Nanoparticle application with adhesives for printable electronics

Patent metadata

Field	Value
Publication number	US-10919281-B2
Application number	US-201715462681-A
Country	US
Kind code	B2
Filing date	Mar 17, 2017
Priority date	Mar 17, 2017
Publication date	Feb 16, 2021
Grant date	Feb 16, 2021

Abstract

A circuit assembly can be made by adhering a conductive element to a substrate with an adhesive. A first layer including an adhesive can be applied over at least a portion of a surface of the substrate. A second layer including a conductive metal can be applied over at least a portion of the first layer. The first layer and the second layer can be exposed to a temperature for a duration of time to (1) fuse the conductive metal together in at least a portion of the first layer and (2) cure the adhesive of the second layer. The fusing can be substantially complete before the curing is substantially complete to enhance bonding of the adhesive to the fused conductive metal.

First claim

What is claimed is:

1. A method of forming a conductive element on a substrate, the method comprising:
applying a first layer comprising a nonconductive adhesive over at least a portion of a surface of a substrate;
applying a second layer comprising nanoparticles of a conductive metal and a curing agent configured to catalyze curing of the nonconductive adhesive, the second layer being applied over the first layer, wherein the second layer does not include an adhesive while being applied; and
exposing the first layer and the second layer to a temperature for a duration of time to (1) fuse the nanoparticles of the conductive metal together in at least a portion of the first layer and (2) cure the nonconductive adhesive of the first layer, wherein the fusing is substantially complete before the curing is substantially complete, and wherein the nonconductive adhesive is curable and the nanoparticles are fusable at a temperature below about 200° C.

2. The method of claim 1 , wherein a thickness of the second layer is greater than a thickness of the first layer.

3. The method of claim 1 , wherein the nonconductive adhesive has an electrical polarity that is greater than an electrical polarity of the nanoparticles of the conductive metal.

4. The method of claim 1 , wherein the exposing comprises infiltrating the first layer with the conductive metal.

5. The method of claim 1 , wherein the exposing comprises infiltrating the second layer with the nonconductive adhesive.

6. The method of claim 1 , further comprising:
after the exposing, applying a third layer comprising an adhesive over at least a portion of a surface of the second layer; and
applying a fourth layer comprising nanoparticles of a conductive metal over at least a portion of the third layer.

7. The method of claim 1 , wherein the exposing comprises applying a laser to achieve the fusing and the curing.

8. A method of forming a conductive element on a substrate, the method comprising:
applying a first layer comprising a nonconductive adhesive over at least a portion of a surface of a substrate;
applying a second layer comprising nanoparticles of a conductive metal and a curing agent configured to catalyze curing of the adhesive, the second layer being applied over the first layer, wherein the second layer does not include an adhesive while being applied; and
exposing the first layer and the second layer to a temperature for a duration of time to (1) fuse the nanoparticles of the conductive metal together in at least a portion of the first layer and (2) cure the adhesive of the first layer, wherein the fusing is substantially complete before the curing is substantially complete;
wherein the nanoparticles of the second layer penetrate the adhesive of the first layer within an interface having a depth not exceeding 3 nm.

Assignees

• Lockheed Corp

Inventors

• Stoltenberg Randall Mark
• Zinn Alfred A

Classifications

• H05K2203/1366

  Spraying coating · CPC title

• H05K1/097

  Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title

• H05K3/386

  by the use of an organic polymeric bonding layer, e.g. adhesive · CPC title

• H05K1/0393

  Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups) · CPC title

• H05K3/1208

  Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns (providing shape patterns H05K3/1258; adhesion treatments H05K3/38) · CPC title