Cleaning solution comprising an ether acetate for preventing pattern collapse
US-8957006-B2 · Feb 17, 2015 · US
US10954480B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10954480-B2 |
| Application number | US-201816141735-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 25, 2018 |
| Priority date | Sep 29, 2017 |
| Publication date | Mar 23, 2021 |
| Grant date | Mar 23, 2021 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Described herein is an aqueous composition for treating a substrate including patterns having line-space dimensions of 50 nm or below to prevent collapse of the patters, the composition comprising: a solvent system comprising water and a water-miscible organic solvent; a surface modifier that is a reaction product between an alkylamine and an organic acid; and an optional pH adjusting agent.
Opening claim text (preview).
The invention claimed is: 1. An aqueous composition for treating a substrate including patterns having line-space dimensions of 50 nm or below to prevent collapse of the patterns, the composition comprising: a solvent system comprising water and a water-miscible organic solvent; a surface modifier that is a reaction product between an alkylamine and an organic acid; and optional pH adjusting agent; wherein said organic acid is selected from the group consisting of aliphatic carboxylic acids, aromatic carboxylic acids, amino carboxylic acids, sulfonic acids and aminosulfonic acids; the pH of the composition is from about 1 to about 5; wherein the alkylamine is selected from a primary amine or a secondary amine; and the composition is free of corrosion inhibitors. 2. The aqueous composition of claim 1 wherein the solvent system comprises water and dipropylene glycol methyl ether. 3. The aqueous composition of claim 2 wherein the water is present at 70 wt % based on the total weight of the solvent system and the dipropylene glycol methyl ether is present at 30 wt % based on the total weight of the solvent system. 4. The aqueous composition of claim 1 wherein the organic acid is p-toluenesulfonic acid. 5. The aqueous composition of claim 1 wherein the alkylamine is a primary amine. 6. The aqueous composition of claim 1 wherein the alkylamine is a secondary amine. 7. The aqueous composition of claim 1 wherein the organic acid is selected from the group consisting of sulfonic acids and aminosulfonic acids. 8. The aqueous composition of claim 5 wherein the alkylamine is dodecylamine. 9. The aqueous composition of claim 1 wherein the pH adjusting agent comprises excess organic acid. 10. The aqueous composition of claim 8 , wherein said organic acid is selected from the group consisting of sulfonic acids and aminosulfonic acids. 11. A method for treating a substrate including patterns having line-space dimensions of 50 nm or below, the method comprising rinsing the substrate with an aqueous composition comprising: a solvent system comprising water and a water-miscible organic solvent; a surface modifier that is a reaction product between an alkylamine and an organic acid; and optional pH adjusting agent; wherein said organic acid is selected from the group consisting of aliphatic carboxylic acids, aromatic carboxylic acids, amino carboxylic acids, sulfonic acids and aminosulfonic acids; wherein the alkylamine is selected from a primary amine or a secondary amine; the pH of the composition is from about 1 to about 5; and the composition is free of corrosion inhibitors, and further wherein collapse of the patterns is substantially prevented. 12. The method of claim 11 wherein the contacting step occurs at a temperature of from about 25 to 125° C. 13. The method of claim 11 wherein the contacting step occurs at a temperature of from about 25 to 80° C. 14. The method of claim 11 wherein the solvent system comprises water and dipropylene glycol methyl ether. 15. The method of any of claim 11 wherein the water is present at 70 wt % based on the total weight of the solvent system and the dipropylene glycol methyl ether is present at 30 wt % based on the total weight of the solvent system. 16. The method of any of claim 11 wherein the organic acid is p-toluenesulfonic acid. 17. The method of claim 11 wherein the alkylamine is a primary amine. 18. The method of claim 11 wherein the alkylamine is a secondary amine. 19. The method of claim 11 wherein the organic acid is selected from the group consisting of sulfonic acids and aminosulfonic acids. 20. The method of claim 16 wherein the alkylamine is dodecylamine. 21. The method of claim 11 wherein the pH adjusting agent comprises excess organic acid. 22. The method of claim 20 wherein the organic acid is selected from the group consisting of sulfonic acids and aminosulfonic acids. 23. The aqueous composition of claim 1 wherein the alkylamine is selected from methylamine, ethylamine, n-propylamine, isopropylamine, n-butylamine, isobutylamine, s-butylamine, t-butylamine, pentylamine, hexylamine, heptylamine, octylamine, nonylamine, decylamine, undecylamine, dodecylamine, tridecylamine, tetradecylamine, pentadecylamine, hexadecylamine, heptadecylamine, octadecylamine, nonadecylamine, icosylamine, eicosylamine, henicosylamine, heneicosylamine, docosylamine, tricosylamine, tetracosylamine, 1-methylbutylamine, 2-methylbutylamine, cyclopropylmethylamine, cyclohexylmethylamine, benzylamine, 2-methylbenzylamine, 4-methylbenzylamine, 1-phenylethylamine, 2-phenylethylamine, 3-aminomethylpyridine, 1-(4-chlorophenyl)ethylamine, 2-(2-chlorophenyl)ethylamine, 1-(3-methoxyphenyl)ethylamine, 1-(4-methoxyphenyl)ethylamine, 2-(2-methoxyphenyl)ethylamine, 2-(3-methoxyphenyl)ethylamine, 2-(4-methoxyphenyl)ethylamine, 1-[3-(trifluoromethyl)phenyl]ethylamine, 1-(1-naphthyl)ethylamine, 1-(2-naphthyl)ethylamine, 1-phenylpropylamine, and 3-phenylpropylamine, and mixtures thereof. 24. The method of claim 11 wherein the alkylamine is selected from methylamine, ethylamine, n-propylamine, isopropylamine, n-butylamine, isobutylamine, s-butylamine, t-butylamine, pentylamine, hexylamine, heptylamine, octylamine, nonylamine, decylamine, undecylamine, dodecylamine, tridecylamine, tetradecylamine, pentadecylamine, hexadecylamine, heptadecylamine, octadecylamine, nonadecylamine, icosylamine, eicosylamine, henicosylamine, heneicosylamine, docosylamine, tricosylamine, tetracosylamine, 1-methylbutylamine, 2-methylbutylamine, cyclopropylmethylamine, cyclohexylmethylamine, benzylamine, 2-methylbenzylamine, 4-methylbenzylamine, 1-phenylethylamine, 2-phenylethylamine, 3-aminomethylpyridine, 1-(4-chlorophenyl)ethylamine, 2-(2-chlorophenyl)ethylamine, 1-(3-methoxyphenyl)ethylamine, 1-(4-methoxyphenyl)ethylamine, 2-(2-methoxyphenyl)ethylamine, 2-(3-methoxyphenyl)ethylamine, 2-(4-methoxyphenyl)ethylamine, 1-[3-(trifluoromethyl)phenyl]ethylamine, 1-(1-naphthyl)ethylamine, 1-(2-naphthyl)ethylamine, 1-phenylpropylamine, and 3-phenylpropylamine, and mixtures thereof.
Cleaning during device manufacture · CPC title
containing oxygen · CPC title
containing phosphorus, sulfur or silicon, e.g. dimethylsulfoxide · CPC title
Solvents · CPC title
Amines or imines with one to four nitrogen atoms; Quaternized amines · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.