Short pulse fiber laser for LTPS crystallization

Patent metadata

Field	Value
Publication number	US-10957541-B2
Application number	US-201916598210-A
Country	US
Kind code	B2
Filing date	Oct 10, 2019
Priority date	Dec 31, 2012
Publication date	Mar 23, 2021
Grant date	Mar 23, 2021

Abstract

Laser pulses from pulsed fiber lasers are directed to an amorphous silicon layer to produce a polysilicon layer comprising a disordered arrangement of crystalline regions by repeated melting and recrystallization. Laser pulse durations of about 0.5 to 5 ns at wavelength range between about 500 nm and 1000 nm, at repetition rates of 10 kHz to 10 MHz can be used. Line beam intensity uniformity can be improved by spectrally broadening the laser pulses by Raman scattering in a multimode fiber or by applying varying phase delays to different portions of a beam formed with the laser pulses to reduce beam coherence.

First claim

We claim:

1. A laser annealing system, comprising:
a pulsed laser configured to provide laser pulses of pulse durations less than 10 ns at a repetition rate of between 10 kHz and 1 MHz;
an optical system configured to receive the laser pulses and produce a line beam; and
a scanning assembly configured so that the line beam and a substrate move with respect to each other so that the line beam is scanned across a substrate surface, wherein a line beam area is selected so that the repetitive laser pulses produce repetitive melting of an a-Si layer on the substrate surface that produces a processed silicon layer with a mobility of at least about 5 cm 2 /V-sec.

2. The laser annealing system of claim 1 , wherein the laser pulses have durations of between about 0.5 and 2 ns, the pulse repetition rate is between 70 and 120 kHz, a pulse wavelength spectrum between about 500 nm and 1000 nm, and the pulse energy is between about 10 and 100 μJ.

3. The laser annealing system of claim 2 , further comprising a laser pulse spectrum enhancer configured to receive the laser pulses and produce spectrally broadened pulses based on Raman scattering.

4. The laser annealing system of claim 2 , wherein the laser spectrum enhancer includes a multimode fiber configured to provide Raman scattering.

5. The laser annealing system of claim 1 , further comprising a stepped mirror assembly that includes at least two reflective surfaces configured to provide a phase delay between different laser pulse portions, wherein the phase delay is based on a reflective surface separation.

6. The laser annealing system of claim 5 , wherein the phase delay corresponds to a reflective surface separation of at least 10 mm.

7. The laser annealing system of claim 3 , wherein the phase delay corresponds to a reflective surface separation of at least 40 mm.

8. A method of processing a silicon layer, comprising:
exposing the silicon layer to a plurality of laser pulses with a wavelength spectrum between about 500 nm and 1000 nm to form substantially randomly oriented crystalline silicon grains having dimensions of between about 200 nm and 500 nm and a mobility of at least 50 cm 2 /V-s; and
processing the exposed silicon layer to define thin film transistors;
wherein the plurality of laser pulses comprise laser pulses of pulse durations less than 10 ns at a repetition rate of between 10 kHz and 1 MHz.

9. The method of claim 8 , wherein the laser pulses are produced with a pulsed fiber laser that produces laser pulses having a duration of between about 0.5 ns and 5 ns, and the laser pulses are subjected to Raman scattering to produce spectrally enhanced pulses prior to exposing the silicon layer.

10. An active matrix display, comprising an active matrix that includes a silicon layer processed as recited in claim 8 .

11. The laser annealing system of claim 1 , wherein the pulse durations are less than about 10 ns.

12. The laser annealing system of claim 1 , wherein the repetitively melted a-Si layer corresponds to a processed silicon layer having a mobility of at least about 50 cm 2 /V-sec.

13. The laser annealing system of claim 1 , wherein the repetitively melted a-Si layer corresponds to a processed silicon layer having a mobility of at least about 100 cm 2 /V-sec.

14. The laser annealing system of claim 1 , wherein the repetitively melted a-Si layer corresponds to a processed silicon layer having silicon crystal grains having an average grain size of between about 200 nm and 500 nm.

15. The laser annealing system of claim 1 , wherein the repetitively melted a-Si layer corresponds to a processed silicon layer comprising unoriented silicon crystal grains having a grain size of between about 200 nm and 500 nm.

16. The laser annealing system of claim 15 , wherein the substrate includes a transparent support having an a-Si layer on at least one surface.

17. The laser annealing system of claim 1 , wherein scanning assembly is configured to scan the line beam such that an effective fluence at the substrate surface is between about 20 mJ/cm 2 and 200 mJ/cm 2 .

18. The laser annealing system of claim 3 , wherein the laser pulse spectrum enhancer is configured to frequency shift at least about 10% of the pulse energy of the received laser pulses through Raman scattering.

19. The laser annealing system of claim 18 , wherein the laser pulse spectrum enhancer is configured to frequency shift at least about 25% of the pulse energy of the received laser pulses through Raman scattering.

20. A laser annealing system, comprising:
a pulsed laser configured to provide laser pulses of pulse durations less than 10 ns at a repetition rate of between 10 kHz and 10 MHz;
an optical system configured to receive the laser pulses and produce a line beam;
a scanning assembly configured so that the line beam and a substrate move with respect to each other so that the line beam is scanned across a substrate surface, wherein a line beam area is selected so that the repetitive laser pulses produce repetitive melting of an a-Si layer on the substrate surface; and
a stepped mirror assembly that includes at least two reflective surfaces configured to provide a phase delay between different laser pulse portions, wherein the phase delay is based on a reflective surface separation.

Assignees

• Nlight Inc

Inventors

• Martinsen Robert J
• Karlsen Scott R
• Gross Ken

Classifications

• H10P14/3816

  Pulsed laser beam · CPC title

• H10P14/3411

  Silicon, silicon germanium or germanium · CPC title

• H10P34/42 Primary

  with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) · CPC title

• B23K26/0624

  using ultrashort pulses, i.e. pulses of 1 ns or less · CPC title

• B23K26/0006

  taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence) · CPC title