Protective film of conductive adhesive, circuit board, and method for assembling display device

Patent metadata

Field	Value
Publication number	US-10993316-B2
Application number	US-201916454170-A
Country	US
Kind code	B2
Filing date	Jun 27, 2019
Priority date	Sep 6, 2018
Publication date	Apr 27, 2021
Grant date	Apr 27, 2021

Abstract

A protective film of a conductive adhesive, a circuit board and a method for assembling a display device are provided. The protective film of conductive adhesive includes: a basic material layer; and a photoinduced peelable adhesive and a protective layer which are arranged on a first surface of the basic material layer in sequence, and the photoinduced peelable adhesive has a low adhesive force in the exposure of light with a first wavelength. The protective film further includes a light-shielding film located on a second surface of the basic material layer opposite to the first surface.

First claim

What is claimed is:

1. A circuit board; comprising:
a substrate,
a conductive pattern on the substrate;
a conductive adhesive on the conductive pattern;
a protective film on the conductive adhesive; and
a light-shielding film on the protective film;
wherein
the conductive pattern is configured to, after the protective film and the light-shielding film are removed, be connected to an electrostatic discharge structure to release static charges;
the protective film comprises a basic material layer, and a photoinduced peelable adhesive arranged on a first surface of the basic material layer, wherein the photoinduced peelable adhesive is located between the basic material layer and the substrate, and has a low adhesive force in the exposure of light with a first wavelength; and
the photoinduced peelable adhesive is arranged in a peripheral area of the conductive adhesive,
the light-shielding film is arranged on a second surface of the basic material layer facing away from the substrate, wherein an orthographic projection of the photoinduced peelable adhesive onto the substrate is located within an orthographic projection of the light-shielding film onto the substrate,
wherein an adhesiveness of the photoinduced peelable adhesive is larger than an adhesiveness of the light-shielding film.

2. The circuit board according to claim 1 , wherein an orthographic projection of the conductive adhesive onto the substrate is not overlapped with an orthographic projection of the photoinduced peelable adhesive onto the substrate, and the orthographic projection of the photoinduced peelable adhesive onto the substrate and the orthographic projection of the conductive adhesive onto the substrate are within an orthographic projection of the basic material layer onto the substrate.

3. The circuit board according to claim 1 , wherein the photoinduced peelable adhesive comprises a plurality of adhesive sub-patterns that is distributed at intervals and surrounds the conductive adhesive.

4. The circuit board according to claim 1 , wherein an orthographic projection of the conductive adhesive onto the substrate is located within an orthographic projection of the photoinduced peelable adhesive onto the substrate.

5. The circuit board according to claim 1 , wherein the protective film further comprises a first adhesive arranged between the basic material layer and the photoinduced peelable adhesive.

6. The circuit board according to claim 1 , wherein at least one side of the light-shielding film is provided with a first handle.

7. The circuit board according to claim 1 , wherein at least one side of the basic material layer is provided with a second handle.

8. The circuit board according to claim 1 , wherein the conductive pattern is made of copper.

Assignees

• Boe Hebei Mobile Display Technology Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Zhao Lei
• Wang Linsong
• Yin Ertao
• Cui Zhiyang
• Zhu Dahua

Classifications

• H05K2201/09127

  PCB or component having an integral separable or breakable part · CPC title

• H05K3/321

  by conductive adhesives · CPC title

• H05K2201/10128

  Display · CPC title

• H05K3/027

  the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles · CPC title

• H05K2201/0195

  Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure · CPC title