High power cavity package for light emitters

Patent metadata

Field	Value
Publication number	US-10971892-B2
Application number	US-201916533721-A
Country	US
Kind code	B2
Filing date	Aug 6, 2019
Priority date	Nov 10, 2017
Publication date	Apr 6, 2021
Grant date	Apr 6, 2021

Abstract

An emitter package can include: a body having a bottom member, side members extending from the bottom member, and a top surface, wherein the body defines a cavity formed into the top surface and located between the bottom member and side members; the cavity having top side walls extending from the top surface to optic shelves, middle side walls extending from the optic shelves to contact shelves, and bottom side walls extending from the contact shelves to a base surface; electrical conductive pads on the base surface in the cavity; emitter chips on the electrical conductive pads, each emitter chip having one or more light emitters; shelf contact pads on the contact shelves; and electrical connector wires connected to and extending between the emitter chips and the shelf contact pads.

First claim

The invention claimed is:

1. An emitter package comprising:
a body having a bottom member, one or more side members extending from the bottom member, and a top surface, wherein the body defines a cavity formed into the top surface and located between the bottom member and the one or more side members;
the cavity having one or more top side walls extending from the top surface to one or more contact shelves, and one or more bottom side walls extending from the one or more contact shelves to a base surface;
a plurality of electrical conductive pads on the base surface in the cavity;
a plurality of light emitter chips on the electrical conductive pads, each light emitter chip having one or more light emitters;
an optic optically coupled with the light emitter chips;
at least one anode pad and at least one cathode pad on a bottom surface of the bottom member;
a plurality of shelf contact pads on the one or more contact shelves; and
a plurality of electrical connector wires connected to and extending between the light emitter chips and the shelf contact pads,
wherein the at least one cathode pad is electrically connected to a first of the electrical conductive pads, which is electrically connected through a first of the light emitter chips and a first of the electrical connector wires to a first of the shelf contact pads, which is electrically connected through one or more first shelf vias to a second of the electrical conductive pads, which is electrically connected through a second of the emitter chips and a second of the electrical connector wires to a second of the shelf contact pads.

2. The emitter package of claim 1 , wherein the body that defines the cavity formed into the top surface and located between the bottom member and one or more side members is a unitary member.

3. The emitter package of claim 1 , wherein one of the light emitter chips is disposed on each of the electrical conductive pads.

4. The emitter package of claim 1 , comprising:
four of the electrical conductive pads on the base surface in the cavity;
one of the light emitter chips on each of the four electrical conductive pads; and
four of the shelf contact pads on the one or more contact shelves.

5. The emitter package of claim 1 , wherein the second shelf contact pad is electrically connected through one or more second shelf vias to a third of the electrical conductive pads, which is electrically connected through a third of the light emitter chips and a third of the electrical connector wires to a third of the shelf contact pads, which is electrically connected through one or more third shelf vias to a fourth of the electrical conductive pads, which is electrically connected through a fourth of the light emitter chips and a fourth of the electrical connector wires to a fourth of the shelf contact pads, which is electrically connected to the at least one anode pad.

6. The emitter package of claim 5 , wherein:
the at least one cathode pads is electrically coupled with the first of the electrical conductive pads through one or more vias or electrical conduits; and
the at least one anode pad is electrically coupled with the second of the shelf contact pads through one or more other vias or electrical conduits.

7. The emitter package of claim 1 , wherein:
the electrical conductive pads are each electrically isolated from each other; and/or
the shelf contact pads are each electrically isolated from each other.

8. The emitter package of claim 1 , wherein the base surface includes one or more recessed regions or one or more raised regions around the electrical conductive pads.

9. The emitter package of claim 1 , wherein each of the one or more emitters on the light emitter chips is configured to emit infrared light.

10. The emitter package of claim 1 , wherein the body is formed of a plastic or ceramic.

11. A method of emitting one or more light beams, the method comprising:
providing the emitter package of claim 1 ; and
emitting light out of the cavity from the one or more light emitters of the light emitter chips.

12. A method of manufacturing the emitter package of claim 1 , the method comprising:
forming the body having the cavity;
placing the electrical conductive pads on the base surface in the cavity;
placing the light emitter chips on the electrical conductive pads;
placing the shelf contact pads on the one or more contact shelves;
electrically connecting the light emitter chips with the shelf contact pads with the electrical connector wires connected to and extending between the light emitter chips and the shelf contact pads; and
depositing a transparent encapsulating material for the optic to encapsulate at least the light emitter chips and covering the base surface and at least partially filling the cavity.

13. The emitter package of claim 1 , the optic comprises a transparent encapsulating material that encapsulates the light emitter chips and the base surface and at least partially fills the cavity.

14. The emitter package of claim 13 , wherein the transparent encapsulating material fills the cavity.

15. The emitter package of claim 13 , further comprising one or more optic shelves between the top surface and one or more contact shelves, wherein the transparent encapsulating material fills the cavity at least to the one or more optic shelves.

16. The emitter package of claim 13 , wherein the transparent encapsulating material is a polymer.

17. The emitter package of claim 1 , further comprising one or more optic shelves between the top surface and one or more contact shelves, wherein the optic comprises an optical element on and extending between the one or more optic shelves so as to cover at least a portion of the cavity.

18. The emitter package of claim 17 , wherein the optical element is a diffuser on and extending between the one or more optic shelves so as to cover a portion of the cavity below the diffuser.

19. The emitter package of claim 1 , wherein the second shelf contact pad is coupled either:
through one or more series of the electrical conductive pads, the light emitter chips, the connector wires, and the shelf contact pads to the at least one anode pad; or
to the at least one anode pad.

Assignees

• Finisar Corp
• Ii Vi Delaware Inc

Inventors

• Stapleton Brent
• Khurana Pritha
• Lye Nathan

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W76/12

  characterised by their shape · CPC title

• H10W72/07554

  changes in dispositions · CPC title