Method of nanoscale patterning based on controlled pinhole formation

Patent metadata

Field	Value
Publication number	US-10981304-B2
Application number	US-201716099493-A
Country	US
Kind code	B2
Filing date	Jun 1, 2017
Priority date	Jun 5, 2016
Publication date	Apr 20, 2021
Grant date	Apr 20, 2021

Abstract

A method of nanoscale patterning is disclosed. The method comprises: mixing predetermined amounts of a first solvent and a second solvent to generate a solvent, the first solvent and the second solvent being immiscible with each other; dissolving a solute material in the solvent to generate a coating material, the solute material having solubility that is higher in the first solvent than in the second solvent; and applying the coating material onto a substrate to form a plurality of pinholes in the coating material. The formation of the plurality of pinholes is associated with suspension drops mostly comprised of the second solvent, separated from the solute material dissolved in the first solvent, in the coating material. A method of making a stamp with a nanoscale pattern is also disclosed based on the above method.

First claim

The invention claimed is:

1. A method of making a stamp having a nanoscale pattern, the method comprising:
mixing predetermined amounts of a first solvent and a second solvent to generate a solvent, the first solvent and the second solvent being immiscible with each other;
dissolving a solute material in the solvent to generate a coating material, the solute material having solubility that is higher in the first solvent than in the second solvent;
applying the coating material onto a substrate to form a plurality of pinholes in the coating material;
applying a replicating material onto the coating material containing the plurality of pinholes to replicate a pattern of a surface of the coating material containing the plurality of pinholes onto a surface of the replicating material; and
delaminating the replicating material from the coating material for using the surface of the delaminated replicating material as the surface of the stamp.

2. The method of claim 1 , wherein
the applying the coating material comprises spin-coating the coating material on the substrate.

3. The method of claim 1 , wherein
the applying the replicating material onto the coating material comprises spin-coating the replicating material on the coating material containing the plurality of pinholes, followed by drying the replicating material.

4. The method of claim 1 , wherein
the formation of the plurality of pinholes is associated with suspension drops comprised of the second solvent, separated from the solute material dissolved in the first solvent, in the coating material.

5. The method of claim 1 , further comprising
attaching a support plate to a back surface of the delaminated replicating material for use as the stamp.

6. The method of claim 1 , wherein
the solute material comprises a hole transport material used for forming a hole transport layer in a perovskite optoelectronic device.

7. The method of claim 6 , wherein
the hole transport material comprises spiro-MeOTAD or polystyrene.

8. The method of claim 1 , wherein
the first solvent comprises chlorobenzene, chloroform, dichloromethane or toluene.

9. The method of claim 1 , wherein
the second solvent comprises water, a stabilizer or both.

10. The method of claim 9 , wherein
the stabilizer comprises amylene.

11. The method of claim 1 , wherein
the replicating material is orthogonal to the coating material, wherein the replicating material does not dissolve the coating material.

12. The method of claim 1 , wherein
the replicating material comprises a thermoplastic polymer.

13. The method of claim 12 , wherein
the thermoplastic polymer comprises an amorphous fluoropolymer, PMMA or a silicone elastomer.

14. The method of claim 1 ,
wherein the plurality of pinholes have dimensions on the order of 1-100 nm.

15. A method of nanoscale patterning, the method comprising:
mixing predetermined amounts of a first solvent and a second solvent to generate a solvent, the first solvent and the second solvent being immiscible with each other;
dissolving a solute material in the solvent to generate a coating material, the solute material having solubility that is higher in the first solvent than in the second solvent; and
applying the coating material onto a substrate to form a plurality of pinholes in the coating material,
wherein the formation of the plurality of pinholes is associated with suspension drops comprised of the second solvent, separated from the solute material dissolved in the first solvent, in the coating material, the plurality of pinholes providing the nanoscale patterning on a surface of the coating material.

16. The method of claim 1 , wherein
the surface of the stamp has a nanoscale pattern associated with a plurality of rods on the surface of the delaminated replicating material corresponding to the plurality of pinholes contained in the coating material,
the plurality of rods have dimensions on the order of 1-100 nm, and
the nanoscale pattern is controlled by types and amounts of the first solvent and the second solvent.

17. The method of claim 15 , wherein the plurality of pinholes have dimensions on the order of 1-100 nm.

18. The method of claim 15 , wherein
the nanoscale patterning comprises a plurality of rods corresponding to the plurality of pinholes contained in the coating material,
the plurality of rods have dimensions on the order of 1-100 nm, and
he nanoscale patterning is controlled by types and amounts of the first solvent and the second solvent.

Assignees

• Okinawa Inst Science & Tech School Corp

Inventors

• Qi Yabing
• Ono Luis Katsuya

Classifications

• H10K85/50

  Organic perovskites; Hybrid organic-inorganic perovskites [HOIP], e.g. CH3NH3PbI3 · CPC title

• H10K30/10

  comprising heterojunctions between organic semiconductors and inorganic semiconductors · CPC title

• H10K30/50

  Photovoltaic [PV] devices · CPC title

• B01D67/0011

  Casting solutions therefor · CPC title

• B01D67/00135

  Air gap characteristics · CPC title