Electronic component and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-2016172102-A1
Application number	US-201514936163-A
Country	US
Kind code	A1
Filing date	Nov 9, 2015
Priority date	Dec 12, 2014
Publication date	Jun 16, 2016
Grant date	—

Abstract

An electronic component includes a magnetic body, and a coil pattern embedded in the magnetic body and including internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and externally exposed from the magnetic body. A thickness of each of the lead parts is formed to be thinner than a thickness of each of the internal coil parts.

First claim

What is claimed is:

1 . An electronic component comprising:
a magnetic body; and a coil pattern embedded in the magnetic body and including internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and externally exposed from the magnetic body, wherein a thickness of each of the lead parts is thinner than a thickness of each of the internal coil parts.

2 . The electronic component of claim 1 , wherein 0.6≦b/a<1 is satisfied, in which a is the thickness of the internal coil part and b is the thickness of the lead part.

3 . The electronic component of claim 1 , wherein a thickness of each of cover regions covering an upper portion and a lower portion of the coil pattern in the magnetic body is 150 μm or less.

4 . The electronic component of claim 1 , wherein the coil pattern is formed by a plating process.

5 . The electronic component of claim 1 , wherein the coil pattern comprises a first coil pattern disposed on one surface of an insulating substrate and a second coil pattern disposed on the other surface of the insulating substrate opposing the one surface of the insulating substrate.

6 . The electronic component of claim 1 , further comprising external electrodes disposed on outer surfaces of the magnetic body and connected to the lead parts.

7 . The electronic component of claim 1 , wherein the magnetic body comprises a magnetic metal powder and a thermosetting resin.

8 . A method of manufacturing an electronic component, the method comprising:
forming coil patterns on an insulating substrate; and providing magnetic sheets on an upper surface and a lower surface of the insulating substrate on which the coil patterns are formed, to form a magnetic body, wherein the coil patterns include internal coil parts having a spiral shape and lead parts connected to ends of the internal coil parts and exposed to surfaces of the magnetic body, and a thickness of each of the lead parts is thinner than a thickness of each of the internal coil parts.

9 . The method of claim 8 , wherein 0.6≦b/a<1 is satisfied, in which a is the thickness of the internal coil part and b is the thickness of the lead part.

10 . The method of claim 8 , wherein in the forming of the coil patterns, a plating process is performed.

11 . The method of claim 8 , further comprising forming external electrodes on outer surfaces of the magnetic body to be connected to the lead parts.

Assignees

• Samsung Electro Mech

Inventors

• Jeong Dong Jin
• Choi Jae Yeol

Classifications

• H01F27/292

  Surface mounted devices · CPC title

• H01F27/28

  Coils; Windings; Conductive connections · CPC title

• H01F27/255 Primary

  made from particles (H01F27/26 takes precedence) · CPC title

• H01F17/00 Primary

  Fixed inductances of the signal type {(coils in general H01F5/00)} · CPC title

• H01F17/04

  with magnetic core · CPC title