Processing apparatus

US10930558B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10930558-B2
Application numberUS-201916252023-A
CountryUS
Kind codeB2
Filing dateJan 18, 2019
Priority dateJan 22, 2018
Publication dateFeb 23, 2021
Grant dateFeb 23, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A processing apparatus includes: a holding unit that holds a workpiece; a processing mechanism that processes the workpiece held by the holding unit; a processing liquid supplying mechanism that supplies a processing liquid containing an oxidizing agent to at least the workpiece held by the holding unit at the time of processing the workpiece by the processing means; a processing waste liquid recovery section that recovers a processing waste liquid containing the processing liquid supplied from the processing liquid supplying mechanism to the workpiece; a discharge passage through which the processing waste liquid is discharged from the processing waste liquid recovery section to the outside of the processing apparatus; and a waste liquid treatment mechanism that is disposed in the discharge passage and that decomposes the processing liquid contained in the processing waste liquid while the processing waste liquid flows through the discharge passage.

First claim

Opening claim text (preview).

What is claimed is: 1. A processing apparatus comprising: holding means holding a workpiece; processing means processing the workpiece held by the holding means; processing liquid supplying means supplying a processing liquid containing at least an oxidizing agent to the workpiece held by the holding means when processing the workpiece by the processing means; a processing waste liquid recovery section recovering a processing waste liquid containing the processing liquid supplied from the processing liquid supplying means to the workpiece; a discharge passage through which the processing waste liquid is discharged from the processing waste liquid recovery section to an outside of the processing apparatus; and a waste liquid treatment mechanism disposed in the discharge passage and decomposing the processing liquid contained in the processing waste liquid while the processing waste liquid flows through the discharge passage, such that the decomposed processing liquid is passed through the discharge passage to the outside of the processing apparatus, wherein the waste liquid treatment mechanism includes ultraviolet irradiation means configured and arranged for irradiating the processing waste liquid with ultraviolet rays. 2. The processing apparatus according to claim 1 , wherein the oxidizing agent is hydrogen peroxide. 3. The processing apparatus according to claim 2 , wherein the ultraviolet rays irradiated by the ultraviolet ray irradiation means have a wavelength of not more than 300 nm. 4. The processing apparatus according to claim 1 , wherein the ultraviolet rays irradiated by the ultraviolet ray irradiation means have a wavelength of not more than 300 nm. 5. A processing apparatus comprising: holding means holding a workpiece; processing means processing the workpiece held by the holding means; processing liquid supplying means supplying a processing liquid containing at least an oxidizing agent to the workpiece held by the holding means when processing the workpiece by the processing means; a processing waste liquid recovery section recovering a processing waste liquid containing the processing liquid supplied from the processing liquid supplying means to the workpiece; a discharge passage through which the processing waste liquid is discharged from the processing waste liquid recovery section to an outside of the processing apparatus; and a waste liquid treatment mechanism disposed in the discharge passage and decomposing the processing liquid contained in the processing waste liquid while the processing waste liquid flows through the discharge passage such that the decomposed processing liquid is passed through the discharge passage to the outside of the processing apparatus, wherein the waste liquid treatment mechanism includes ultraviolet irradiation means configured and arranged for irradiating the processing waste liquid with ultraviolet rays, and wherein the waste liquid treatment mechanism includes a transparent wall configured and arranged to permit the ultraviolet rays from the ultraviolet ray irradiation means to act upon the processing waste liquid. 6. A processing apparatus comprising: holding means holding a workpiece; processing means processing the workpiece held by the holding means; processing liquid supplying means supplying processing liquid containing at least an oxidizing agent to the workpiece held by the holding means when processing the workpiece by the processing means; a processing waste liquid recovery section recovering a processing waste liquid containing the processing liquid supplied from the processing liquid supplying means to the workpiece; a discharge passage through which the processing waste liquid is discharged from the processing waste liquid recovery section to an outside of the processing apparatus; and a waste liquid treatment mechanism disposed in the discharge passage and decomposing the processing liquid contained in the processing waste liquid while the processing waste liquid flows through the discharge passage, such that the decomposed processing liquid is passed through the discharge passage to the outside of the processing apparatus, wherein the waste liquid treatment mechanism includes ultraviolet irradiation means configured and arranged for irradiating the processing waste liquid with ultraviolet rays, and wherein the waste liquid treatment mechanism includes a transparent drain pipe configured and arranged to permit the ultraviolet rays from the ultraviolet ray irradiation means to act upon the processing waste liquid. 7. A processing apparatus comprising: holding means holding a workpiece; processing means processing the workpiece held by the holding means; processing liquid supplying means supplying a processing liquid containing at least an oxidizing agent to the workpiece held by the holding means when processing the workpiece by the processing means; a processing waste liquid recovery section recovering a processing waste liquid containing the processing liquid supplied from the processing liquid supplying means to the workpiece; a discharge passage through which the processing waste liquid is discharged from the processing waste liquid recovery section to an outside of the processing apparatus; and a waste liquid treatment mechanism disposed in the discharge passage and decomposing the processing liquid contained in the processing waste liquid while the processing waste liquid flows through the discharge passage, such that the decomposed processing liquid is passed through the discharge passage to the outside of the processing apparatus, wherein the waste liquid treatment mechanism includes ultraviolet ray irradiation means irradiating the processing waste liquid with ultraviolet rays at a wavelength of not more than 340 nm.

Assignees

Inventors

Classifications

  • mainly by radiation · CPC title

  • Apparatus for mechanical treatment or grinding or cutting · CPC title

  • H10P54/00Primary

    Cutting or separating of wafers, substrates or parts of devices · CPC title

  • for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title

  • Oxidation by peroxides · CPC title

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Frequently asked questions

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What does patent US10930558B2 cover?
A processing apparatus includes: a holding unit that holds a workpiece; a processing mechanism that processes the workpiece held by the holding unit; a processing liquid supplying mechanism that supplies a processing liquid containing an oxidizing agent to at least the workpiece held by the holding unit at the time of processing the workpiece by the processing means; a processing waste liquid r…
Who is the assignee on this patent?
Disco Corp
What technology area does this patent fall under?
Primary CPC classification H10P72/0436. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 23 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).