Cassette mold type injection molding machine

Patent metadata

Field	Value
Publication number	US-10946573-B2
Application number	US-201715807575-A
Country	US
Kind code	B2
Filing date	Nov 9, 2017
Priority date	Nov 16, 2016
Publication date	Mar 16, 2021
Grant date	Mar 16, 2021

Abstract

The cassette mold type injection molding machine controls a first temperature control circuit to supply a heat medium having a heating temperature from a first heating device to a matrix supply path, controls a second temperature control circuit to supply the heat medium having a cooling temperature from a second heating device to the core cavity supply path, and performs cassette mold cool down control in which a bypass control valve is controlled to connect a bypass path and a main body supply path, such that a second heating device or a core cavity supply path is connected to a main body supply path, and thus the heat medium having the heating temperature is supplied to the matrix and the heat medium having the cooling temperature is supplied to a cassette mold main body and a core cavity portion.

First claim

What is claimed is:

1. A cassette mold type injection molding machine which comprises a cassette mold and a matrix in which the cassette mold is removably installed, and the cassette mold performing injection molding using a mold having a core cavity portion configured with a core portion and a cavity portion forming a molding space corresponding to a shape of a desired molded article, and a cassette mold main body which is a portion of the cassette mold other than the core portion and the cavity portion, the cassette mold type injection molding machine comprising:
a first temperature control circuit having a first heating device which maintains a heat medium at a heating temperature, a matrix supply path which supplies the heat medium having the heating temperature from the first heating device to the matrix when performing injection molding, and a main body supply path which supplies the heat medium having the heating temperature from the first heating device to the cassette mold main body when performing injection molding,
a second temperature control circuit having a second heating device which maintains the heat medium at a cooling temperature or the heating temperature, and a core cavity supply path which supplies the heat medium from the second heating device to the core cavity portion when performing injection molding,
a bypass circuit having a bypass path which connects the second heating device or the core cavity supply path with the main body supply path, and a bypass control valve which switches connection between the first heating device when performing injection molding and the main body supply path and connection between the bypass path when replacing the cassette mold and the main body supply path, and
a control portion configured to control the first temperature control circuit to supply the heat medium having the heating temperature from the first heating device to the matrix supply path, to control the second temperature control circuit to supply the heat medium having the cooling temperature from the second heating device to the core cavity supply path, and to perform cassette mold cool down control in which the bypass control valve is controlled to connect the bypass path and the main body supply path and thus the heat medium having the cooling temperature is supplied to the cassette mold main body and the core cavity portion to cool the cassette mold main body and the core cavity portion while the heat medium having the heating temperature is supplied to the matrix to maintain the matrix at the heating temperature, when replacing the cassette mold,
wherein the heating temperature is higher than the cooling temperature;
a matrix path for controlling a temperature of the matrix is formed in the matrix,
a main body path for controlling a temperature of the cassette mold main body is formed in the cassette mold main body, and
a core cavity path for controlling a temperature of the core cavity portion is formed in the core cavity portion;
the matrix path is connected to the matrix supply path;
the main body path is connected to the main body supply path; and
the core cavity path is connected to the core cavity supply path.

2. The cassette mold type injection molding machine according to claim 1 , further comprising a purge circuit having a purge path which supplies a compressed gas to the core cavity supply path and the bypass path, and a purge control valve which switches supply of the compressed gas to the core cavity supply path and the bypass path on and off,
wherein the control portion controls the first temperature control circuit to supply the heat medium having the heating temperature from the first heating device to the matrix supply path, controls the purge circuit to supply the compressed gas, instead of the heat medium having the cooling temperature or the heating temperature from the second heating device, to the core cavity supply path and the bypass path, and performs cassette mold purge control in which the bypass control valve is controlled to connect the bypass path and the main body supply path and thus the heat medium having the heating temperature is supplied to the matrix and the compressed gas is supplied to the cassette mold main body and the core cavity portion.

3. The cassette mold type injection molding machine according to claim 2 , further comprising an operation device having a display portion configured to display each operation button corresponding to each operation command comprising a command for performing the cassette mold purge control and a command for performing the cassette mold cool down control and required upon replacement of the cassette mold on one input screen and a touch sensor configured to receive an selection input of each displayed operation button,
wherein the control portion performs control according to the operation command corresponding to the operation button which receives the selection operation by the touch sensor.

Assignees

• Sodick Co Ltd
• Sodickco Ltd

Inventors

• Aiba Shuji
• Takakura Shigeru
• Kitamura Yasuhiro
• Akiyama Kenzo

Classifications

• B29C45/7306 Primary

  Control circuits therefor · CPC title

• B29C45/26

  Moulds · CPC title

• B29C45/1753

  Cleaning or purging, e.g. of the injection unit (B29C45/24 takes precedence) · CPC title

• B29C45/78

  of temperature · CPC title

• B29C45/2673

  with exchangeable mould parts, e.g. cassette moulds (B29C45/1756 takes precedence) · CPC title