Method of providing an imaging system and imaging system thereof
US-10446582-B2 · Oct 15, 2019 · US
US10969505B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10969505-B2 |
| Application number | US-201716471110-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 18, 2017 |
| Priority date | Dec 20, 2016 |
| Publication date | Apr 6, 2021 |
| Grant date | Apr 6, 2021 |
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A charged particle detector is provided. The charged particle detector includes a flexible semiconductor wafer, the semiconductor wafer being doped to form a p-n junction, and an amplifier coupled to the semiconductor wafer and configured to amplify a current or voltage across the p-n junction.
Opening claim text (preview).
The invention claimed is: 1. A charged particle detector comprising: a flexible semiconductor wafer, the semiconductor wafer being doped to form a p-n junction; an amplifier coupled to the semiconductor wafer and configured to amplify a current or voltage across the p-n junction; a layer of aluminium on each surface of the flexible semiconductor wafer, each layer of aluminium being of a thickness sufficient to exclude optical photons, and which is transparent to alpha particles; wherein the amplifier is coupled to the semiconductor wafer via the aluminium layers. 2. The charged particle detector according to claim 1 , wherein the flexible semiconductor wafer is mounted so as to provide a curved alpha particle detection surface. 3. The charged particle detector according to claim 2 , wherein the flexible semiconductor wafer is mounted to a pipe inspection gauge. 4. The charged particle detector according to claim 2 , wherein the flexible semiconductor wafer is mounted on an inner surface of a pipe. 5. The charged particle detector according to claim 1 , wherein the semiconductor wafer is a silicon wafer with a thickness of between 20 and 70 microns. 6. The charged particle detector according to claim 1 , wherein each aluminium layer is 200 nm thick. 7. The charged particle detector according to claim 1 , wherein at least one of the aluminium layers is subdivided into a plurality of pixels, each pixel being coupled to a different amplifier. 8. The charged particle detector according to claim 1 , wherein the flexible semiconductor wafer has a minimum radius of curvature less than 10 cm. 9. A neutron detector comprising a charged particle detector according to claim 1 , and a material which produces charged particles when exposed to neutron flux. 10. The neutron detector according to claim 9 , wherein the charged particles are alpha particles and the substance comprises boron-10. 11. The neutron detector according to claim 10 , wherein the material is boron oxide, the flexible semiconductor wafer comprises two flexible semiconductor sheets of different doping types, and the boron oxide is provided as an intrinsic region between the two flexible silicon sheets. 12. A pipe having a neutron detector according to claim 9 lining the outside of the pipe. 13. A pipe having a charged particle detector according to claim 1 lining the inside of the pipe.
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