Metal-clad laminate, circuit board, and multilayer circuit board

Patent metadata

Field	Value
Publication number	US-10959330-B2
Application number	US-201916526243-A
Country	US
Kind code	B2
Filing date	Jul 30, 2019
Priority date	Mar 6, 2017
Publication date	Mar 23, 2021
Grant date	Mar 23, 2021

Abstract

A metal-clad laminate that includes a metal foil with low surface roughness and in which the adhesion strength between a liquid crystal polymer film and the metal foil is high, the low transmission loss in a high frequency region is low, and the problems associated with warpage and adhesive leakage are alleviated. The metal-clad laminate includes the liquid crystal polymer film, an adhesive layer, and the metal foil, with the adhesive layer and the metal foil stacked on one surface of the liquid crystal polymer film.

First claim

The invention claimed is:

1. A metal-clad laminate comprising:
a liquid crystal polymer film;
an adhesive layer disposed on the liquid crystal polymer film, with the adhesive layer having:
a thickness of 0.5 μm or more and 4.0 μm or less,
a dynamic magnification of at least 1.15, and
a loss tangent of 0.16 or less at a strain of 0.06% under periodic strain at 1 Hz, and

a metal foil disposed on the adhesive layer and having a surface in contact with the adhesive layer having roughness height of 0.4 μm or less.

2. The metal-clad laminate according to claim 1 , wherein the adhesive layer has a relative permittivity of 3.0 or less and a dielectric dissipation factor of 0.008 or less.

3. The metal-clad laminate according to claim 1 , wherein the adhesive layer comprises a main agent and a curable resin.

4. The metal-clad laminate according to claim 3 , wherein the main agent is a carboxy group-containing styrene-based elastomer.

5. The metal-clad laminate according to claim 4 , wherein the curable resin is an epoxy resin.

6. The metal-clad laminate according to claim 1 , wherein the liquid crystal polymer film has a thickness of 5 μm or more and 130 μm or less.

7. The metal-clad laminate according to claim 1 , wherein the metal foil has a thickness of 5 μm or more and 40 μm or less.

8. A circuit board comprising:
a metal-clad laminate that includes;
a liquid crystal polymer film;
an adhesive layer disposed on the liquid crystal polymer film, with the adhesive layer having:
a thickness of 0.5 μm or more and 4.0 μm or less,
a dynamic magnification of at least 1.15, and
a loss tangent of 0.16 or less at a strain of 0.06% under periodic strain at 1 Hz, and

a metal foil disposed on the adhesive layer and having a surface in contact with the adhesive layer having roughness height of 0.4 μm or less; and

a circuit disposed in the metal foil of the metal-clad laminate.

9. A multilayer circuit board comprising two or more of the circuit boards according to claim 8 , wherein the circuit boards are stacked on top of each other.

10. The multilayer circuit board according to claim 9 , comprising at least one via connecting the stacked circuits boards.

11. The multilayer circuit board according to claim 8 , further comprising an electronic device that is mounted on each circuit.

12. The multilayer circuit board according to claim 9 , further comprising an electronic device that is mounted on each circuit.

13. The multilayer circuit board according to claim 8 , wherein the adhesive layer has a relative permittivity of 3.0 or less and a dielectric dissipation factor of 0.008 or less.

14. The multilayer circuit board according to claim 8 , wherein the adhesive layer comprises a main agent and a curable resin, and the main agent is a carboxy group-containing styrene-based elastomer.

15. The multilayer circuit board according to claim 14 , wherein the curable resin is an epoxy resin.

16. The multilayer circuit board according to claim 8 , wherein the liquid crystal polymer film has a thickness of 5 μm or more and 130 μm or less.

17. The multilayer circuit board according to claim 8 , wherein the metal foil has a thickness of 5 μm or more and 40 μm or less.

18. An electronic component comprising:
a multilayer circuit board, with each circuit board including:
a metal-clad laminate that includes a liquid crystal polymer film, an adhesive layer, and a metal foil stacked on the adhesive layer,
wherein the adhesive layer includes a thickness of 0.5 μm or more and 4.0 μm or less, a dynamic magnification of at least 1.15, and a loss tangent of 0.16 or less at a strain of 0.06% under periodic strain at 1 Hz,
wherein the metal foil has a surface in contact with the adhesive layer with roughness height of 0.4 μm or less, and
wherein a circuit is disposed in the metal foil of the metal-clad laminate; and

a mother board with the multilayer circuit board mounted on the mother board.

19. The electronic component according to claim 18 , wherein the multilayer circuit board comprises at least one via connecting the stacked circuits boards.

20. The electronic component according to claim 18 , wherein an electronic device is mounted on each circuit of each circuit board in the multilayer circuit board.

Assignees

• Murata Manufacturing Co

Inventors

• Ohashi Kazuhiko
• Fukutake Sunao
• Eda Takeshi

Classifications

• H05K3/4626

  characterised by the insulating layers or materials (H05K3/4688 takes precedence) · CPC title

• H05K3/386

  by the use of an organic polymeric bonding layer, e.g. adhesive · CPC title

• B32B15/092

  comprising epoxy resins · CPC title

• H05K2201/0195

  Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure · CPC title

• B32B2264/108

  Carbon, e.g. graphite particles · CPC title