · CPC title

• H05K1/141 Primary

  One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K1/142 and H05K1/147 take precedence) · CPC title

• H05K2201/09327

  Special sequence of power, ground and signal layers in multilayer PCB · CPC title

• H05K1/113

  Via provided in pad; Pad over filled via · CPC title

• H05K2201/093

  Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein · CPC title