Method for manufacturing ceramic electronic component and ceramic electronic component

Patent metadata

Field	Value
Publication number	US-10971305-B2
Application number	US-201916666177-A
Country	US
Kind code	B2
Filing date	Oct 28, 2019
Priority date	May 31, 2017
Publication date	Apr 6, 2021
Grant date	Apr 6, 2021

Abstract

A method for manufacturing a ceramic electronic component in which a plated electrode can be formed in a region of the surface of a ceramic base body formed of a titanium-containing metal oxide. The method includes preparing a ceramic base body containing a titanium-containing metal oxide, forming a low-resistance section by modifying the metal oxide through irradiation of part of a surface layer portion of the ceramic base body with a pulse laser with a peak power density of 1×10 6 W/cm 2 to 1×10 9 W/cm 2 and a frequency of 500 kHz or less, and forming an electrode on the low-resistance section by electroplating. The laser irradiation generates an O defect in a titanium-containing metal oxide, such as BaTiO 3 to form an n-type semiconductor. Since this semiconductor section has a lower resistance value than the metal oxide, plating metal can be selectively deposited by electroplating.

First claim

What is claimed is:

1. A method for manufacturing a ceramic electronic component, the method comprising:
preparing a ceramic base body containing a titanium-containing metal oxide;
forming a low-resistance section by modifying the metal oxide through irradiation of part of a surface layer portion of the ceramic base body with a pulse laser; and
forming an electrode on the low-resistance section by electroplating,
wherein the irradiation with the pulse laser is performed with a peak power density of 1×10 6 W/cm 2 to 1×10 9 W/cm 2 and a frequency of 500 kHz or less.

2. The method for manufacturing a ceramic electronic component according to claim 1 , wherein the metal oxide is formed into an n-type semiconductor in the low-resistance section.

3. The method for manufacturing a ceramic electronic component according to claim 1 , wherein
the irradiation with the pulse laser is performed with a peak power density of 1×10 6 W/cm 2 to 1×10 8 W/cm 2 and a frequency of 10 kHz to 100 kHz.

4. The method for manufacturing a ceramic electronic component according to claim 1 , wherein the ceramic base body contains BaTiO 3 .

5. The method for manufacturing a ceramic electronic component according to claim 1 , wherein
the ceramic electronic component is a multilayer ceramic capacitor;
a plurality of end portions of inner electrodes is exposed on each of both end surfaces of the ceramic electronic component;
the low-resistance section is formed in at least one side surface adjacent to the both end surfaces of the ceramic electronic component in such a manner that the low-resistance section is formed in each of portions of the side surface that adjoin the respective end surfaces; and
the electrode is continuously formed on each end surface and each low-resistance section of the ceramic electronic component.

6. The method for manufacturing a ceramic electronic component according to claim 2 , wherein
the irradiation with the pulse laser is performed with a peak power density of 1×10 6 W/cm 2 to 1×10 8 W/cm 2 and a frequency of 10 kHz to 100 kHz.

7. The method for manufacturing a ceramic electronic component according to claim 2 , wherein the ceramic base body contains BaTiO 3 .

8. The method for manufacturing a ceramic electronic component according to claim 3 , wherein the ceramic base body contains BaTiO 3 .

9. The method for manufacturing a ceramic electronic component according to claim 6 , wherein the ceramic base body contains BaTiO 3 .

10. The method for manufacturing a ceramic electronic component according to claim 2 , wherein
the ceramic electronic component is a multilayer ceramic capacitor;
a plurality of end portions of inner electrodes is exposed on each of both end surfaces of the ceramic electronic component;
the low-resistance section is formed in at least one side surface adjacent to the both end surfaces of the ceramic electronic component in such a manner that the low-resistance section is formed in each of portions of the side surface that adjoin the respective end surfaces; and
the electrode is continuously formed on each end surface and each low-resistance section of the ceramic electronic component.

