Sputtered SIP antenna

Patent metadata

Field	Value
Publication number	US-10978779-B2
Application number	US-201816132786-A
Country	US
Kind code	B2
Filing date	Sep 17, 2018
Priority date	Sep 17, 2018
Publication date	Apr 13, 2021
Grant date	Apr 13, 2021

Abstract

System in package (SIP) modules are compact packages that include components such as processors, memory, sensors, and passive components on a single substrate. One low cost and compact way to integrate an antenna into a SIP module is to suspend an antenna in molding compound so that the antenna is embedded in the real estate of the molding compound layer. To embed the antenna, the molding compound is first deposited. A cavity can be cut in the molding compound to hold the antenna. The cavity can be filled with conductive material to form the antenna. Further molding compound can be deposited to cover the antenna and enclose the antenna in the molding compound layer. Ground structures can also be suspended in the molding compound. Such an embedded antenna can be particularly useful for radio applications.

First claim

What is claimed is:

1. A system in package module, comprising:
a substrate;
a component layer;
one or more components mounted on the component layer;
a molding compound layer comprising molding compound; and
an antenna formed from conductive material, the antenna comprising a radiating structure spanning horizontally and a feedline extending vertically to connect the radiating structure to the component layer, wherein the radiating structure and the feedline are embedded inside the molding compound layer.

2. The system in package module of claim 1 , wherein the radiating structure further comprises:
one or more parasitic conductive elements extending from the radiating structure.

3. The system in package module of claim 1 , wherein the radiating structure further comprises:
one or more parasitic conductive elements adjacent to the radiating structure.

4. The system in package module of claim 1 , further comprising:
one or more antenna ground structures enclosed inside the molding compound layer.

5. The system in package module of claim 4 , wherein the one or more antenna ground structures comprises one or more defected ground structures.

6. The system in package module of claim 1 , wherein the antenna comprises:
two radiating structures forming a dipole antenna.

7. The system in package module of claim 1 , wherein the antenna comprises:
four radiating structures forming a quadrupole antenna.

8. The system in package module of claim 1 , wherein the component layer is made of conductive material serving as electrical interconnections for the one or more components.

9. The system in package module of claim 1 , further comprising:
a conformal overmold compound layer comprising conformal overmold compound sealing surfaces of the component layer and contours of the one or more components.

10. The system in package module of claim 9 , wherein the conformal overmold compound layer is a conformal coating.

11. The system in package module of claim 9 , further comprising:
a conformal shield enclosing surfaces of the conformal overmold compound layer.

12. The system in package module of claim 11 , wherein the molding compound layer is deposited over the conformal shield.

13. The system in package module of claim 1 , wherein the molding compound comprises one or more of: organic resin, inorganic material, catalyst for curing, mold release material, and colorant.

14. The system in package module of claim 1 , further comprising:
package enclosure material enclosing surfaces of conformal shield and molding compound layer.

15. The system in package module of claim 1 , wherein the feedline does not contact a conformal shield enclosing surfaces of a conformal overmold compound layer.

16. A system in package module, comprising:
a substrate;
a component layer;
one or more components mounted on the component layer;
a molding compound layer comprising molding compound; and
an antenna made with conductive material comprising a radiating structure spanning horizontally and a feedline extending vertically to connect the radiating structure to the component layer, wherein the radiating structure and the feedline are suspended in the molding compound layer.

17. The system in package module of claim 16 , wherein the radiating structure comprises one or more parasitic conductive elements.

18. A system in package module, comprising:
a substrate;
a component layer;
one or more components mounted on the component layer;
a molding compound layer comprising molding compound, wherein the molding compound encloses surfaces of the one or more components and the component layer; and
an antenna formed by sputtering conductive material in cavities of the molding compound layer, the antenna comprising (1) a radiating structure suspended horizontally in the molding compound layer, and (2) a feedline extending from radiating structure in the molding compound layer vertically to the component layer to connect the antenna to the component layer.

19. The system in package module of claim 18 , further comprising:
further package molding compound deposited over the antenna to enclose the antenna.

20. The system in package module of claim 18 , wherein the conductive material comprises one or more of: copper, silver, aluminum, metal alloy, and magnetic material.

Assignees

• Analog Devices International Unlimited Co

Inventors

• Maggay Romulo

Classifications

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W44/248

  for antennas · CPC title

• H10W70/685 Primary

  comprising multiple insulating layers · CPC title

• H10W44/20

  at high-frequency [HF] or radio frequency [RF] · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title