Adhesive resin layer, adhesive resin film, laminate, and method of producing laminate

Patent metadata

Field	Value
Publication number	US-10919276-B2
Application number	US-201615540098-A
Country	US
Kind code	B2
Filing date	Jan 27, 2016
Priority date	Jan 30, 2015
Publication date	Feb 16, 2021
Grant date	Feb 16, 2021

Abstract

The present invention provides an adhesive resin layer, which can prevent generation of air bubbles even when adhered to a substrate having a high level difference, and can maintain transparency, an adhesive resin film, a laminate, and a method of producing a laminate. More specifically, the present invention is a monolayered adhesive resin layer comprising an acrylic-based adhesive resin composition having transparency, wherein the adhesive resin composition contains an acrylic-based polymer, an acrylic-based monomer, and a thermopolymerization initiator, and an adhesive resin layer has pressure sensitive adhesiveness on both surfaces at an ambient temperature, and can be thermally cured by heating at a temperature of 100 to 250° C. and a time of 30 seconds to 10 minutes.

First claim

What is claimed is:

1. A monolayered adhesive resin layer comprising an acrylic-based adhesive resin composition having transparency, wherein
said adhesive resin composition consists essentially of (A) an acrylic-based polymer, (B) an acrylic-based monomer, and (C) a thermopolymerization initiator, wherein
said (B) acrylic-based monomer is a monomer of (meth)acrylate having a hydroxyl group which is at least one selected from the group consisting of 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctane (meth)acrylate, and cyclohexanedimethanol mon(meth)acrylate,
said adhesive resin composition contains 4 to 10 parts by weight of said (B) acrylic-based monomer based on 100 parts by weight of said (A) acrylic-based polymer, and
said adhesive resin layer has pressure sensitive adhesiveness on both surfaces at an ambient temperature, and can be thermally cured by heating at a temperature of 100 to 250° C. and a time of 30 seconds to 10 minutes.

2. The monolayered adhesive resin layer according to claim 1 , wherein said thermopolymerization initiator is a peroxide.

3. The monolayered adhesive resin layer according to claim 1 , wherein a storage elastic modulus at a temperature of 23° C. after thermal curing by heating is higher than a storage elastic modulus at a temperature of 23° C. before said heating, a storage elastic modulus at a temperature of 23° C. before heating is 1×10 4 to 1×10 6 Pa, and a storage elastic modulus at a temperature of 23° C. after thermal curing by said heating is 1×10 4 to 1×10 9 Pa.

4. An adhesive resin film comprising the monolayered adhesive resin layer according to claim 1 laminated between two separators.

5. A laminate comprising two substrates laminated with the monolayered adhesive resin layer according to claim 1 interposed between the two substrates.

6. The laminate according to claim 5 , wherein at least one substrate of said two substrates comprises one or more level differences of 5 μm to 1 mm in a surface on a side contacting with said adhesive resin layer.

7. The laminate according to claim 6 , wherein said level difference is 50 μm to 1 mm.

8. A method of producing a laminate, comprising:
laminating two substrates with the monolayered adhesive resin layer according to claim 1 interposed between the two substrates; and
thermally curing said adhesive resin layer in a state where the resulting laminate is held between two dies.

9. The method of producing a laminate according to claim 8 , wherein when a boiling point of a solvent contained in a raw material composition of said adhesive resin layer is expressed as “Temperature A”, a temperature at which said thermopolymerization initiator has a half-life of 1 minute is expressed as “Temperature B”, a temperature at heating for removing said solvent in the step of producing said adhesive resin layer is expressed as “Temperature C”, and a pressing temperature of a die in the step of thermally curing said adhesive resin layer is expressed as “Temperature D”, each temperature is in an order of an equation (1) below:
Temperature A<Temperature C<Temperature B<Temperature D.   Equation (1)

10. The method of producing a laminate according to claim 8 , wherein at least one substrate of said two substrates comprises one or more level differences of 5 μm to 1 mm in a surface on a side contacting with said adhesive resin layer.

11. The method of producing a laminate according to claim 10 , wherein said level difference is 50 μm to 1 mm.

12. The method of producing a laminate according to claim 8 , wherein a temperature of the die upon said thermal curing is a temperature of 150 to 300° C.

Assignees

• Fujimori Kogyo Co Ltd

Inventors

• Fujita Shiro
• Suzuki Atsushi
• Niimi Hiroto

Classifications

• B32B37/06

  characterised by the heating method · CPC title

• B32B7/12

  using interposed adhesives or interposed materials with bonding properties · CPC title

• B32B2309/02

  Temperature · CPC title

• B32B27/308 Primary

  comprising acrylic (co)polymers · CPC title

• C09J2433/00

  Presence of (meth)acrylic polymer · CPC title