Integrated power delivery board for delivering power to an ASIC with bypass of signal vias in a printed circuit board
US-11564317-B2 · Jan 24, 2023 · US
Seto Kan is listed as an inventor on 6 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Seto Kan |
| Total patents | 6 |
| First publication | Jul 6, 2017 |
| Latest publication | Jan 24, 2023 |
Publications ranked by popularity score, then publication date.
US-11564317-B2 · Jan 24, 2023 · US
US-2021219426-A1 · Jul 15, 2021 · US
US-10999930-B2 · May 4, 2021 · US
US-2020196448-A1 · Jun 18, 2020 · US
US-9780669-B2 · Oct 3, 2017 · US
US-2017194867-A1 · Jul 6, 2017 · US
Latest publications not already listed above.
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Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Cisco Tech Inc | 6 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K2201/09309 | 4 |
| H05K1/113 | 4 |
| H05K1/0262 | 4 |
| H05K2201/10734 | 4 |
| H05K2201/09609 | 4 |