Method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing a member and the uncured material on a substrate into contact

US10990005B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10990005-B2
Application numberUS-202016845357-A
CountryUS
Kind codeB2
Filing dateApr 10, 2020
Priority dateFeb 6, 2007
Publication dateApr 27, 2021
Grant dateApr 27, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing a member and the uncured material on a substrate into contact with each other is cured. The method includes a step of bringing the member and the substrate near to each other while effecting the alignment control, based on a driving profile, after the alignment control is started, to bring the member and the uncured material into contact with each other, and then the uncured material is cured, and a step of increasing a gap between the member and the substrate, after the uncured material is cured, wherein the driving profile for the alignment control after the alignment control is started and at least one of before and after the member contacts the uncured material is changed.

First claim

Opening claim text (preview).

We claim: 1. A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing the member and the uncured material on a substrate into contact with each other is cured, the method comprising: a step of bringing the member and the substrate near to each other while effecting the alignment control, based on a driving profile, after the alignment control is started, to bring the member and the uncured material into contact with each other, and then the uncured material is cured; and a step of increasing a gap between the member and the substrate, after the uncured material is cured, wherein the driving profile for the alignment control after the alignment control is started and at least one of before and after the member contacts the uncured material is changed. 2. A method according to claim 1 , wherein the driving profile for the alignment control includes at least one of an acceleration, a speed, a driving voltage, and a driving current. 3. A method according to claim 1 , further comprising a detecting step of detecting contact between the member and the uncured material, wherein the driving profile is changed according to the detecting step of detecting contact between the member and the uncured material. 4. A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing the member and the uncured material on a substrate into contact with each other is cured, the method comprising: a step of contacting the member and the uncured material to each other by bringing the member and the substrate near to each other while effecting the alignment control based on a driving profile; a step of bringing the member, contacting the uncured material, and the substrate further near to each other; a step of curing the uncured material in a state in which the member and the substrate are brought further near to each other; and a step of increasing a gap between the member and the substrate, after the uncured material is cured, wherein the driving profile for the alignment control is changed, in a period from the time when the member and the substrate are brought near to each other until the time when the member brought into contact with the uncured material and the substrate are brought further near to each other. 5. A method according to claim 4 , wherein the driving profile for the alignment control includes at least one of an acceleration, a speed, a driving voltage, and a driving current. 6. A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing the member and the uncured material on a substrate into contact with each other is cured, the method comprising: a step of bringing the member and the substrate near to each other while effecting the alignment control, based on a control parameter, after the alignment control is started, to bring the member and the uncured material into contact with each other, and then the uncured material is cured; and a step of increasing a gap between the member and the substrate, after the uncured material is cured, wherein the control parameter for the alignment control after the alignment control is started and at least one of before and after the member contacts the uncured material is changed. 7. A method according to claim 6 , wherein the control parameter for the alignment control includes at least one of a PID parameter, a feedforward parameter, and a filter parameter. 8. A method according to claim 6 , wherein the control parameter for the alignment control is a proportional gain. 9. A method according to claim 8 , wherein the proportional gain used for the alignment control after the member and the uncured material are contacted to each other is greater than that before the member and the uncured material are contacted to each other. 10. A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing the member and the uncured material on a substrate into contact with each other is cured, the method comprising: a step of contacting the member and the uncured material to each other by bringing the member and the substrate near to each other while effecting the alignment control based on a driving profile; a step of bringing the member, contacting the uncured material, and the substrate further near to each other; a step of curing the uncured material in a state in which the member and the substrate are brought further near to each other; and a step of increasing a gap between the member and the substrate, after the uncured material is cured, wherein the control parameter for the alignment control is changed, in a period from the time when the member and the substrate are brought near to each other until the time when the member brought into contact with the uncured material and the substrate are brought further near to each other. 11. A method according to claim 10 , wherein the control parameter for the alignment control includes at least one of a PID parameter, a feedforward parameter, and a filter parameter. 12. A method according to claim 10 , wherein the control parameter for the alignment control is a proportional gain. 13. A method according to claim 12 , wherein the proportional gain used for the alignment control after the member and the uncured material are contacted to each other is greater than that before the member and the uncured material are contacted to each other. 14. A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing the member and the uncured material on a substrate into contact with each other is cured, the method comprising: a step of bringing the member and the substrate near to each other while effecting the alignment control, based on a driving profile, after the alignment control is started, to bring the member and the uncured material into contact with each other, and then the uncured material is cured; and a step of increasing a gap between the member and the substrate, after the uncured material is cured, wherein the driving profile for the alignment control after contact of the member and the uncured material is different from the driving profile for the alignment control before the contact of the member and the uncured material. 15. A method according to claim 14 , wherein the driving profile for the alignment control includes at least one of an acceleration, a speed, a driving voltage, and a driving current. 16. A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing the member and the uncured material on a substrate into contact with each other is cured, the method comprising: a step of contacting the member and the uncured material to each other by bringing the member and the substrate near to each other while effecting the alignment control based on a driving profile; a step of bringing the member, contacting the uncured material, and the substrate further near to each other; a step of curing the uncured material in a state in which the member and the substrate are brought further near to each other; and a step of increasi

Assignees

Inventors

Classifications

  • Component parts, details or accessories; Auxiliary operations · CPC title

  • Manufacture or treatment of nanostructures · CPC title

  • Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic · CPC title

  • Gap setting, e.g. in proximity printer · CPC title

  • Aligning or positioning in direction perpendicular to substrate surface · CPC title

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What does patent US10990005B2 cover?
A method in which alignment control of a member and a substrate is effected with respect to an in-plane direction of the substrate and an uncured material in a state of bringing a member and the uncured material on a substrate into contact with each other is cured. The method includes a step of bringing the member and the substrate near to each other while effecting the alignment control, based…
Who is the assignee on this patent?
Canon Kk
What technology area does this patent fall under?
Primary CPC classification G03F7/0002. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Apr 27 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).