Film mask, method for manufacturing same, and method for forming pattern using film mask and pattern formed thereby

Patent metadata

Field	Value
Publication number	US-10969686-B2
Application number	US-201715776748-A
Country	US
Kind code	B2
Filing date	Jan 31, 2017
Priority date	Jan 27, 2016
Publication date	Apr 6, 2021
Grant date	Apr 6, 2021

Abstract

The present application relates to a film mask comprising: a transparent substrate; a darkened light-shielding pattern layer provided on the transparent substrate; and groove portions provided in a region where the darkened light-shielding pattern layer is not provided, a method for manufacturing the same, a method for forming a pattern by using the same, and a pattern manufactured by using the same.

First claim

The invention claimed is:

1. A film mask, comprising:
a transparent substrate;
a separate resin layer provided on the transparent substrate;
a light-shielding region that includes:
an aluminum metal layer provided on the resin layer; and
a darkened light-shielding pattern layer provided on the aluminum metal layer, the aluminum metal layer provided between the transparent substrate and the darkened light-shielding pattern layer;

a half tone region provided on the resin layer and that includes the darkened light-shielding pattern layer having a thickness that is different from a thickness of the darkened light-shielding pattern layer in the light-shielding region; and
groove portions formed in the separate resin layer provided in a region where no darkened light-shielding pattern layer is provided,
wherein the darkened light-shielding pattern layer comprises AlOxNy (0≤x≤1.5, 0≤y≤1, and x and y are a ratio of O atoms and N atoms to one Al atom, respectively).

2. The film mask of claim 1 , wherein the darkened light-shielding pattern layer has a reflectance of about 30% or less of light in a UV region range.

3. The film mask of claim 1 , further comprising:
at least one of a surface protective layer and a release force enhancement layer provided on the darkened light-shielding pattern layer and the groove portion.

4. The film mask of claim 1 , further comprising:
an attachment layer provided between the darkened light-shielding pattern layer and the transparent substrate.

5. The film mask of claim 1 , further comprising an attachment layer provided between the aluminum metal layer and the transparent substrate.

6. The film mask of claim 1 , wherein the substrate is a flexible plastic.

7. The film mask of claim 1 , wherein the substrate is a polyethylene terephthalate (PET) film.

8. A method for manufacturing the film mask according to claim 1 , the method comprising:
coating the separate resin layer on the transparent substrate;
forming groove portions in the separate resin layer;
forming the light-shielding region by:
providing the aluminum metal layer of a region where the groove portions are not provided; and
forming the darkened light-shielding pattern layer on the aluminum metal layer; and

forming the half tone region by providing on the resin layer the darkened light-shielding pattern layer having a thickness that is different from the thickness of the darkened light-shielding pattern layer in the light-shielding region,
wherein the darkened light-shielding pattern layer comprises AlOxNy (0≤x≤1.5, 0≤y≤1, and x and y are a ratio of O atoms and N atoms to one Al atom, respectively).

9. The method of claim 8 , wherein the forming of the groove portions comprises:
imprinting the separate resin using a master mold; and
exposing the separate resin to UV light for forming a groove portion.

10. A method for forming a pattern, comprising:
applying a photosensitive resin composition onto a substrate;
exposing the applied photosensitive resin composition to light through the film mask of claim 1 ; and
developing the photosensitive resin composition.

11. The method of claim 10 , wherein the photosensitive resin composition is selected that satisfies a relationship of [a refractive index of a mask<a refractive index of the photosensitive resin composition after curing>a refractive index of an uncured photosensitive resin composition].

Assignees

• Lg Chemical Ltd

Inventors

• Hwang Ji Young
• Seo Han Min
• Han Sangcholl
• Lee Seung Heon
• Oh Dong Hyun
• Seo Dae Han
• Bae Nam Seok
• Song Min Soo

Classifications

• H10P76/4085

  characterised by the processes involved to create the masks · CPC title

• H10P76/405

  characterised by their composition, e.g. multilayer masks · CPC title

• H10P76/40

  of masks comprising inorganic materials · CPC title

• G03F7/20 Primary

  Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title