Resin composition and use thereof

Patent metadata

Field	Value
Publication number	US-9458279-B2
Application number	US-99372109-A
Country	US
Kind code	B2
Filing date	May 14, 2009
Priority date	Jun 2, 2008
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

An object of the present invention is to provide: a (a) thermosetting resin composition, a photosensitive resin composition, a resin composition solution, a resin film, and an insulating film, each of which (i) is curable at a low temperature (not more than 200° C.), (ii) has excellent flexibility, electrical insulating reliability, solder heat resistance, and resistance to organic solvent, (iii) causes less warpage of a substrate after curing, and (iv) has excellent adhesiveness to a sealing agent; and a (b) printed wiring board provided with the insulating film mentioned above. The object of the present invention is attainable by using a thermosetting resin composition containing at least a (A) urethane imide oligomer having a terminal carboxylic acid group and a (B) thermosetting resin.

First claim

The invention claimed is:

1. A resin composition solution obtained by dissolving, in an organic solvent, a thermosetting resin composition containing at least:
a (A) urethane imide oligomer having a terminal carboxylic acid group; and
a (B) thermosetting resin
wherein:
the (A) urethane imide oligomer having a terminal carboxylic acid group is obtained by:
(i) reacting at least a (a) diol compound and a (b) diisocyanate compound so as to synthesize a terminal isocyanate compound;
(ii) reacting the terminal isocyanate compound with a (c) tetracarboxylic acid dianhydride so as to synthesize a urethane imide oligomer having a terminal acid anhydride; and
(iii) reacting the urethane imide oligomer having a terminal acid anhydride with (d) water,
the (a) diol compound being represented by General Formula (1):
HO R 1 OH   (1)

wherein R represents a divalent organic group; and 1 represents an integer of 1 to 20,
O═C═N—X—N═C═O   (2)

the (b) diisocyanate compound being represented by General Formula (2):
wherein X represents a divalent organic group, and
the (c) tetracarboxylic acid dianhydride being represented by General Formula (3):

wherein Y represents a tetravalent organic group;
wherein the (A) urethane imide oligomer having a terminal carboxylic acid group is a tetracarboxylic acid urethane imide oligomer,
wherein the (a) diol compound contains at least a polycarbonate diol represented by General Formula (4):

wherein each R 1 independently represents a divalent organic group; and m represents an integer of 1 to 20,
wherein the resin composition solution having a solute concentration of 60% by weight or more and 90% by weight or less, and
wherein the resin composition solution has a viscosity of not less than 180 poise and not more than 250 poise at 23° C.

2. The resin composition solution as set forth in claim 1 , wherein the (B) thermosetting resin is contained in the resin composition solution by 1 to 100 parts by weight, relative to 100 parts by weight of the (A) urethane imide oligomer having a terminal carboxylic acid group.

3. A photosensitive resin composition containing at least:
a resin composition solution as set forth in claim 1 ;
a (C) photosensitive resin; and
a (D) photopolymerization initiator.

4. The photosensitive resin composition as set forth in claim 3 , wherein:
the (A) urethane imide oligomer having a terminal carboxylic acid group, the (B) thermosetting resin, the (C) photosensitive resin, and the (D) photopolymerization initiator are contained in the photosensitive resin composition in such an amount ratio that the (C) photosensitive resin and the (D) photopolymerization initiator are contained therein respectively by 10 to 200 parts by weight and by 0.1 to 50 parts by weight, relative to 100 parts by weight of a total solid content of the (A) urethane imide oligomer having a terminal carboxylic acid group and the (B) thermosetting resin.

5. A resin film obtained by applying, to a surface of a base material, a resin composition solution as set forth in claim 3 and then drying the resin composition solution thus applied.

6. An insulating film obtained by curing a resin film as set forth in claim 5 .

7. A printed wiring board provided with an insulating film, wherein:
the insulating film is an insulating film as set forth in claim 6 ; and
the printed wiring board is covered with the insulating film.

8. A resin composition solution obtained by dissolving, in an organic solvent, a photosensitive resin composition as set forth in claim 3 .

9. A resin film obtained by applying, to a surface of a base material, a resin composition solution as set forth in claim 8 and then drying the resin composition solution thus applied.

10. An insulating film obtained by curing a resin film as set forth in claim 9 .

11. A printed wiring board provided with an insulating film, wherein:
the insulating film is an insulating film as set forth in claim 10 ; and
the printed wiring board is covered with the insulating film.

12. The resin composition solution as set forth in claim 1 , wherein the (A) urethane imide oligomer having a terminal carboxylic acid group further has a carboxyl group in its side chain.

Assignees

• Sekito Yoshihide
• Kaneka Corp

Inventors

• Sekito Yoshihide

Classifications

• C08G18/44

  Polycarbonates · CPC title

• C08G18/758 Primary

  containing two or more cycloaliphatic rings · CPC title

• H01B3/40

  epoxy resins · CPC title

• C08G18/348

  Hydroxycarboxylic acids · CPC title

• C08G73/1035

  from tetracarboxylic acids or derivatives and diisocyanates · CPC title