Quantum device with modular quantum building blocks

Patent metadata

Field	Value
Publication number	US-10971672-B2
Application number	US-201816047192-A
Country	US
Kind code	B2
Filing date	Jul 27, 2018
Priority date	Jul 27, 2018
Publication date	Apr 6, 2021
Grant date	Apr 6, 2021

Abstract

Techniques for a quantum device with modular quantum building blocks are provided. In one embodiment, a device is provided that comprises a substrate that is coupled with a plurality of qubit pockets, where at least one qubit pocket of the plurality of qubit pockets is coupled with a qubit. In one implementation, the device can further comprise a plurality of connectors coupled to the substrate and positioned around at least a portion of the substrate, where the plurality of connectors comprising a connecting element. In one or more implementations, the device can further comprise a plurality of transmission lines formed on the substrate and connect at least one connector of the plurality of connectors to at least one qubit pocket of the plurality of qubit pockets.

First claim

What is claimed is:

1. A device, comprising:
a plurality of substrates, each of the plurality of substrates having a plurality of qubit pockets, wherein at least one qubit pocket of the plurality of qubit pockets is provided with a qubit of a plurality of qubits in the respective plurality of qubit pockets;
a plurality of connectors directly connected between at least two of the plurality of substrates and positioned around an edge of the at least two of the plurality of substrates, the plurality of connectors comprising respective connecting elements, wherein each of the respective connecting elements directly connects the at least two of the plurality of substrates; and
a plurality of transmission lines formed on the substrate and connected to at least one connector of the plurality of connectors and to at least one qubit pocket of the plurality of qubit pockets, and wherein the plurality of substrates are separate from one another rendering the device a modular quantum device in which the qubit is separately replaceable from other ones of the plurality of qubits without replacement of the entire device.

2. The device of claim 1 , wherein the respective connecting elements are arranged on the at least one of the plurality of substrates with a separation gap between the respective connecting elements of at least 3 millimeters and wherein the separation gap is disposed to maintain crosstalk below −50 decibels.

3. The device of claim 1 , wherein the respective connecting elements comprise wire bonds.

4. The device of claim 1 , wherein the respective connecting elements comprise vertical interconnect accesses.

5. The device of claim 1 , wherein the at least one of the plurality of substrates is composed of a material selected from the group consisting of Sapphire and Silicon and Gallium Arsenide.

6. The device of claim 1 , wherein at least one transmission line of the plurality of transmission lines is a coplanar waveguide.

7. The device of claim 1 , wherein at least one transmission line of the plurality of transmission lines is comprised of a microstrip material.

8. The device of claim 1 , wherein at least one qubit pocket of the plurality of qubit pockets is coupled to the substrate using a coplanar waveguide, and wherein adjacent ones of the plurality of qubit pockets are vertically adjacent.

9. The device of claim 1 , wherein the plurality of substrates comprises at least four substrates, wherein each of the four substrates is positioned having at least one edge adjacent to an edge of another one of the four substrates to form the modular quantum device in the shape of a four-sided polygon, and wherein each of the four substrates comprises a plurality of connectors directly connecting each of the four substrates to another one of the four substrates.

10. A structure, comprising:
a device comprising a plurality of quantum building blocks, wherein the plurality of quantum building blocks comprise a respective plurality of substrates, a plurality of connectors directly connected between at least two of the plurality of substrates, a plurality of qubit pockets and a plurality of transmission lines; and
a plurality of connecting elements coupled to the plurality of connectors, wherein the plurality of connecting elements transport quantum signals between the plurality of quantum building blocks, wherein each of the plurality of connecting elements directly connects at least two of the plurality of substrates, and wherein the respective plurality of substrates are separate from one another rendering the structure a modular quantum structure in which a substrate of the plurality of substrates is separately detachable from other ones of the plurality of substrates without replacement of the entire structure.

11. The structure of claim 10 , wherein at least one qubit pocket of the plurality of qubit pockets is coupled with a qubit.

12. The structure of claim 10 , wherein the plurality of connecting elements are arranged with a separation gap between the plurality of connecting elements to maintain crosstalk below −50 decibels.

Assignees

• IBM

Inventors

• Olivadese Salvatore Bernardo
• Ritter Mark

Classifications

• G06N10/40 Primary

  Physical realisations or architectures of quantum processors or components for manipulating qubits, e.g. qubit coupling or qubit control · CPC title

• H10N60/815

  for Josephson-effect devices · CPC title

• H01L39/2493

  Electricity · mapped topic

• G06N10/00

  Quantum computing, i.e. information processing based on quantum-mechanical phenomena · CPC title

• H01L39/223

  Electricity · mapped topic