11. The method for manufacturing a ceramic electronic component according to claim 3 , wherein
the ceramic electronic component is a multilayer ceramic capacitor;
a plurality of end portions of inner electrodes is exposed on each of both end surfaces of the ceramic electronic component;
the low-resistance section is formed in at least one side surface adjacent to the both end surfaces of the ceramic electronic component in such a manner that the low-resistance section is formed in each of portions of the side surface that adjoin the respective end surfaces; and
the electrode is continuously formed on each end surface and each low-resistance section of the ceramic electronic component.

12. The method for manufacturing a ceramic electronic component according to claim 4 , wherein
the ceramic electronic component is a multilayer ceramic capacitor;
a plurality of end portions of inner electrodes is exposed on each of both end surfaces of the ceramic electronic component;
the low-resistance section is formed in at least one side surface adjacent to the both end surfaces of the ceramic electronic component in such a manner that the low-resistance section is formed in each of portions of the side surface that adjoin the respective end surfaces; and
the electrode is continuously formed on each end surface and each low-resistance section of the ceramic electronic component.

13. The method for manufacturing a ceramic electronic component according to claim 6 , wherein
the ceramic electronic component is a multilayer ceramic capacitor;
a plurality of end portions of inner electrodes is exposed on each of both end surfaces of the ceramic electronic component;
the low-resistance section is formed in at least one side surface adjacent to the both end surfaces of the ceramic electronic component in such a manner that the low-resistance section is formed in each of portions of the side surface that adjoin the respective end surfaces; and
the electrode is continuously formed on each end surface and each low-resistance section of the ceramic electronic component.

14. The method for manufacturing a ceramic electronic component according to claim 7 , wherein
the ceramic electronic component is a multilayer ceramic capacitor;
a plurality of end portions of inner electrodes is exposed on each of both end surfaces of the ceramic electronic component;
the low-resistance section is formed in at least one side surface adjacent to the both end surfaces of the ceramic electronic component in such a manner that the low-resistance section is formed in each of portions of the side surface that adjoin the respective end surfaces; and
the electrode is continuously formed on each end surface and each low-resistance section of the ceramic electronic component.

15. The method for manufacturing a ceramic electronic component according to claim 8 , wherein
the ceramic electronic component is a multilayer ceramic capacitor;
a plurality of end portions of inner electrodes is exposed on each of both end surfaces of the ceramic electronic component;
the low-resistance section is formed in at least one side surface adjacent to the both end surfaces of the ceramic electronic component in such a manner that the low-resistance section is formed in each of portions of the side surface that adjoin the respective end surfaces; and
the electrode is continuously formed on each end surface and each low-resistance section of the ceramic electronic component.

16. The method for manufacturing a ceramic electronic component according to claim 9 , wherein
the ceramic electronic component is a multilayer ceramic capacitor;
a plurality of end portions of inner electrodes is exposed on each of both end surfaces of the ceramic electronic component;
the low-resistance section is formed in at least one side surface adjacent to the both end surfaces of the ceramic electronic component in such a manner that the low-resistance section is formed in each of portions of the side surface that adjoin the respective end surfaces; and
the electrode is continuously formed on each end surface and each low-resistance section of the ceramic electronic component.

17. A ceramic electronic component comprising:
a ceramic base body containing a titanium-containing metal oxide;
a low-resistance section formed in part of a surface layer portion of the ceramic base body and obtained by mo

Assignees

• Murata Manufacturing Co

Inventors

• Tsutsumi Masaki
• Kunishi Tatsuo

Classifications

• C25D5/54

  Electroplating of non-metallic surfaces (C25D7/12 takes precedence) · CPC title

• H01G4/232 Primary

  electrically connecting two or more layers of a stacked or rolled capacitor · CPC title

• H01G4/1227

  based on alkaline earth titanates · CPC title

• H01G4/30

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G4/2325

  characterised by the material of the terminals · CPC title