Microchannel plate and electron multiplier
US-10340129-B2 · Jul 2, 2019 · US
US10957522B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10957522-B2 |
| Application number | US-201916661184-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 23, 2019 |
| Priority date | Aug 31, 2016 |
| Publication date | Mar 23, 2021 |
| Grant date | Mar 23, 2021 |
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An electron multiplier production method including a main body portion, and a channel provided in the main body portion to open at one end surface and the other end surface of the main body portion and emits secondary electrons includes a first step of preparing a main body member including the one end surface and the other end surface, a communicating hole for the channel through which the one end surface and the other end surface communicate being provided in the main body member, a second step of forming the channel by forming a deposition layer including at least a resistive layer on an outer surface of the main body member and an inner surface of the communicating hole using an atomic layer deposition method, and a third step of forming the main body portion by removing the deposition layer formed on the outer surface of the main body member.
Opening claim text (preview).
The invention claimed is: 1. An electron multiplier comprising: a main body portion including one end surface, the other end surface, and a side surface connecting the one end surface to the other end surface; and a channel provided in the main body portion to be open at the one end surface and the other end surface, wherein the channel includes a deposition layer including a resistive layer and a secondary electron multiplication layer formed on an inner surface of a communicating hole for the channel, the deposition layer is formed on the one end surface and the other end surface, a heat sink is thermally connected to the main body portion through an insulating layer provided with the side surface, and the deposition layer is formed using an atomic layer deposition method. 2. The electron multiplier according to claim 1 , wherein the heat sink is formed of a metal. 3. The electron multiplier according to claim 1 , wherein the main body portion is formed of an insulating material. 4. The electron multiplier according to claim 1 , wherein the insulating layer is a secondary electron multiplication layer, and a material of the secondary electron multiplication layer is Al 2 O 3 , or MgO.
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