Composition for conducting material removal operations and method for forming same

Patent metadata

Field	Value
Publication number	US-10982114-B2
Application number	US-201816165640-A
Country	US
Kind code	B2
Filing date	Oct 19, 2018
Priority date	Oct 25, 2017
Publication date	Apr 20, 2021
Grant date	Apr 20, 2021

Abstract

A composition including a carrier comprising a liquid, an abrasive particulate contained in the carrier, an accelerant contained in the carrier, the accelerant including at least one free anion selected from the group of iodide (I − ), bromide (Br − ), fluoride (F − ), sulfate (SO 4 2− ), sulfide (S 2− ), sulfite (SO 3 2− ), chloride (Cl − ), silicate (SiO 4 4− ), phosphate (PO 4 3− ), nitrate (NO 3 − ), carbonate (CO 3 2− ), perchlorate (ClO 4 − ), or any combination thereof, and a buffer contained in a saturated concentration in the carrier, the buffer including a compound selected from M a F x , N b F x , M a N b F x , M a I x , N b I x , M a N b I x , M a Br x , N b Br x , M a N b Br x , M a (SO 4 ) x , N b (SO 4 ) x , MaN b (SO 4 ) x , M a S x , N b S x , M a N b S x , M a (SiO 4 ) x , N b (SiO 4 ) x , M a N b (SiO 4 ) x , M a (PO 4 ) x , N b (PO 4 ) x , M a N b (PO 4 ) x , M a (NO 3 ) x , N b (NO 3 ) x , M a N b (NO 3 ) x , M a (CO 3 ) x , N b (CO 3 ) x , M a N b (CO 3 ) x , or any combination, wherein M represents a metal element or metal compound; N represents a non-metal element; and a, b, and x is 1-6.

First claim

What is claimed is:

1. A composition comprising:
a carrier comprising a liquid;
an abrasive particulate contained in the carrier;
an accelerant contained in the carrier, the accelerant being fully dissolved and including free fluoride (F − ) anions; and
a buffer contained in a saturated concentration in the carrier, the buffer including a compound selected from M a F x , N b F x , M a N b F x , or any combination thereof, wherein M represents a metal element or metal compound; N represents a non-metal element; and a, b, and x is 1-6, and wherein the buffer is different than the accelerant,

wherein the accelerant has a solubility of at least 50 g/L and the buffer has a solubility of less than 10 g/L according to ASTM standard E1148.

2. The composition of claim 1 , wherein the carrier comprises water.

3. The composition of claim 1 , wherein the carrier is present in an amount of at least 45 wt % for a total weight of the composition.

4. The composition of claim 1 , wherein the abrasive particulate comprises a density of not greater than 4.5 g/cm 3 .

5. The composition of claim 1 , wherein the abrasive particulate comprises silica.

6. The composition of claim 1 , wherein the accelerant includes a compound selected from KF, NaF, RbF, NiF 2 , ZnF 2 , CoF 2 , or any combination thereof.

7. The composition claim 1 , wherein the buffer includes a compound selected from KBF 4 , NaBF 4 , NH 4 BF 4 , KPF 6 , NaPF 6 , CaF 2 , MgF2, Na 3 AlF 6 , FeF 3 , LiF, MnF 2 , AlF 3 , or any combination thereof.

8. The composition of claim 1 , wherein the accelerant is present in a concentration of at least 0.002 M to not greater than 1.0 M.

9. The composition of claim 1 , wherein the accelerant includes KF and the buffer includes KBF 4 .

10. The composition of claim 1 , wherein the abrasive particulate comprises silica, the accelerant comprises KF, and the buffer comprises KBF 4 .

11. The polishing slurry of claim 1 , wherein the polishing slurry is adapted to polish a zirconia-containing material with an average material removal rate (MMR) of at least 8.0 microns/hour according to a Zirconia Polishing Test.

12. The composition of claim 1 , wherein a pH of the composition is at least 9.

13. A composition comprising:
a carrier comprising a liquid;
an abrasive particulate contained in the carrier, wherein the abrasive particulate comprises silica;
an accelerant contained in the carrier, the accelerant being fully dissolved and comprising free fluoride ions (F 1− ) present in an amount within a range of at least 0.002 M and not greater than 1.0 M and the accelerant has a solubility of at least 50 g/L;
a buffer contained in the carrier, the buffer comprising M a N b F x , wherein M is a metal element, N is a non-metal element, and a, b, x are 1-6, and wherein the buffer has a solubility less than 10 g/L,
wherein the buffer is contained in a saturated concentration in the carrier.

14. The composition of claim 13 , wherein the buffer includes KBF 4 .

15. The composition of claim 13 , wherein the accelerant includes a compound selected from KF, NaF, RbF, NiF 2 , ZnF 2 , CoF 2 , or any combination thereof.

16. The composition claim 13 , wherein the buffer includes a compound selected from KBF 4 , NaBF 4 , NH 4 BF 4 , KPF 6 , NaPF 6 , or any combination thereof.

17. The composition of claim 13 , wherein the accelerant comprises KF and the buffer comprises KBF 4 .

18. The composition of claim 13 , wherein a pH of the composition is at least 9.

Assignees

• Saint Gobain Ceramics

Inventors

• Sines Ian T
• Bottiglieri Stephen
• Ward Douglas E
• Nahas Nabil
• Hampden-Smith Mark
• Robare Steven L

Classifications

• C09K3/1463

  Aqueous liquid suspensions · CPC title

• C09G1/04

  Aqueous dispersions (C09G1/02 takes precedence) · CPC title

• C09G1/02 Primary

  containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)} · CPC title

• C09G1/00

  Polishing compositions (French polish C09F11/00; detergents C11D) · CPC title

• C09K3/1454

  Abrasive powders, suspensions and pastes for polishing · CPC title