Projection lighting system for semiconductor lithography with an improved heat transfer

Patent metadata

Field	Value
Publication number	US-10969699-B2
Application number	US-201916541579-A
Country	US
Kind code	B2
Filing date	Aug 15, 2019
Priority date	Feb 20, 2017
Publication date	Apr 6, 2021
Grant date	Apr 6, 2021

Abstract

A projection exposure apparatus for semiconductor lithography has a connecting element for connecting a component of the apparatus to a supporting cooling structure of the apparatus. The connecting element has a receiving region for receiving the component, and the connecting element has a foot region for connecting the connecting element to the supporting cooling structure. At least one joint is arranged between the receiving and foot regions, and at least one heat conducting element is arranged between the receiving and foot regions. The heat conducting element is soft in the actuation direction of the joint and has a stiffness perpendicularly to the actuation direction of the joint that is at least twice as large as in the actuation direction of the joint.

First claim

What is claimed is:

1. An apparatus, comprising:
a component;
a supporting cooling structure; and
a connecting element comprising a joint and a heat conducting element,
wherein:
the connecting element connects the component to the supporting cooling structure;
the connecting element has a receiving region that receives the component;
the connecting element has a foot region connected to the supporting cooling structure;
the joint is between the receiving and foot regions;
the heat conducting element is between the receiving and foot regions;
the heat conducting element contacts the receiving region only in a first region;
the heat conducting element contacts the foot region only in a second region;
without a force applied to the heat conducting element:
a first straight line extends from the first region to the second region;
a second straight line is parallel to the first straight line;
the second straight line does not intersect the first region or the second region; and
the second straight line intersects the heat conducting element;

the heat conducting element has portions extending perpendicular to the connecting straight line; and
the apparatus is a semiconductor lithography projection exposure apparatus.

2. The apparatus of claim 1 , wherein the joint comprises a flexure.

3. The apparatus of claim 1 , wherein the joint and the heat conducting element are a single piece.

4. The apparatus of claim 1 , wherein the heat conducting element is a flat, angled element.

5. The apparatus of claim 1 , wherein the heat conducting element has portions extending obliquely relative to the connecting straight line.

6. The apparatus of claim 1 , wherein the heat conducting element comprises a central part and a leaf-spring-like portion, wherein the central part is connected to the leaf-spring-like portion.

7. The apparatus of claim 1 , wherein the connecting element is actuatable in more than one degree of freedom.

8. The apparatus of claim 7 , wherein the connecting element allows tilting about two axes.

9. The apparatus of claim 1 , wherein the optical component comprises a mirror.

10. The apparatus of claim 1 , wherein the optical component comprises a facet mirror.

11. The apparatus of claim 1 , wherein the optical component comprises a field facet mirror.

12. The apparatus of claim 1 , further comprising an illumination system, wherein the optical component is in the illumination system.

13. The apparatus of claim 12 , wherein the optical component comprises a facet mirror.

14. The apparatus of claim 12 , further comprising a projection optical unit.

15. The apparatus of claim 1 , wherein:
a stiffness of the joint in the direction perpendicular to the actuation direction of the joint is at least 50 times the stiffness of the heat conducting element in the direction perpendicular to the actuation direction of the joint; and
the joint comprises a flexure.

16. The apparatus of claim 1 , wherein:
a stiffness of the joint in the direction perpendicular to the actuation direction of the joint is at least 50 times the stiffness of the heat conducting element in the direction perpendicular to the actuation direction of the joint; and
the joint and the heat conducting element are a single piece.

17. An apparatus, comprising:
a component;
a supporting cooling structure; and
a connecting element comprising a joint and a heat conducting element,
wherein:
the connecting element connects the component to the supporting cooling structure;
the connecting element has a receiving region that receives the component;
the connecting element has a foot region connected to the supporting cooling structure;
the joint is between the receiving and foot regions;
the heat conducting element is between the receiving and foot regions;
the heat conducting element contacts the receiving region only in a first region;
the heat conducting element contacts the foot region only in a second region;
without a force applied to the heat conducting element:
a first straight line extends from the first region to the second region;
a second straight line is parallel to the first straight line;
the second straight line does not intersect the first region or the second region; and
the second straight line intersects the heat conducting element;

the apparatus is a semiconductor lithography projection exposure apparatus;
a stiffness of the heat conducting element in a direction perpendicular to an actuation direction of the joint is at least twice a stiffness of the heat conducting element in the actuation direction of the joint;
the joint and the heat conducting element are a single piece;
the heat conducting element has portions extending obliquely relative to the connecting straight line; and
the heat conducting element has portions extending perpendicular to the connecting straight line.

18. The apparatus of claim 17 , wherein a stiffness of the joint in a direction perpendicular to an actuation direction of the joint is at least 50 times the stiffness of the heat conducting element in a direction perpendicular to the actuation direction of the joint.

19. The apparatus of claim 17 , further comprising an illumination system, wherein the optical component is in the illumination system.

20. The apparatus of claim 19 , wherein the optical component comprises a facet mirror.

Assignees

• Zeiss Carl Smt Gmbh

Inventors

• Weber Ulrich
• Anderl Willi

Classifications

• G03F7/70891 Primary

  Temperature · CPC title

• G03F7/70825

  Mounting of individual elements, e.g. mounts, holders or supports (workpiece or mask holders G03F7/707) · CPC title

• G03F7/702

  Reflective illumination, i.e. reflective optical elements other than folding mirrors, e.g. extreme ultraviolet [EUV] illumination systems · CPC title

• G03F7/70875 Primary

  Temperature, e.g. temperature control of masks or workpieces via control of stage temperature · CPC title

• G03F7/70075

  Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection · CPC title