Method for operating an integrated MEMS microphone device and integrated MEMS microphone device

Patent metadata

Field	Value
Publication number	US-10959002-B2
Application number	US-201816629679-A
Country	US
Kind code	B2
Filing date	Jul 3, 2018
Priority date	Jul 14, 2017
Publication date	Mar 23, 2021
Grant date	Mar 23, 2021

Abstract

A method for operating an integrated MEMS microphone device is proposed. The integrated MEMS microphone device comprises a package housing enclosing an interior cavity, wherein an integrated MEMS microphone die with a movable membrane, at least one environmental sensor and a thermal decoupling circuit are arranged inside the cavity. The method comprising the steps of repeatedly operating the environmental sensor in a measurement mode and activating the thermal decoupling circuit for a transition phase preceding and/or succeeding the measurement mode of the environmental sensor. During the transition phase a heat dissipation into the cavity is gradually adjusted.

First claim

The invention claimed is:

1. A method for operating an integrated MEMS (Microelectromechanical systems) microphone device comprising a package housing enclosing an interior cavity, wherein an integrated MEMS microphone die with a movable membrane, at least one environmental sensor and a thermal decoupling circuit are arranged inside the cavity, the method comprising:
repeatedly operating the environmental sensor in a measurement mode;
activating the thermal decoupling circuit for a transition phase preceding and/or succeeding the measurement mode of the environmental sensor; and
during the transition phase, gradually adjusting a heat dissipation into the cavity, wherein the heat dissipation is adjusted by the thermal decoupling circuit depending on a transition function with a characteristic time constant.

2. The method according to claim 1 , wherein
in the measurement mode, the environmental sensor is operated at an operating condition defining a first level of heat dissipation into the cavity; and wherein:
in the transition phase preceding the measurement mode, the heat dissipation is gradually adjusted to reach the first level, and/or
in the transition phase succeeding the measurement mode, the heat dissipation is adjusted to drop below the first level.

3. The method according to claim 1 , wherein the transition function is arranged such that a pressure change due to adjusting the heat dissipation inside the cavity induces a vibration frequency in the movable membrane which is inaudible to a human, for example, a vibration frequency which is smaller than 50 Hz or which is smaller than 20 Hz.

4. The method according to claim 1 , wherein
the transition function for the transition phase preceding the measurement mode increases as a function of time, and/or
the transition function for the transition phase succeeding the measurement mode decreases as a function of time.

5. The method according to claim 1 , wherein
the measurement mode is initiated by switching the environmental sensor on, and/or
the measurement mode is terminated by switching the environmental sensor off.

6. The method according to claim 5 , wherein
heat dissipation meets the first level when the measurement mode is initiated, and/or
heat dissipation drops from the first level when the measurement mode is terminated.

7. The method according to claim 5 , wherein
the thermal decoupling circuit is switched on when the measurement mode is initiated, and/or
the thermal decoupling circuit is switched off when the measurement mode is terminated.

8. The method according to claim 6 , wherein the thermal decoupling circuit comprises an adjustable current source or an adjustable current sink to dissipate heat into the cavity and the thermal decoupling circuit is separate from the environmental sensor, and wherein:
a dissipation current of the thermal decoupling circuit is adjusted depending on the transition function, and wherein
in the transition phase preceding the measurement mode, the dissipation current is adjusted until it meets an operating current, wherein the operating current is defined by the operating condition of the measurement mode, and/or
in the transition phase succeeding the measurement mode, the dissipation current is adjusted to drop from operating current.

9. The method according to claim 5 , wherein the thermal decoupling circuit is comprised by the environmental sensor and remains switched on in the measurement mode.

10. The method according to claim 9 , wherein
in the transition phase preceding the measurement mode, an operating current is increased until the operating current reaches a value defined by the operating condition of the measurement mode, and/or
in the transition phase succeeding the measurement mode, the operating current is decreased until the environmental sensor is off.

11. An integrated MEMS (Microelectromechanical systems) microphone device, comprising:
a package housing enclosing a cavity;
an integrated MEMS microphone die arranged inside the cavity, wherein the MEMS microphone die comprises a movable membrane;
at least one environmental sensor arranged inside the cavity, wherein the environmental sensor is configured to be activated in a measurement mode; and
a thermal decoupling circuit arranged inside the cavity, wherein the thermal decoupling circuit can be activated in a transition phase preceding and/or succeeding the measurement mode, and wherein the thermal decoupling circuit is configured to gradually dissipate power in the transition phase depending on a transition function with a characteristic time constant.

12. The device according to claim 11 , wherein the thermal decoupling circuit is separate from the environmental sensor and comprises at least one of:
one or more adjustable current sources to dissipate heat into the cavity,
one or more adjustable current sinks to dissipate heat into the cavity,
one or more a digitally adjustable analog-to-digital converters
one or more a digitally adjustable current analog-to-converters.

13. The device according to claim 11 , wherein the thermal decoupling circuit is integrated into the integrated MEMS (Microelectromechanical systems) microphone die and/or the environmental sensor.

14. The device according to claim 11 , wherein the environmental sensor comprising at least one of:
a temperature sensor,
a pressure sensor,
a humidity sensor,
a gas sensor and/or
an air quality sensor.

15. A method for operating an integrated MEMS (Microelectromechanical systems) microphone device comprising a package housing enclosing an interior cavity, wherein an integrated MEMS microphone die with a movable membrane, at least one environmental sensor and a thermal decoupling circuit are arranged inside the cavity, the method comprising:
repeatedly operating the environmental sensor in a measurement mode;
activating the thermal decoupling circuit for a transition phase preceding and/or succeeding the measurement mode of the environmental sensor; and
during the transition phase, gradually adjusting of temperature inside the cavity due to the flow of electrical current through the thermal decoupling circuit; wherein:
the measurement mode is initiated by switching the environmental sensor on, and/or
the measurement mode is terminated by switching the environmental sensor off,
heat dissipation due to the flow of electrical current through the thermal decoupling circuit meets a first level when the measurement mode is initiated, and/or
heat dissipation drops from the first level when the measurement mode is terminated, and
the thermal decoupling circuit comprises an adjustable current source or an adjustable current sink to dissipate heat into the cavity and the thermal decoupling circuit is separate from the environmental sensor, and wherein:
a dissipation current of the thermal decoupling circuit is adjusted depending on a transition function with a characteristic time constant, and wherein
in the transition phase preceding the measurement mode, the dissipation current is adjusted until it meets an operating current, wherein the operating current is defined by the operating condition of the measurement mode, and/or
in the transition phase succeeding the measurement mode, the dissipation current is adjusted to drop from operating current.

16. An integrated MEMS (Microelectromechanical systems) microphone device, comprising:
a package housing enclosing a cavity;
an integrated MEMS microphone die arranged inside the cavity, wherein the MEMS microphone die comprises a movable membrane;
at least one enviro

Assignees

• Ams Ag

Inventors

• Nishimura Naoaki

Classifications

• H04R1/021

  incorporating only one transducer · CPC title

• B81B2201/0257

  Microphones or microspeakers · CPC title

• H04R3/007 Primary

  Protection circuits for transducers · CPC title

• H04R2410/03

  Reduction of intrinsic noise in microphones · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title