Methods and apparatus for creating a large area imprint without a seam

US10948818B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10948818-B2
Application numberUS-201815924763-A
CountryUS
Kind codeB2
Filing dateMar 19, 2018
Priority dateMar 19, 2018
Publication dateMar 16, 2021
Grant dateMar 16, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments of the present disclosure generally relate to imprint lithography, and more particularly to methods and apparatus for creating a large area imprint without a seam. Methods disclosed herein generally include separating the curing time of the features in a stamp or product from the curing time of the seam and the periphery. The seam and periphery can be cured first or the seam and periphery can be cured last. Additionally, the seam curing operations can be performed on the master, on the stamp, or on the final product.

First claim

Opening claim text (preview).

What is claimed is: 1. An imprint lithography method, comprising: imprinting a stamp material with a plurality of masters adhered to a backing plate to form a stamp, each master having a plurality of features thereon, and each pair of the plurality of masters having a seam therebetween; positioning a mask between an ultraviolet light source and the stamp material; and exposing the stamp material to ultraviolet light from the ultraviolet light source directed through the mask to form cured portions and uncured portions of the stamp material, wherein the cured portions of the stamp material comprise a periphery of the stamp material and the exposing the stamp material to ultraviolet light occurs before the imprinting of the stamp material with the plurality of masters. 2. The method of claim 1 , wherein the cured portions of the stamp material further comprise portions of the stamp material directly underlying the seam between each pair of the plurality of masters when the stamp material is imprinted by the plurality of masters. 3. The method of claim 1 , further comprising: exposing the stamp material having cured and uncured portions to additional ultraviolet light from the ultraviolet light source to cure the uncured portions of the stamp material. 4. The method of claim 3 , wherein the additional ultraviolet light cures all of the uncured portions of the stamp material. 5. The method of claim 1 , further comprising: imprinting a photoresist material on a substrate with the stamp; and removing the stamp from the imprinted photoresist material to form a patterned final product. 6. The method of claim 1 , wherein the periphery of the stamp material is cured by directing ultraviolet light through an outer transparent portion of the mask that extends to an outer edge of the mask.

Assignees

Inventors

Classifications

  • G03F7/0002Primary

    Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

  • characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light · CPC title

  • with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image · CPC title

  • Ceramics · CPC title

  • Plastics, e.g. foam or rubber · CPC title

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What does patent US10948818B2 cover?
Embodiments of the present disclosure generally relate to imprint lithography, and more particularly to methods and apparatus for creating a large area imprint without a seam. Methods disclosed herein generally include separating the curing time of the features in a stamp or product from the curing time of the seam and the periphery. The seam and periphery can be cured first or the seam and per…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification G03F7/0002. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 16 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).