Generating milled structural elements with a flat upper surface

Patent metadata

Field	Value
Publication number	US-10971618-B2
Application number	US-201916530331-A
Country	US
Kind code	B2
Filing date	Aug 2, 2019
Priority date	Aug 2, 2019
Publication date	Apr 6, 2021
Grant date	Apr 6, 2021

Abstract

A miller, a non-transitory computer-readable medium, and a method for milling a multi-layered object. The method may include milling each structural element of an array of structural elements that are spaced apart from each other by gaps to provide the milled structural elements, wherein each milled structural element has a flat upper surface, wherein prior the milling each one of the structural elements of the array has a flat upper surface of a certain width, wherein the certain width is of a nanometric scale. The milling of each structural element of the array may include scanning a defocused ion beam of the certain width along a longitudinal axis of the structural element. A current intensity of the defocused ion beam decreases with a distance from a middle of the defocused ion beam.

First claim

We claim:

1. A method for generating milled structural elements, the method comprises:
milling each structural element of an array of structural elements that are spaced apart from each other by gaps to provide the milled structural elements, wherein each milled structural element of the array has a flat upper surface; wherein prior to the milling, the each structural element has a flat upper surface of a certain width, wherein the certain width is of a nanometric scale;
wherein the milling comprises scanning a defocused ion beam of the certain width along a longitudinal axis of the each structural element; and
wherein a current intensity of the defocused ion beam decreases with a distance from a middle of the defocused ion beam.

2. The method according to claim 1 comprising receiving structural element information regarding the certain width and determining at least one milling parameter to provide the defocused ion beam of the certain width.

3. The method according to claim 1 comprising:
receiving or determining a shape of an upper part of evenly milled structural elements of the array;
determining a milling scheme that compensates for deviations of the shape of the upper part of the evenly milled structural elements from having a flat top surface; and
applying the milling scheme during the milling of the each structural element.

4. The method according to claim 3 wherein the determining of the milling scheme comprises determining a milling scan pattern and one or more additional milling parameters.

5. The method according to claim 4 wherein the one or more additional milling parameters comprise a defocus strength of the defocused ion beam, and a defocused ion beam current distribution.

6. The method according to claim 1 , wherein the defocused ion beam has a focus plane above or below the flat upper surface of the structural elements of the array.

7. A miller that comprises:
a controller; and
a focused ion beam module;
wherein the focused ion beam module is configured to mill, under a control of the controller, each structural element of an array of structural elements that are spaced apart from each other by gaps to provide milled structural elements, wherein each milled structural element has a flat upper surface; wherein prior to milling, the each structural element has a flat upper surface of a certain width, wherein the certain width is of a nanometric scale;
wherein a milling, by the focused ion beam module, of the each structural element comprises scanning a defocused ion beam of the certain width along a longitudinal axis of the each structural element; and
wherein a current intensity of the defocused ion beam decreases with a distance from a middle of the defocused ion beam.

8. The miller according to claim 7 wherein the controller is configured to receive structural element information regarding the certain width and determine at least one milling parameter to provide the defocused ion beam of the certain width.

9. The miller according to claim 7 wherein the controller is configured to:
receive or determine a shape of an upper part of evenly milled structural elements of the array;
determine a milling scheme that compensates for deviations of the shape of the upper part of the evenly milled structural elements from having a flat top surface; and
wherein the focused ion beam module is configured to apply the milling scheme during the milling of the each structural element.

10. The miller according to claim 9 wherein the controller is configured to determine the milling scheme by determining a milling scan pattern and one or more additional milling parameters.

11. The miller according to claim 10 wherein the one or more additional milling parameters comprise a defocus strength of the defocused ion beam, and a defocused ion beam current distribution.

12. The miller according to claim 7 , wherein the defocused ion beam has a focus plane below the flat upper surface of the structural elements of the array.

13. A non-transitory computer-readable medium that stores instructions for generating milled structural elements, the instructions causing a miller to perform a method comprising:
milling each structural element of an array of structural elements that are spaced apart from each other by gaps to provide the milled structural elements, each milled structural element has a flat upper surface; wherein prior the milling the each structural element has a flat upper surface of a certain width, wherein the certain width is of a nanometric scale;
wherein the milling comprises scanning a defocused ion beam of the certain width along a longitudinal axis of the each structural element; and
wherein a current intensity of the defocused ion beam decreases with a distance from a middle of the defocused ion beam.

14. The non-transitory computer-readable medium according to claim 13 , the method further comprising receiving structural element information regarding the certain width and determining at least one milling parameter to provide the defocused ion beam of the certain width.

15. The non-transitory computer-readable medium according to claim 13 , the method further comprising:
receiving or determining a shape of an upper part of evenly milled structural elements of the array;
determining a milling scheme that compensates for deviations of the shape of the upper part of the evenly milled structural elements from having a flat top surface; and
applying the milling scheme during the milling of the each structural element.

16. The non-transitory computer-readable medium according to claim 15 wherein the determining of the milling scheme comprises determining a milling scan pattern and one or more additional milling parameters.

17. The non-transitory computer-readable medium according to claim 16 wherein the one or more additional milling parameters comprise a defocus strength of the defocused ion beam and a defocused ion beam current distribution.

18. The non-transitory computer-readable medium according to claim 13 , wherein the defocused ion beam has a focus plane below the flat upper surface of the structural elements of the array.

Assignees

• Applied Materials Israel Ltd

Inventors

• Davidescu Ron
• Zur Yehuda

Classifications

• H10P95/00

  Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass · CPC title

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title

• H10P50/242 Primary

  of Group IV materials · CPC title

• H10D30/603

  having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended drain IGFETs [EDMOS] · CPC title

• H10D30/64 Primary

  Double-diffused metal-oxide semiconductor [DMOS] FETs · CPC title