Antenna assembly

Patent metadata

Field	Value
Publication number	US-10938092-B2
Application number	US-201916297395-A
Country	US
Kind code	B2
Filing date	Mar 8, 2019
Priority date	Sep 12, 2018
Publication date	Mar 2, 2021
Grant date	Mar 2, 2021

Abstract

A disclosed antenna assembly includes a first flexible circuit having a first signal line, at least one first shielding layer, and a first attachment region. The first attachment region includes a first signal pad and first shielding pads disposed around the first signal pad. The antenna assembly further includes a second flexible circuit having a second signal line, at least one second shielding layer, and a second attachment region. The second attachment region includes a second signal pad and second shielding pads disposed around the second signal pad. The first attachment region is attached to the second attachment region.

First claim

What is claimed is:

1. An antenna assembly comprising:
a first flexible circuit having a first signal line, at least one first shielding layer, and a first attachment region, wherein the first attachment region includes a first signal pad and first shielding pads disposed around the first signal pad; and
a second flexible circuit having a second signal line, at least one second shielding layer, and a second attachment region, the second attachment region including a second signal pad and second shielding pads disposed around the second signal pad,
wherein the first attachment region is attached to the second attachment region.

2. The antenna assembly of claim 1 , wherein:
the first shielding pads comprise a first row of shielding pads and a second row of shielding pads; and
the first signal pad is part of a row of signal pads positioned between the first and second rows of shielding pads.

3. The antenna assembly of claim 2 , wherein the row of signal pads is staggered relative to the first and second rows of shielding pads.

4. The antenna assembly of claim 1 , wherein:
the first signal pad is electrically and mechanically bonded to the second signal pad; and
each of the first shielding pads is electrically and mechanically bonded to one of the second shielding pads.

5. The antenna assembly of claim 1 , wherein:
the first signal pad is connected to the first signal line through the first flexible circuit;
the first shielding pads are connected to the at least one first shielding layer through the first flexible circuit;
the second signal pad is connected to the second signal line through the second flexible circuit; and
the second shielding pads are connected to the at least one second shielding layer through the second flexible circuit.

6. The antenna assembly of claim 1 , further comprising:
a first stiffener attached to the first flexible circuit; and
a second stiffener attached to the second flexible circuit,
wherein the first and second attachment regions are positioned between the first and second stiffeners.

7. The antenna assembly of claim 1 , wherein:
the first attachment region further comprises a first temperature activated adhesive; and
the second attachment region further comprises a second temperature activated adhesive adhered to the first temperature activated adhesive.

8. The antenna assembly of claim 1 , wherein each of the first shielding pads and the second shielding pads are electrically connected to a grounding path of a chassis of an electronic device.

9. The antenna assembly of claim 1 , further comprising surface mount components and clips attached to at least one of the first flexible circuit or the second flexible circuit.

10. A flexible circuit for an antenna, the flexible circuit comprising:
a conductive signal line;
a conductive shielding layer overlapping the conductive signal line;
a dielectric layer between the conductive signal line and the conductive shielding layer;
two rows of conductive shielding pads electrically connected to the conductive shielding layer; and
a row of conductive signal pads electrically connected to the conductive signal line, wherein the row of conductive signal pads is staggered relative to the two rows of conductive shielding pads and the row of conductive signal pads is positioned between the two rows of conductive shielding pads.

11. The flexible circuit of claim 10 , further comprising two temperature activated attachments, wherein the two rows of conductive shielding pads and the row of conductive shielding pads are positioned between the two temperature activated attachments.

12. The flexible circuit of claim 10 , wherein the conductive shielding layer is a first conductive shielding layer and the dielectric layer is a first dielectric layer, wherein the flexible circuit further comprises:
a second conductive shielding layer overlapping the conductive signal line; and
a second dielectric layer between the conductive signal line and the second conductive shielding layer.

13. The flexible circuit of claim 10 , further comprising:
two rows of shielding vias, wherein the conductive signal line is disposed between the two rows of shielding vias.

14. The flexible circuit of claim 10 , wherein the dielectric layer is made from a liquid crystal polymer.

15. The flexible circuit of claim 10 , wherein:
the two rows of conductive shielding pads extend in a first direction and are aligned with each other, such that a position along the first direction of each of the conductive shielding pads in one of the two rows substantially matches a position along the first direction of another conductive shielding pad in the other of the two rows; and
the row of conductive signal pads extends in the first direction and is offset from the two rows of conductive shielding pads in the first direction, such that a position along the first direction of each of the conductive shielding pads does not match a position along the first direction of any of the conductive shielding pads in the two rows of conductive shielding pads.

16. An electronic device comprising:
a chassis having a grounding path;
electronic components mounted to the chassis; and
an antenna assembly mounted to the chassis between two or more of the electronic components, wherein the antenna assembly comprises two flexible circuits attached to each other via a joint, wherein the joint comprises two signal pads bonded to each other and two sets of shielding pads bonded to each other, wherein the two sets of shielding pads are disposed around the two signal pads and are electrically connected to the grounding path of the chassis through at least one of the two flexible circuits.

17. The electronic device of claim 16 , wherein the two signal pads connect two respective signal lines in the two flexible circuits to each other, wherein the two respective signal lines are configured to carry a radiofrequency signal.

18. The electronic device of claim 17 , wherein the two sets of shielding pads connect two respective shielding layers in the two flexible circuits to each other, wherein the two respective shielding layers are configured to shield the radiofrequency signal.

19. The electronic device of claim 16 , wherein the antenna assembly comprises clips attached to the chassis, wherein the clips electrically connect the two sets of shielding pads to the grounding path of the chassis.

20. The electronic device of claim 16 , wherein the two signal pads are staggered relative to the two sets of shielding pads.

Assignees

• Apple Inc

Inventors

• Jin Nanbo
• Monaco Devon A
• Parr Donald J
• Tong Erica J
• Wang Han

Classifications

• H01Q1/243 Primary

  with built-in antennas · CPC title

• H05K2201/0715

  provided by an outer layer of PCB · CPC title

• H05K1/0219

  Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors · CPC title

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H05K1/0298

  Multilayer circuits · CPC title