Superhydrophobic surface arrangement, article compromising same and method of manufacture thereof

US10961629B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10961629-B2
Application numberUS-201816233325-A
CountryUS
Kind codeB2
Filing dateDec 27, 2018
Priority dateJan 27, 2015
Publication dateMar 30, 2021
Grant dateMar 30, 2021

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention is concerned with a superhydrophobic surface arrangement, an article having the same and a method of making same. The arrangement is configured for generating, upon contact by water droplets, pancaking bouncing and reducing liquid contact time. The arrangement has an array of posts residing on a surface and extending from the surface, said posts having an elongate configuration with a base portion at one end and an upper portion at an opposite end. By way of the configuration of the posts and the Weber number the surface arrangement in use pancake bouncing of liquid droplets and reduction of contact time of the liquid droplets are effected.

First claim

Opening claim text (preview).

The invention claimed is: 1. A superhydrophobic surface arrangement for generating, upon contact by water droplets, pancaking bouncing and reducing liquid contact time, consisting of an array of posts residing on a surface and extending from the surface, said posts having an elongate configuration with a base portion at one end and an upper portion at an opposite end, wherein: said posts have a height from 1 to 2 mm; a center to center distance of two adjacent said posts is from 0.1 to 0.4 mm; spacing of said two adjacent posts is from 0.05 to 0.3 mm; said posts have a base with a width or diameter of 0.05 to 0.2 mm; said posts have atop with a width or diameter of 0.02 to 0.2 mm; said surface arrangement has a Weber number with respect to water droplets of 12.6 to 80; and said posts have a profile selected from a straight post or a conical post profile wherein by way of the dimensions of said posts and the configuration of the straight or conical profile of said posts and the Weber number, the surface arrangement in use pancake bouncing of liquid droplets and reduction of contact time of the liquid droplets are effected. 2. An arrangement as claimed in claim 1 , wherein when said posts have the straight profile, the posts are in the form of a square column. 3. An arrangement as claimed in claim 2 , wherein when said posts have the conical profile, top ends of the posts have a truncated profile with a substantially flat top. 4. A substrate comprising a superhydrophobic arrangement as claimed in claim 1 . 5. A method of manufacture a substrate as claimed in claim 4 , comprising steps of forming said posts by wire cutting and cyclic chemical etching. 6. A method as claimed in claim 5 , wherein said posts are formed from cooper or copper wire.

Assignees

Inventors

Classifications

  • B08B17/065Primary

    the surface having a microscopic surface pattern to achieve the same effect as a lotus flower · CPC title

  • Producing external conical surfaces or spikes (B23H9/08 takes precedence) · CPC title

  • for etching copper or alloys thereof · CPC title

  • Other heavy metals · CPC title

  • macromolecular (C09D7/41-C09D7/48 take precedence) · CPC title

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Frequently asked questions

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What does patent US10961629B2 cover?
The present invention is concerned with a superhydrophobic surface arrangement, an article having the same and a method of making same. The arrangement is configured for generating, upon contact by water droplets, pancaking bouncing and reducing liquid contact time. The arrangement has an array of posts residing on a surface and extending from the surface, said posts having an elongate configur…
Who is the assignee on this patent?
Univ City Hong Kong
What technology area does this patent fall under?
Primary CPC classification B08B17/065. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 30 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).