Compositions and methods for preventing collapse of high aspect ratio structures during drying

US10954480B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10954480-B2
Application numberUS-201816141735-A
CountryUS
Kind codeB2
Filing dateSep 25, 2018
Priority dateSep 29, 2017
Publication dateMar 23, 2021
Grant dateMar 23, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Described herein is an aqueous composition for treating a substrate including patterns having line-space dimensions of 50 nm or below to prevent collapse of the patters, the composition comprising: a solvent system comprising water and a water-miscible organic solvent; a surface modifier that is a reaction product between an alkylamine and an organic acid; and an optional pH adjusting agent.

First claim

Opening claim text (preview).

The invention claimed is: 1. An aqueous composition for treating a substrate including patterns having line-space dimensions of 50 nm or below to prevent collapse of the patterns, the composition comprising: a solvent system comprising water and a water-miscible organic solvent; a surface modifier that is a reaction product between an alkylamine and an organic acid; and optional pH adjusting agent; wherein said organic acid is selected from the group consisting of aliphatic carboxylic acids, aromatic carboxylic acids, amino carboxylic acids, sulfonic acids and aminosulfonic acids; the pH of the composition is from about 1 to about 5; wherein the alkylamine is selected from a primary amine or a secondary amine; and the composition is free of corrosion inhibitors. 2. The aqueous composition of claim 1 wherein the solvent system comprises water and dipropylene glycol methyl ether. 3. The aqueous composition of claim 2 wherein the water is present at 70 wt % based on the total weight of the solvent system and the dipropylene glycol methyl ether is present at 30 wt % based on the total weight of the solvent system. 4. The aqueous composition of claim 1 wherein the organic acid is p-toluenesulfonic acid. 5. The aqueous composition of claim 1 wherein the alkylamine is a primary amine. 6. The aqueous composition of claim 1 wherein the alkylamine is a secondary amine. 7. The aqueous composition of claim 1 wherein the organic acid is selected from the group consisting of sulfonic acids and aminosulfonic acids. 8. The aqueous composition of claim 5 wherein the alkylamine is dodecylamine. 9. The aqueous composition of claim 1 wherein the pH adjusting agent comprises excess organic acid. 10. The aqueous composition of claim 8 , wherein said organic acid is selected from the group consisting of sulfonic acids and aminosulfonic acids. 11. A method for treating a substrate including patterns having line-space dimensions of 50 nm or below, the method comprising rinsing the substrate with an aqueous composition comprising: a solvent system comprising water and a water-miscible organic solvent; a surface modifier that is a reaction product between an alkylamine and an organic acid; and optional pH adjusting agent; wherein said organic acid is selected from the group consisting of aliphatic carboxylic acids, aromatic carboxylic acids, amino carboxylic acids, sulfonic acids and aminosulfonic acids; wherein the alkylamine is selected from a primary amine or a secondary amine; the pH of the composition is from about 1 to about 5; and the composition is free of corrosion inhibitors, and further wherein collapse of the patterns is substantially prevented. 12. The method of claim 11 wherein the contacting step occurs at a temperature of from about 25 to 125° C. 13. The method of claim 11 wherein the contacting step occurs at a temperature of from about 25 to 80° C. 14. The method of claim 11 wherein the solvent system comprises water and dipropylene glycol methyl ether. 15. The method of any of claim 11 wherein the water is present at 70 wt % based on the total weight of the solvent system and the dipropylene glycol methyl ether is present at 30 wt % based on the total weight of the solvent system. 