Techniques for fluid cooling of integrated circuits in packages

Patent metadata

Field	Value
Publication number	US-10964624-B2
Application number	US-201715416589-A
Country	US
Kind code	B2
Filing date	Jan 26, 2017
Priority date	Jan 26, 2017
Publication date	Mar 30, 2021
Grant date	Mar 30, 2021

Abstract

A method is provided for removing heat from an integrated circuit package. Fluid coolant is provided from a fluid inlet of a fluid routing device through channels in the fluid routing device to absorb heat generated by first and second integrated circuit dies in the integrated circuit package. The fluid routing device is mounted on a surface of each of the first and second integrated circuit dies. The fluid coolant is provided from the channels to a fluid outlet of the fluid routing device. A flow of the fluid coolant through the fluid routing device is adjusted to reduce a temperature of the first integrated circuit die in response to an increase in a workload of the first integrated circuit die.

First claim

What is claimed is:

1. A method for removing heat from an integrated circuit package, the method comprising:
providing fluid coolant from a fluid inlet of a fluid routing device through first vertical channels in the fluid routing device and then through a first horizontal channel in the fluid routing device to absorb heat generated by a first integrated circuit die in the integrated circuit package, wherein the first horizontal channel is over the first integrated circuit die, and wherein the fluid coolant from the first vertical channels flows horizontally through the first horizontal channel directly over a surface of the first integrated circuit die;
providing the fluid coolant from the first horizontal channel through second vertical channels in the fluid routing device to a second horizontal channel in the fluid routing device;
providing the fluid coolant from the fluid inlet through third vertical channels in the fluid routing device and then through a third horizontal channel in the fluid routing device to absorb heat generated by a second integrated circuit die in the integrated circuit package, wherein the third horizontal channel is over the second integrated circuit die;
providing the fluid coolant from the third horizontal channel through fourth vertical channels in the fluid routing device to the second horizontal channel without causing the fluid coolant from the third horizontal channel to flow through the first horizontal channel; and
providing the fluid coolant from the second horizontal channel to a fluid outlet of the fluid routing device.

2. The method of claim 1 further comprising:
adjusting a flow of the fluid coolant through the fluid routing device to reduce a temperature of the first integrated circuit die in response to signals sent through a signal path from the first integrated circuit die and received at a controller that indicate an increase in a data rate of data being sent to and from the first integrated circuit die.

3. The method of claim 2 , wherein adjusting the flow of the fluid coolant through the fluid routing device to reduce the temperature of the first integrated circuit die in response to the signals sent through the signal path from the first integrated circuit die and received at the controller that indicate an increase in the data rate of the data being sent to and from the first integrated circuit die further comprises:
adjusting a flow rate or pressure of the fluid coolant provided through the fluid routing device using a pump in response to an increase in the data rate of the data being sent to and from the first integrated circuit die.

4. The method of claim 2 , wherein adjusting the flow of the fluid coolant through the fluid routing device to reduce the temperature of the first integrated circuit die in response to the signals sent through the signal path from the first integrated circuit die and received at the controller that indicate an increase in the data rate of the data being sent to and from the first integrated circuit die further comprises:
changing a direction of the flow of the fluid coolant through the fluid routing device using a pump in response to an increase in the data rate of the data being sent to and from the first integrated circuit die to cause a port of the fluid routing device previously used as the fluid outlet to be used as the fluid inlet for the fluid coolant.

5. The method of claim 4 , wherein the direction of the flow of the fluid coolant through the fluid routing device is changed in response to the controller receiving an indication that the data rate of the data being sent to and from the first integrated circuit die has increased above a threshold, and wherein the first integrated circuit die is adjacent to the port.

6. The method of claim 2 , wherein the first integrated circuit die is a memory integrated circuit die, and wherein the controller monitors a bandwidth of the memory integrated circuit die based on the data rate of the data as indicated by the signals sent through the signal path.

7. The method of claim 2 , wherein adjusting the flow of the fluid coolant through the fluid routing device to reduce the temperature of the first integrated circuit die further comprises adjusting the flow of the fluid coolant through the fluid routing device to reduce the temperature of the first integrated circuit die in response to the signals sent through the signal path from the first integrated circuit die without using a temperature sensor that senses a temperature of the first integrated circuit die.

8. The method of claim 1 , wherein the second horizontal channel is oriented to provide the fluid coolant to the fluid outlet without the fluid coolant in the second horizontal channel flowing directly over the first integrated circuit die or the second integrated circuit die.

9. The method of claim 1 , wherein the fluid coolant from the third vertical channels flows horizontally through the third horizontal channel directly over a surface of the second integrated circuit die.

10. A method for cooling a memory integrated circuit die and a second integrated circuit die in an integrated circuit package, the method comprising:
providing fluid coolant from a fluid inlet of a fluid routing device through first vertical channels in the fluid routing device and then through a first horizontal channel in the fluid routing device to absorb heat from the memory integrated circuit die in the integrated circuit package, wherein the first horizontal channel is above the memory integrated circuit die, and wherein the fluid coolant from the first vertical channels flows horizontally through the first horizontal channel directly over a surface of the memory integrated circuit die;
providing the fluid coolant from the first horizontal channel through second vertical channels in the fluid routing device to a second horizontal channel in the fluid routing device;
providing the fluid coolant from the fluid inlet through third vertical channels in the fluid routing device and then through a third horizontal channel in the fluid routing device to absorb heat from the second integrated circuit die in the integrated circuit package, wherein the third horizontal channel is above the second integrated circuit die;
providing the fluid coolant from the third horizontal channel through fourth vertical channels in the fluid routing device to the second horizontal channel without allowing the fluid coolant from the third horizontal channel to flow through the first horizontal channel; and
providing the fluid coolant through the second horizontal channel to a fluid outlet of the fluid routing device.

11. The method of claim 10 further comprising:
adjusting the flow of the fluid coolant through the fluid routing device using a pump by adjusting a flow rate or pressure of the fluid coolant provided to the fluid routing device using the pump.

12. The method of claim 11 , wherein adjusting a flow rate or pressure of the fluid coolant provided to the fluid routing device using the pump further comprises:
decreasing the flow rate or the pressure of the fluid coolant in the fluid routing device in response to signals indicating that a data rate of data being sent to and from the memory integrated circuit die has decreased.

13. The method of claim 11 , wherein adjusting a flow rate or pressure of the fluid coolant provided to the fluid routing device using the pump further comprises:
increasing the flow rate or the pressure of the fluid coolant in the fluid routing device in response to signals indicating that a data rate of data being sent to and from the memory integrated circuit die has increased.

Assignees

• Intel Corp

Inventors

• Gutala Ravi
• Dasu Aravind

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W40/47 Primary

  by flowing liquids, e.g. forced water cooling · CPC title

• G11C7/04

  with means for avoiding disturbances due to temperature effects · CPC title