Method of providing an imaging system and imaging system thereof

Patent metadata

Field	Value
Publication number	US-10446582-B2
Application number	US-201615334143-A
Country	US
Kind code	B2
Filing date	Oct 25, 2016
Priority date	Dec 22, 2014
Publication date	Oct 15, 2019
Grant date	Oct 15, 2019

Abstract

A method can include providing a scintillator structure. Providing the scintillator structure can include providing a scintillator support layer, providing a scintillator layer, and coupling the scintillator layer to the scintillator support layer. Meanwhile, the scintillator support layer has a substantially non-planar surface, the scintillator layer having a first surface and a second surface opposite the first surface and being configured to scintillate, and the first surface of the scintillator layer is coupled to the substantially non-planar surface of the scintillator support layer such that the second surface of the scintillator layer has a contour of the substantially non-planar surface of the scintillator support layer.

First claim

What is claimed is:

1. A method comprising:
providing a scintillator structure; and
after providing the scintillator structure, engaging an electronic device with the scintillator structure, wherein:
providing the scintillator structure comprises:
providing a scintillator support layer;
providing a scintillator layer; and
coupling the scintillator layer to the scintillator support layer;

the scintillator support layer comprises:
a first substantially non-planar surface;
a second substantially non-planar surface, the first substantially non-planar surface being approximately parallel to the second substantially non-planar surface; and
a scintillator support layer thickness greater than approximately 200 micrometers and less than or equal to approximately 300 micrometers;

the scintillator layer comprises:
a first surface;
a second surface opposite the first surface of the scintillator layer and being configured to scintillate; and
one or more granular phosphor materials comprising a diameter of greater than or equal to approximately 2 micrometers and less than or equal to approximately 30 micrometers;

the first surface of the scintillator layer is coupled to the second substantially non-planar surface of the scintillator support layer such that the second surface of the scintillator layer comprises a contour of the second substantially non-planar surface of the scintillator support layer;
the electronic device comprises a device substrate and one or more active sections;
the device substrate comprises a first surface and a second surface opposite the first surface of the device substrate;
the one or more active sections are at the second surface of the device substrate;
the second surface of the device substrate and the one or more active sections conform to the second surface of the scintillator layer of the scintillator structure; and
the device substrate comprises a device substrate thickness, the device substrate thickness being less than or equal to approximately 25 micrometers.

2. The method of claim 1 wherein:
coupling the scintillator layer to the scintillator support layer comprises at least one of:
depositing the scintillator layer over the scintillator support layer; or
bonding the scintillator layer to the scintillator support layer.

3. The method of claim 1 wherein:
providing the scintillator support layer comprises forming the scintillator support layer so the scintillator support layer comprises the first substantially non-planar surface and the second substantially non-planar surface.

4. The method of claim 3 wherein:
forming the scintillator support layer so the scintillator support layer comprises the first substantially non-planar surface and the second substantially non-planar surface occurs before the coupling the scintillator layer to the scintillator support layer.

5. The method of claim 3 wherein:
forming the scintillator support layer so the scintillator support layer comprises the first substantially non-planar surface and the second substantially non-planar surface comprises at least one of:
thermoforming the scintillator support layer so the scintillator support layer comprises the first substantially non-planar surface and the second substantially non-planar surface;
rotational molding the scintillator support layer so the scintillator support layer comprises the first substantially non-planar surface and the second substantially non-planar surface;
injection molding the scintillator support layer so the scintillator support layer comprises the first substantially non-planar surface and the second substantially non-planar surface;
blow molding the scintillator support layer so the scintillator support layer comprises the first substantially non-planar surface and the second substantially non-planar surface; or
extrusion molding the scintillator support layer so the scintillator support layer comprises the first substantially non-planar surface and the second substantially non-planar surface.

6. The method of claim 1 wherein:
coupling the scintillator layer to the scintillator support layer occurs before the scintillator support layer comprises the first substantially non-planar surface and the second substantially non-planar surface.

7. The method of claim 1 wherein:
the one or more granular phosphor materials comprise terbium doped gadolinium oxysulfide.

8. The method of claim 1 wherein:
the scintillator layer comprises a scintillator layer thickness greater than or equal to approximately 50 micrometers and less than approximately 100 micrometers.

9. The method of claim 1 wherein:
the first substantially non-planar surface and the second substantially non-planar surface comprise a non-planar manifold.

10. The method of claim 1 wherein:
the device substrate further comprises a flexible substrate;
each active section of the one or more active sections comprises at least one semiconductor device; and
each semiconductor device of the at least one semiconductor device comprises at least one detector pixel.

11. The method of claim 1 , wherein engaging the electronic device with the scintillator structure comprises:
coupling the electronic device to the scintillator structure.

12. The method of claim 11 wherein:
coupling the electronic device to the scintillator structure comprises bonding the electronic device to the scintillator structure.

13. The method of claim 1 wherein:
the device substrate comprises a device substrate material, and the device substrate material comprises polyimide.

14. The method of claim 1 wherein:
the one or more granular phosphor materials comprise terbium doped gadolinium oxysulfide; and
the scintillator support layer comprises one or more scintillator support layer materials, and the one or more scintillator support layer materials comprise at least one thermoplastic polymer.

15. The method of claim 1 wherein:
the first substantially non-planar surface and the second substantially non-planar surface comprise an ellipsoid.

16. The method of claim 1 wherein:
the first substantially non-planar surface and the second substantially non-planar surface comprise an elliptic cylinder.

17. The method of claim 1 wherein:
the first substantially non-planar surface and the second substantially non-planar surface comprise a prism.

18. A method comprising:
providing a scintillator structure;
providing an electronic device; and
after providing the scintillator structure, engaging the electronic device with the scintillator structure, wherein:
providing the scintillator structure comprises:
providing a scintillator support layer;
providing a scintillator layer; and
coupling the scintillator layer to the scintillator support layer;

the scintillator support layer comprises:
a substantially non-planar surface;
a test surface opposite and approximately parallel to the substantially non-planar surface; and
a scintillator support layer thickness greater than approximately 200 micrometers and less than or equal to approximately 300 micrometers;

the scintillator layer comprises:
a first surface;
a second surface opposite the first surface and being configured to scintillate; and
one or more granular phosphor materials comprising a diameter of greater than or equal to approximately 2 micrometers and less than or equal to approximately 30 micrometers;

the first surface of the scintillator layer is coupled to the substantially non-planar surface of the scintillator support layer such that the second surf

Assignees

• Smith Joseph
• Bottesch Rita
• Stowell John
• Univ Arizona State

Inventors

• Smith Joseph
• Bottesch Rita
• Stowell John

Classifications

• H10P72/7426

  used as a support during build up manufacturing of active devices · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P50/642

  Chemical etching · CPC title

• H10W70/692

  Ceramics or glasses · CPC title