16. The method of any of claim 11 wherein the organic acid is p-toluenesulfonic acid. 17. The method of claim 11 wherein the alkylamine is a primary amine. 18. The method of claim 11 wherein the alkylamine is a secondary amine. 19. The method of claim 11 wherein the organic acid is selected from the group consisting of sulfonic acids and aminosulfonic acids. 20. The method of claim 16 wherein the alkylamine is dodecylamine. 21. The method of claim 11 wherein the pH adjusting agent comprises excess organic acid. 22. The method of claim 20 wherein the organic acid is selected from the group consisting of sulfonic acids and aminosulfonic acids. 23. The aqueous composition of claim 1 wherein the alkylamine is selected from methylamine, ethylamine, n-propylamine, isopropylamine, n-butylamine, isobutylamine, s-butylamine, t-butylamine, pentylamine, hexylamine, heptylamine, octylamine, nonylamine, decylamine, undecylamine, dodecylamine, tridecylamine, tetradecylamine, pentadecylamine, hexadecylamine, heptadecylamine, octadecylamine, nonadecylamine, icosylamine, eicosylamine, henicosylamine, heneicosylamine, docosylamine, tricosylamine, tetracosylamine, 1-methylbutylamine, 2-methylbutylamine, cyclopropylmethylamine, cyclohexylmethylamine, benzylamine, 2-methylbenzylamine, 4-methylbenzylamine, 1-phenylethylamine, 2-phenylethylamine, 3-aminomethylpyridine, 1-(4-chlorophenyl)ethylamine, 2-(2-chlorophenyl)ethylamine, 1-(3-methoxyphenyl)ethylamine, 1-(4-methoxyphenyl)ethylamine, 2-(2-methoxyphenyl)ethylamine, 2-(3-methoxyphenyl)ethylamine, 2-(4-methoxyphenyl)ethylamine, 1-[3-(trifluoromethyl)phenyl]ethylamine, 1-(1-naphthyl)ethylamine, 1-(2-naphthyl)ethylamine, 1-phenylpropylamine, and 3-phenylpropylamine, and mixtures thereof. 24. The method of claim 11 wherein the alkylamine is selected from methylamine, ethylamine, n-propylamine, isopropylamine, n-butylamine, isobutylamine, s-butylamine, t-butylamine, pentylamine, hexylamine, heptylamine, octylamine, nonylamine, decylamine, undecylamine, dodecylamine, tridecylamine, tetradecylamine, pentadecylamine, hexadecylamine, heptadecylamine, octadecylamine, nonadecylamine, icosylamine, eicosylamine, henicosylamine, heneicosylamine, docosylamine, tricosylamine, tetracosylamine, 1-methylbutylamine, 2-methylbutylamine, cyclopropylmethylamine, cyclohexylmethylamine, benzylamine, 2-methylbenzylamine, 4-methylbenzylamine, 1-phenylethylamine, 2-phenylethylamine, 3-aminomethylpyridine, 1-(4-chlorophenyl)ethylamine, 2-(2-chlorophenyl)ethylamine, 1-(3-methoxyphenyl)ethylamine, 1-(4-methoxyphenyl)ethylamine, 2-(2-methoxyphenyl)ethylamine, 2-(3-methoxyphenyl)ethylamine, 2-(4-methoxyphenyl)ethylamine, 1-[3-(trifluoromethyl)phenyl]ethylamine, 1-(1-naphthyl)ethylamine, 1-(2-naphthyl)ethylamine, 1-phenylpropylamine, and 3-phenylpropylamine, and mixtures thereof.

Assignees

Inventors

Classifications

  • Cleaning during device manufacture · CPC title

  • containing oxygen · CPC title

  • containing phosphorus, sulfur or silicon, e.g. dimethylsulfoxide · CPC title

  • C11D7/50Primary

    Solvents · CPC title

  • Amines or imines with one to four nitrogen atoms; Quaternized amines · CPC title

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What does patent US10954480B2 cover?
Described herein is an aqueous composition for treating a substrate including patterns having line-space dimensions of 50 nm or below to prevent collapse of the patters, the composition comprising: a solvent system comprising water and a water-miscible organic solvent; a surface modifier that is a reaction product between an alkylamine and an organic acid; and an optional pH adjusting agent.
Who is the assignee on this patent?
Versum Mat Us Llc
What technology area does this patent fall under?
Primary CPC classification C11D7/50. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 23 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).