Optical component, method of manufacturing same, and light emitting device

Patent metadata

Field	Value
Publication number	US-10935194-B2
Application number	US-201916596251-A
Country	US
Kind code	B2
Filing date	Oct 8, 2019
Priority date	Oct 10, 2018
Publication date	Mar 2, 2021
Grant date	Mar 2, 2021

Abstract

A method of manufacturing an optical component includes: providing a base comprising a first projection, wherein the first projection includes: an upper surface, and a plurality of lateral surfaces, wherein the plurality of lateral surfaces includes a first lateral surface including: a first light control region, a first non-light-control region that is continuous with the first light control region, and a second non-light-control region on an upper surface side of the first light control region, and wherein the first light control region is located between the first non-light-control region and the second non-light-control region; forming a lower surface of the optical component by processing a lower surface of the base such that the first non-light-control region in the base remains; and forming an upper surface of the optical component by processing an upper surface of the base to remove the second non-light-control region.

First claim

What is claimed is:

1. A method of manufacturing an optical component, the method comprising:
providing a base comprising a first projection, wherein the first projection comprises:
an upper surface, and
a plurality of lateral surfaces,
wherein the plurality of lateral surfaces includes a first lateral surface comprising:
a first light control region,
a first non-light-control region that is continuous with the first light control region, and
a second non-light-control region on an upper surface side of the first light control region, and

wherein the first light control region is located between the first non-light-control region and the second non-light-control region;

forming a lower surface of the optical component by processing a lower surface of the base such that the first non-light-control region in the base remains; and
before or after forming the lower surface of the optical component, forming an upper surface of the optical component by processing an upper surface of the base to remove the second non-light-control region;
wherein a lateral surface of the optical component manufactured by the method comprises the first light control region and the first non-light-control region.

2. The method according to claim 1 , wherein:
the first lateral surface comprises a second light control region on an upper surface side of the first light control region;
the second non-light-control region is continuous with the second light control region and located on an upper surface side of the second light control region; and
the step of forming the upper surface of the optical component comprises processing the upper surface of the optical component until the second non-light-control region is removed but the second light control region remains.

3. The method according to claim 1 , further comprising:
providing a metal film on the lower surface of the optical component.

4. The method according to claim 1 , wherein:
in the step of providing the base, the base comprises:
an outer peripheral region, and
a component region in which the first projection extends to the outer peripheral region in a direction from a first lateral surface of the base toward a second lateral surface of the base on a side opposite the first lateral surface; and

the method further comprises, after the steps of forming the lower surface and forming the upper surface of the optical component, dividing at least the first projection into a plurality of optical components by forming second lateral surfaces of the optical components.

5. The method according to claim 4 , wherein:
in the step of providing the base, the component region of the base further comprises a second projection that extends to the outer peripheral region from the first lateral surface of the base toward the second lateral surface of the base; and
the step of dividing at least the first projection into the plurality of optical components comprises dividing the first and second projections into a plurality of the optical components such that the base is divided into 10 or more optical components.

6. The method according to claim 5 , wherein:
in the step of providing the base, the component region of the base comprises a connection surface connecting a plurality of adjacent ones of the projections, the connection surface being positioned above the lower surface of the base and under an uppermost surface of the projection; and
the step of forming the lower surface of the optical component includes processing the lower surface of the base to remove the connection surface.

7. The method according to claim 6 , wherein:
the step of forming the lower surface of the optical component comprises processing the base to remove the connection surface while maintaining the component region in a state connected to the outer peripheral region.

8. The method according to claim 1 , further comprising:
forming a reflecting film on the first lateral surface.

9. An optical component comprising:
an upper surface,
a lower surface, and
a plurality of lateral surfaces,
wherein the plurality of lateral surfaces includes a first lateral surface that comprises a light reflecting surface;
wherein the light reflecting surface comprises:
a first light control region, and
a first non-light-control region that is continuous with the first light control region and located between the first light control region and the lower surface; and

wherein the light reflecting surface extends obliquely from the upper surface the optical component.

10. The optical component according to claim 9 , further comprising:
a metal film located on the lower surface;
wherein the upper surface is light transmissive such that the metal film is visible from an upper surface side of the optical component.

11. A light emitting device comprising:
a base member comprising a first upper surface;
a semiconductor laser element disposed on the first upper surface; and
the optical component according to claim 9 , which is disposed on the first upper surface and configured to reflect light from the semiconductor laser element.

12. A light emitting device comprising:
a base member comprising a first upper surface;
a semiconductor laser element disposed on the first upper surface; and
the optical component according to claim 10 , which is disposed on the first upper surface and configured to reflect light from the semiconductor laser element.

Assignees

• Nichia Corp

Inventors

• Kiyota Seiji

Classifications

• H01S5/005

  Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping (H01S5/026, H01S5/18388 take precedence) · CPC title

• F21K9/65 Primary

  specially adapted for changing the characteristics or the distribution of the light, e.g. by adjustment of parts · CPC title

• B29D11/0074 Primary

  Production of other optical elements not provided for in B29D11/00009- B29D11/0073 · CPC title

• H01S5/0087

  for illuminating phosphorescent or fluorescent materials, e.g. using optical arrangements specifically adapted for guiding or shaping laser beams illuminating these materials · CPC title

• H01S5/4056

  emitting light in more than one direction · CPC title