Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, mask blank including actinic ray-sensitive or radiation-sensitive film, pattern forming method, and method for manufacturing

Patent metadata

Field	Value
Publication number	US-10928727-B2
Application number	US-201715856064-A
Country	US
Kind code	B2
Filing date	Dec 28, 2017
Priority date	Jun 30, 2015
Publication date	Feb 23, 2021
Grant date	Feb 23, 2021

Abstract

According to the present invention, an actinic ray-sensitive or radiation-sensitive resin composition including a compound (A) whose dissolution rate in an alkali developer decreases by the action of an acid, a hydrophobic resin (B), and a resin (C) having an aromatic ring, as well as a film, a mask blank, a pattern forming method, and a method for manufacturing an electronic device, each using the composition, are provided.

First claim

What is claimed is:

1. An actinic ray-sensitive or radiation-sensitive resin composition comprising:
a compound (A) whose dissolution rate in an alkali developer decreases by the action of an acid;
a resin (B) including a repeating unit having one or more groups selected from the group consisting of a fluorine atom, a group having a fluorine atom, a group having a silicon atom, an alkyl group having 6 or more carbon atoms, and a cycloalkyl group having 5 or more carbon atoms; and
a resin (C) having an aromatic ring, different from the resin (B),
wherein the resin (B) further includes a repeating unit having a group which decomposes by the action of an acid, and
wherein the resin (B) contains at least one of a repeating unit represented by General Formula (A1) or a repeating unit represented by General Formula (A2),
wherein the repeating unit represented by General Formula (A1) is selected from the group consisting of the repeating units shown below:

wherein the repeating unit represented by General Formula (A2) is selected from the group consisting of the repeating units shown below:

2. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 ,
wherein the content of the resin (B) with respect to the total solid content in the actinic ray-sensitive or radiation-sensitive resin composition is 0.01% to 30% by mass.

3. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 ,
wherein the resin (C) is a resin having a repeating unit represented by General Formula (30),

in General Formula (30),
R 31 , R 32 , and R 33 each independently represent a hydrogen atom, an alkyl group, a cycloalkyl group, a halogen atom, a cyano group, or an alkoxycarbonyl group, R 33 may be bonded to Ar 3 to form a ring, and in this case, R 33 represents an alkylene group,
X 3 represents a single bond or a divalent linking group,
Ar 3 represents an (n3+1)-valent aromatic ring group, and in a case where Ar 3 is bonded to R 33 to form a ring, Ar 3 represents an (n3+2)-valent aromatic ring group, and
n3 represents an integer of 1 to 4.

4. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 ,
wherein the compound (A) is a phenol derivative.

5. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 ,
wherein the compound (A) has a structure represented by General Formula (1),

in General Formula (1), R 1 to R 6 each independently represent a hydrogen atom, an organic group having 1 to 50 carbon atoms, or a bonding moiety to a linking group or a single bond represented by L in General Formula (3), provided that at least one of R 2 to R 6 is a structure represented by General Formula (2),
in General Formula (2), R 7 represents a hydrogen atom or an organic group having 1 to 30 carbon atoms, and * represents a bonding moiety in any one of R 2 to R 6 , and
in General Formula (3), L represents a linking group or a single bond, * represents a bonding moiety in any one of R 1 to R 6 , and k represents an integer of 2 to 5.

6. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , further comprising a compound which generates an acid upon irradiation with actinic rays or radiation.

7. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 6 ,
wherein the compound which generates an acid upon irradiation with actinic rays or radiation is a sulfonium salt.

8. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 , further comprising a basic compound whose basicity decreases upon irradiation with actinic rays or radiation, or an ammonium salt compound.

9. An actinic ray-sensitive or radiation-sensitive film formed using the actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 .

10. A mask blank comprising the actinic ray-sensitive or radiation-sensitive film according to claim 9 .

11. A pattern forming method comprising:
a step of applying the actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 onto a substrate to form a film;
a step of exposing the film; and
a step of developing the exposed film to form a negative tone pattern.

12. The pattern forming method according to claim 11 ,
wherein the step of exposing the film is a step of exposing the film using electron beams or extreme ultraviolet rays.

13. A method for manufacturing an electronic device, comprising the pattern forming method according to claim 11 .

Assignees

• Fujifilm Corp

Inventors

• Hirano Shuji

Classifications

• C09D125/18 Primary

  Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen · CPC title

• C08F112/24

  Phenols or alcohols · CPC title

• C08F212/24

  Phenols or alcohols · CPC title

• G03F7/20

  Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title

• G03F7/322

  Aqueous alkaline compositions · CPC title