Coil electronic component

Patent metadata

Field	Value
Publication number	US-10923276-B2
Application number	US-201815970138-A
Country	US
Kind code	B2
Filing date	May 3, 2018
Priority date	Nov 29, 2017
Publication date	Feb 16, 2021
Grant date	Feb 16, 2021

Abstract

A coil electronic component includes a body having a coil portion embedded therein and having a form in which magnetic particles are dispersed in a first insulating material, a first atomic layer deposition (ALD) layer formed along a surface of the coil portion using a second insulating material, a second ALD layer formed along a surface of the first ALD layer using a third insulating material, and external electrodes connected to the coil portion.

First claim

What is claimed is:

1. A coil electronic component comprising:
a body comprising:
magnetic particles dispersed in a first insulating material,
a coil portion embedded in the first insulating material;
a first insulating layer along a surface of the coil portion and formed of a second insulating material;
a second insulating layer along a surface of the first insulating layer and formed of a third insulating material; and
external electrodes connected to the coil portion,
wherein a material of the coil portion has a coefficient of thermal expansion (CTE) greater than that of a material of the first insulating layer, and
the material of the first insulating layer has a CTE greater than that of a material of the second insulating layer.

2. The coil electronic component of claim 1 , wherein the first insulating layer has a thickness of 0.5 μm or less.

3. The coil electronic component of claim 1 , wherein the second insulating layer has a thickness of 0.5 μm or less.

4. The coil electronic component of claim 1 , wherein the first and second insulating layers are formed of the same material.

5. The coil electronic component of claim 1 , wherein the first and second insulating layers are formed of different materials.

6. The coil electronic component of claim 1 , wherein the first insulating layer includes Al 2 O 3 , and the second insulating layer includes SiO 2 .

7. The coil electronic component of claim 6 , wherein the coil portion includes Cu.

8. The coil electronic component of claim 1 , wherein the magnetic particles fill in a gap between adjacent coil patterns in the coil portion.

9. The coil electronic component of claim 1 , wherein only the first insulating layer is formed in a gap between adjacent coil patterns in the coil portion.

10. The coil electronic component of claim 1 , wherein the magnetic particles have conductivity.

11. The coil electronic component of claim 10 , wherein the magnetic particles include an Fe-based alloy.

12. The coil electronic component of claim 1 , wherein the first insulating material is an insulating resin.

13. The coil electronic component of claim 9 , wherein the first insulating layer covers the coil portion.

14. The coil electronic component of claim 1 , wherein each of the first and second insulating layers includes an atomic layer deposition layer.

Assignees

• Samsung Electro Mech

Inventors

• Lee Young Il
• Ryu Han Wool
• Kwon Sang Kyun

Classifications

• H01F41/04

  for manufacturing coils {(coils for transformer or inductances H01F27/28)} · CPC title

• H01F27/292

  Surface mounted devices · CPC title

• H01F17/0013 Primary

  with stacked layers · CPC title

• H01F1/015

  Metals or alloys · CPC title

• H01F41/125

  Other insulating structures; Insulating between coil and core, between different winding sections, around the coil · CPC title