Photosensitive resin composition

Patent metadata

Field	Value
Publication number	US-10948821-B2
Application number	US-201716084496-A
Country	US
Kind code	B2
Filing date	Mar 24, 2017
Priority date	Mar 28, 2016
Publication date	Mar 16, 2021
Grant date	Mar 16, 2021

Abstract

A photosensitive resin composition includes an alkali-soluble resin (A) containing at least one selected from polyimides and precursors thereof, and polybenzoxazoles and precursors thereof, and a (meth)acryl group-containing compound (B) which constitutes a polyfunctional (meth)acryl group-containing silane condensate (B1) having a weight average molecular weight of 1,000 to 20,000, and having a plurality of structures represented by Formula (1), which is a condensate of compounds having a structure represented by Formula (1) and at least one structure selected from Formula (2-1), Formula (2-2), and Formula (2-3).

First claim

The invention claimed is:

1. A photosensitive resin composition, comprising
an alkali-soluble resin (A) comprising at least one selected from polyimides and precursors thereof, and polybenzoxazoles and precursors thereof, and
a (meth)acryl group-containing compound (B),

wherein the (meth)acryl group-containing compound (B) comprises
a polyfunctional (meth)acryl group-containing silane condensate (B1) having a plurality of structures represented by Formula (1), the silane condensate (B1) being a condensate of compounds having a structure represented by Formula (1) and at least one structure selected from Formula (2-1), Formula (2-2), and Formula (2-3), and
the compound (B1) has a weight average molecular weight of 1,000 to 20,000,

wherein in Formula (1), R 1 is a hydrogen atom or a methyl group, m is an integer in a range of 1≤m≤4, and the symbol * indicates a binding site;

wherein in Formula (2-1), R 2 is a methyl group or an ethyl group, n is an integer in a range of 1≤n≤4, and the symbol * indicates a binding site;

wherein in Formula (2-2), R 2 is a methyl group or an ethyl group, n is an integer in a range of 1≤n≤4, and the symbol * indicates a binding site; and

wherein in Formula (2-3), R 2 is a methyl group or an ethyl group, n is an integer in a range of 1≤n≤4, and the symbol * indicates a binding site.

2. The photosensitive resin composition according to claim 1 , wherein the (meth)acryl group-containing compound (B) further comprises a polyfunctional (meth)acryl group-containing compound (B2) which is at least one selected from compounds represented by Formula (3) and compounds represented by Formula (4):

wherein in Formula (3), R 4 is a hydrogen atom or a methyl group; and

wherein in Formula (4), R 5 is a hydrogen atom or a methyl group.

3. The photosensitive resin composition according to claim 2 , wherein the polyfunctional (meth)acryl group-containing compound (B2) is 50 to 300 parts by mass based on 100 parts by mass of the total amount of the polyfunctional (meth)acryl group-containing silane condensate (B1).

4. The photosensitive resin composition according to claim 1 , wherein the acryl group-containing compound (B) is 20 to 70 parts by mass based on 100 parts by mass of the (A) alkali-soluble resin (A).

5. A resin sheet comprising the photosensitive resin composition of claim 1 .

6. A method of producing an interlayer insulating film or a passivation film, comprising the steps of:
forming a photosensitive resin composition layer or a resin layer on a substrate by a step of coating the photosensitive resin composition of claim 1 on the substrate or a step of laminating a resin sheet formed from the photosensitive resin composition of claim 1 on the substrate;
forming a pattern by irradiation with ultraviolet rays and development; and
forming a layer of a cured relief pattern by heating.

Assignees

• Toray Industries

Inventors

• Kiuchi Yohei
• Shoji Yu
• Isobe Kimio

Classifications

• C09D183/08

  containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen · CPC title

• G03F7/0757

  Macromolecular compounds containing Si-O, Si-C or Si-N bonds (G03F7/0752 takes precedence) · CPC title

• C08G77/20

  containing silicon bound to unsaturated aliphatic groups · CPC title

• C09D183/04

  Polysiloxanes · CPC title

• G03F7/027

  Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds (G03F7/075 takes precedence) · CPC title