LED module and LED lamp including the same

Patent metadata

Field	Value
Publication number	US-10964852-B2
Application number	US-201816223990-A
Country	US
Kind code	B2
Filing date	Dec 18, 2018
Priority date	Apr 24, 2018
Publication date	Mar 30, 2021
Grant date	Mar 30, 2021

Abstract

A light emitting diode (LED) module includes: a flexible substrate having a first surface on which a circuit pattern is disposed, and a second surface opposite the first surface; a plurality of light emitting diode (LED) chips mounted on the first surface of the flexible substrate, and electrically connected to the circuit pattern; an insulating reflective layer disposed on the first surface of the flexible substrate, and covering a portion of the circuit pattern; first and second connection terminals disposed at both ends of the flexible substrate, and connected to the circuit pattern; and a wavelength conversion layer covering the plurality of LED chips and surrounding the flexible substrate in a cross-sectional view.

First claim

What is claimed is:

1. A light emitting diode (LED) module comprising:
a flexible substrate having a first surface on which a circuit pattern is disposed, and a second surface opposite to the first surface;
a plurality of light emitting diode (LED) chips mounted on the first surface of the flexible substrate, and electrically connected to the circuit pattern;
an insulating reflective layer disposed on the first surface of the flexible substrate, and covering a portion of the circuit pattern;
first and second connection terminals disposed at both ends of the flexible substrate, and connected to the circuit pattern; and
a wavelength conversion layer covering the plurality of LED chips and surrounding the flexible substrate in a cross-sectional view,
wherein the circuit pattern comprises a pad region connected to one of the plurality of LED chips, a connection pattern connected to the pad region, and a dummy pattern protruding from the connection pattern.

2. The LED module of claim 1 , wherein the insulating reflective layer is disposed in a region of an upper surface of the flexible substrate, excluding regions adjacent to both edges of the upper surface of the flexible substrate.

3. The LED module of claim 1 , wherein the insulating reflective layer is disposed to surround a periphery of each of the plurality of LED chips.

4. The LED module of claim 1 , wherein the insulating reflective layer comprises a plurality of discrete patterns spaced apart from each other in a longitudinal direction of the flexible substrate, and
wherein the wavelength conversion layer contacts an upper surface and a bottom surface of the flexible substrate.

5. The LED module of claim 4 , wherein each of the plurality of discrete patterns has a T-shape or an I-shape.

6. The LED module of claim 1 , wherein the insulating reflective layer covers the circuit pattern including at least a portion of the dummy pattern and excluding the pad region.

7. The LED module of claim 1 , wherein the circuit pattern comprises a copper layer, and a tin (Sn) layer formed on the copper layer.

8. The LED module of claim 1 , wherein the insulating reflective layer comprises a white-photo solder resist.

9. The LED module of claim 1 , wherein the insulating reflective layer comprises a resin containing a white ceramic powder.

10. The LED module of claim 9 , wherein the white ceramic powder comprises at least one selected from TiO 2 , Al 2 O 3 , Nb 2 O 5 , and ZnO.

11. A light emitting diode (LED) module comprising:
a flexible substrate having first and second surfaces opposite to each other, the flexible substrate having an elongated shape;
a circuit pattern disposed on the first surface of the flexible substrate, and having a pad region, a connection pattern connected to the pad region, and a dummy pattern protruding from the connection pattern;
a plurality of LED chips disposed on the first surface of the flexible substrate, each of the plurality of LED chips electrically connected to the pad region of the circuit pattern;
an insulating reflective layer mounted on the first surface of the flexible substrate, and covering a portion of the circuit pattern;
first and second connection terminals disposed at both ends of the flexible substrate, and connected to the circuit pattern; and
a wavelength conversion layer covering the plurality of LED chips and surrounding the flexible substrate in a cross-sectional view.

12. The LED module according to claim 11 , wherein the insulating reflective layer covers a region of the circuit pattern including at least a portion of the dummy pattern, and excluding the pad region.

13. The LED module according to claim 12 , wherein the insulating reflective layer comprises a plurality of discrete patterns spaced apart from each other in a longitudinal direction of the flexible substrate.

14. The LED module according to claim 13 , wherein each of the plurality of discrete patterns have a T-shape or an I-shape.

15. The LED module according to claim 11 , wherein the insulating reflective layer is disposed to surround a periphery of each of the plurality of LED chips in a region of an upper surface of the flexible substrate, excluding regions adjacent to both edges of the upper surface of the flexible substrate.

16. The LED module according to claim 11 , wherein the insulating reflective layer comprises a sheet including a white photo-solder resist or white ceramic powder, and an adhesive layer disposed on a lower surface of the sheet.

17. The LED module according to claim 11 , wherein the wavelength conversion layer has a first wavelength conversion layer disposed on the first surface of the flexible substrate, and a second wavelength conversion layer disposed on the second surface of the flexible substrate.

18. The LED module according to claim 17 , wherein the wavelength conversion layer comprises a transparent resin and at least one wavelength conversion material,
wherein the at least one wavelength conversion material is mixed with the transparent resin, and
wherein a content ratio of a wavelength conversion material to the transparent resin in the first wavelength conversion layer is greater than a content ratio of a wavelength conversion material to the transparent resin in the second wavelength conversion layer.

19. A light emitting diode (LED) module comprising:
a flexible substrate having first and second surfaces opposite to each other, the flexible substrate having an elongated shape;
a circuit pattern disposed on the first surface of the flexible substrate;
a plurality of LED chips disposed on the first surface of the flexible substrate, and the plurality of LED chips electrically connected to the circuit pattern;
an insulating reflective layer comprising a plurality of discrete patterns arranged on the first surface of the flexible substrate to be spaced apart from each other in a longitudinal direction of the flexible substrate, the insulating reflective layer covering a portion of the circuit pattern;
first and second connection terminals respectively disposed at both ends of the flexible substrate, and the first and second connection terminals electrically connected to the circuit pattern; and
a wavelength conversion layer covering the plurality of LED chips and surrounding the flexible substrate in a cross-sectional view.

Assignees

• Samsung Electronics Co Ltd

Inventors

• You Jae Sung
• Paek Ho Sun
• Song Ho Young
• Lee Jun Bum

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H20/851

  Wavelength conversion means · CPC title

• H10H20/832

  characterised by their material · CPC title

• H10H20/822

  Materials of the light-emitting regions · CPC title

• H10H20/814

  having reflecting means, e.g. semiconductor Bragg reflectors · CPC title